公开(公告)号：US5412866A

公开(公告)日：1995-05-09

申请号：US88962

申请日：1993-07-01

申请人： Blake F. Woith ,  John Pasiecznik, Jr. ,  William R. Crumly ,  Robert K. Betz

发明人： Blake F. Woith ,  John Pasiecznik, Jr. ,  William R. Crumly ,  Robert K. Betz

IPC分类号： G01R1/073 ,  H01K3/22

CPC分类号： G01R1/0735 ,  Y10T29/49158

摘要： A flexible membrane (12) of an integrated circuit chip test probe is provided with raised contact features (14) on one side arranged in the pattern of contact pads of the chip to be tested. During manufacture, the membrane, in the area of its raised contact features, is specifically shaped by applying a vacuum to the outside of the membrane and casting a solid resilient elastomer (26) in place on the other side of the membrane to act as a shape retaining solid backup and to provide an anti-drape (226) shaped membrane (212) or to ensure planarity (326) of the ends of the membrane contact features (314). The vacuum may be used to pull the membrane and its contacts against a shape defining mandrel (60,260,360) while the elastomer is cast into place.

摘要翻译： 集成电路芯片测试探针的柔性膜（12）在被测芯片的接触焊盘的图案的一侧上设有凸起的接触特征（14）。 在制造过程中，膜在其凸起接触特征的区域中通过向膜的外部施加真空并将固体弹性弹性体（26）浇铸在膜的另一侧上的位置而特别地成形为充当 形状保持固体支撑并且提供防悬垂（226）形状的膜（212）或确保膜接触特征（314）的端部的平坦度（326）。 当将弹性体浇铸到位时，可以使用真空将膜及其接触件压靠在限定心轴（60,260,360）的形状上。

公开(公告)号：US07504839B2

公开(公告)日：2009-03-17

申请号：US10956318

申请日：2004-10-01

申请人： Haim Feigenbaum ,  Bao Q. Le ,  Long T. Hoang ,  Robert K. Betz

发明人： Haim Feigenbaum ,  Bao Q. Le ,  Long T. Hoang ,  Robert K. Betz

IPC分类号： G01R31/26

CPC分类号： H05K3/4092 ,  G01R1/06711 ,  G01R1/07342 ,  G01R3/00 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/205 ,  H05K2201/0391

摘要： A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second material is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.

摘要翻译： 柔性电路包括多个电迹线和直接形成于其上的多个探针尖。 电迹线由第一导电材料制成，并且探针尖端由比第一导电材料硬的第二导电材料制成。 第一种材料是铜或铜合金，第二种材料是镍或镍合金，其中第二种材料可镀金。 探针尖端的部分被暴露以便于与另一个电路的接触垫的电接触。 柔性电路还可以包括接地层，以便在较高频率下与另一电路进行电校正。

公开(公告)号：US5600256A

公开(公告)日：1997-02-04

申请号：US387674

申请日：1995-02-13

申请人： Blake F. Woith ,  John Pasiecznik, Jr. ,  William R. Crumly ,  Robert K. Betz

发明人： Blake F. Woith ,  John Pasiecznik, Jr. ,  William R. Crumly ,  Robert K. Betz

IPC分类号： G01R1/073 ,  G01R31/02

CPC分类号： G01R1/0735 ,  Y10T29/49158

摘要： A flexible membrane (12) of an integrated circuit chip test probe is provided with raised contact features (14) on one side arranged in the pattern of contact pads of the chip to be tested. During manufacture, the membrane, in the area of its raised contact features, is specifically shaped by applying a vacuum to the outside of the membrane and casting a solid resilient elastomer (26) in place on the other side of the membrane to act as a shape retaining solid backup and to provide an anti-drape (226) shaped membrane (212) or to ensure planarity (326) of the ends of the membrane contact features (314). The vacuum may be used to pull the membrane and its contacts against a shape defining mandrel (60, 260, 360) while the elastomer is cast into place.

摘要翻译： 集成电路芯片测试探针的柔性膜（12）在被测芯片的接触焊盘的图案的一侧上设有凸起的接触特征（14）。 在制造过程中，膜在其凸起接触特征的区域中通过向膜的外部施加真空并将固体弹性弹性体（26）浇铸在膜的另一侧上的位置而特别地成形为充当 形状保持固体支撑并且提供防悬垂（226）形状的膜（212）或确保膜接触特征（314）的端部的平坦度（326）。 当将弹性体浇铸到位时，可以使用真空将膜及其接触件压靠在限定心轴（60,260,360）的形状上。

公开(公告)号：US5304922A

公开(公告)日：1994-04-19

申请号：US904740

申请日：1992-06-26

申请人： Robert K. Betz ,  Blake F. Woith

发明人： Robert K. Betz ,  Blake F. Woith

IPC分类号： G01R1/073 ,  H01H1/14 ,  H01L21/66 ,  H05K1/11 ,  H05K3/32

CPC分类号： G01R1/0735

摘要： A multi-layered flexible circuit comprises a plurality of electrical traces (52) formed on a rigid substrate (50) and each including a contact pad (56) from which is raised a projecting contact feature (58). The contact pads (56) and features (58) extend along a line or lines of such contact pads and connection features, and both the contact pads and the raised features carried thereby are supported at or above the plane of the circuit traces by a compressed molded elastomeric gasket (44) positioned adjacent and edge (66) of the rigid substrate that underlies the traces. The gasket directly underlies the line of contact pads and raised features and is incorporated during the lamination of the several layers.

摘要翻译： 多层柔性电路包括形成在刚性基板（50）上的多个电迹线（52），每个电迹线包括接触焊盘（56），凸起突出接触特征（58）。 接触焊盘（56）和特征（58）沿着这样的接触焊盘和连接特征的线或线延伸，并且由此承载的接触焊盘和凸起特征两者都被支撑在电路迹线的平面上或上方，通过压缩 位于轨迹下方的刚性基底的邻近边缘（66）处的模制弹性垫圈（44）。 垫片直接位于接触焊盘和凸起特征之下，并且在层压多层期间结合。