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公开(公告)号：US09635845B1
公开(公告)日：2017-05-02
申请号：US14749931
申请日：2015-06-25
申请人： Travis Swisher , Robert Swisher
发明人： Travis Swisher , Robert Swisher
IPC分类号： A47F7/00 , A01K97/01 , A47B3/00 , A47B37/00 , A01K97/10 , A01K97/22 , A47B43/00 , A47F5/10 , A47B81/00 , A47F5/00 , A47B47/02 , A47B96/02
CPC分类号： A01K97/01 , A01K97/10 , A01K97/22 , A47B43/00 , A47B47/022 , A47B81/005 , A47B96/027 , A47F5/0018 , A47F5/10 , A47F5/103 , A47F7/0028
摘要： An ice fishing accessory support apparatus for supporting fishing accessories may comprise a base portion for resting upon a surface, and an upright portion mounted on the base portion. The upright portion may be movable with respect to the base portion between collapsed and deployed positions. The collapsed position may be characterized by the upright portion oriented substantially parallel to the base portion and the deployed position being characterized by the upright portion oriented substantially perpendicular to the base portion. At least one shelf portion may be mounted on the upright portion, and may be movable between a lowered position and a raised position. The raised position may be characterized by the shelf portion oriented substantially perpendicular to the upright portion and the lowered position being characterized by the shelf portion oriented substantially parallel to the upright portion.
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公开(公告)号：US20070015448A1
公开(公告)日：2007-01-18
申请号：US11428475
申请日：2006-07-03
申请人： Robert Swisher , Alan Wang
发明人： Robert Swisher , Alan Wang
IPC分类号： B24D11/00
CPC分类号： B24B37/22
摘要： A polishing pad has a sublayer and a polishing layer, wherein the surface of the outer peripheral edge of the sublayer can be at least partially treated to reduce the absorption or permeation of polishing fluid into the sublayer through the outer peripheral edge. The application of the surface treatment at least reduces the amount of polishing fluid absorbed by the sublayer of the polishing pad during the polishing process. The polishing pad of the present invention is useful in polishing microelectronic substrates and especially useful in chemical mechanical planarization of semiconductor wafers.
摘要翻译： 抛光垫具有子层和抛光层，其中可以至少部分地处理子层的外周边缘的表面，以减少抛光流体通过外周边缘进入子层的吸收或渗透。 在抛光过程中，表面处理的应用至少减少抛光垫子层吸收的抛光液的量。 本发明的抛光垫可用于抛光微电子衬底，并且特别适用于半导体晶片的化学机械平面化。
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公开(公告)号：US08435631B2
公开(公告)日：2013-05-07
申请号：US12761020
申请日：2010-04-15
CPC分类号： C08J9/0066 , A61L9/042 , A61L9/12 , B01D39/00 , B01D39/1676 , B01D2239/0471 , C08J5/18 , C08J9/28 , C08J9/365 , C08J2201/0502 , C08J2205/044 , C08J2429/00 , Y10T428/24942 , Y10T428/249921 , Y10T428/249978 , Y10T428/24998 , Y10T428/249986 , Y10T428/249991 , Y10T428/249992
摘要： Microporous materials that include thermoplastic organic polyolefin polymer (e.g., ultrahigh molecular weight polyolefin, such as polyethylene), particulate filler (e.g., precipitated silica), and a network of interconnecting pores, are described. The microporous materials of the present invention possess controlled volatile material transfer properties. The microporous materials can have a density of at least 0.8 g/cm3; and a volatile material transfer rate, from the volatile material contact surface to the vapor release surface of the microporous material, of from 0.04 to 0.6 mg/(hour*cm2). In addition, when volatile material is transferred from the volatile material contact surface to the vapor release surface, the vapor release surface is substantially free of volatile material in liquid form.
摘要翻译： 描述了包括热塑性有机聚烯烃聚合物（例如超高分子量聚烯烃，例如聚乙烯），颗粒填料（例如沉淀二氧化硅）和互连孔网络的微孔材料。 本发明的微孔材料具有控制的挥发性物质转移性能。 微孔材料可以具有至少0.8g / cm 3的密度; 以及从微孔材料的挥发性物质接触表面到蒸汽释放表面的挥发性物质转移速率为0.04至0.6mg /（小时* cm2）。 此外，当挥发性物质从挥发性物质接触表面转移到蒸汽释放表面时，蒸汽释放表面基本上不含液体形式的挥发性物质。
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公开(公告)号：US20110256364A1
公开(公告)日：2011-10-20
申请号：US12761020
申请日：2010-04-15
CPC分类号： C08J9/0066 , A61L9/042 , A61L9/12 , B01D39/00 , B01D39/1676 , B01D2239/0471 , C08J5/18 , C08J9/28 , C08J9/365 , C08J2201/0502 , C08J2205/044 , C08J2429/00 , Y10T428/24942 , Y10T428/249921 , Y10T428/249978 , Y10T428/24998 , Y10T428/249986 , Y10T428/249991 , Y10T428/249992
摘要： Microporous materials that include thermoplastic organic polyolefin polymer (e.g., ultrahigh molecular weight polyolefin, such as polyethylene), particulate filler (e.g., precipitated silica), and a network of interconnecting pores, are described. The microporous materials of the present invention possess controlled volatile material transfer properties. The microporous materials can have a density of at least 0.8 g/cm3; and a volatile material transfer rate, from the volatile material contact surface to the vapor release surface of the microporous material, of from 0.04 to 0.6 mg/(hour*cm2). In addition, when volatile material is transferred from the volatile material contact surface to the vapor release surface, the vapor release surface is substantially free of volatile material in liquid form.
摘要翻译： 描述了包括热塑性有机聚烯烃聚合物（例如超高分子量聚烯烃，例如聚乙烯），颗粒填料（例如沉淀二氧化硅）和互连孔网络的微孔材料。 本发明的微孔材料具有控制的挥发性物质转移性能。 微孔材料可以具有至少0.8g / cm 3的密度; 以及从微孔材料的挥发性物质接触表面到蒸汽释放表面的挥发性物质转移速率为0.04至0.6mg /（小时* cm2）。 此外，当挥发性物质从挥发性物质接触表面转移到蒸汽释放表面时，蒸汽释放表面基本上不含液体形式的挥发性物质。
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公开(公告)号：US20060089093A1
公开(公告)日：2006-04-27
申请号：US10974529
申请日：2004-10-27
申请人： Robert Swisher , Alan Wang , William Allison
发明人： Robert Swisher , Alan Wang , William Allison
CPC分类号： B24B37/24 , B24D3/32 , C08G18/10 , C08G18/3808 , C08G18/5024 , C08L23/10 , C08L75/02 , C08G18/6685 , C08G18/792 , C08L2666/04
摘要： The present invention relates to an article for altering a surface of a workpiece, or a polishing pad. In particular, the polishing pad includes a polyurethane urea material wherein at least a portion of the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers.
摘要翻译： 本发明涉及一种用于改变工件表面或抛光垫的制品。 特别地，抛光垫包括聚氨酯脲材料，其中至少一部分聚氨酯脲材料含有至少部分填充有气体的电池。 聚氨酯脲材料可以通过将多异氰酸酯和/或聚氨酯预聚物，含羟基材料，含胺材料和发泡剂组合来制备。 根据本发明的抛光垫可用于抛光制品，并且特别适用于微电子和光电子器件的化学机械抛光或平面化，例如但不限于半导体晶片。
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公开(公告)号：US09949564B1
公开(公告)日：2018-04-24
申请号：US15473780
申请日：2017-03-30
申请人： Travis Swisher , Robert Swisher
发明人： Travis Swisher , Robert Swisher
IPC分类号： A47F7/00 , A01K97/01 , A47B3/00 , A47B37/00 , A01K97/10 , A01K97/22 , A47B43/00 , A47F5/10 , A47B81/00 , A47F5/00 , A47B46/00 , F16M11/20 , A47B57/04 , A47B96/02
CPC分类号： A01K97/22 , A01K97/01 , A01K97/10 , F16M11/2042 , F16M2200/08
摘要： An ice fishing accessory support apparatus for supporting fishing accessories may comprise a base portion for resting upon a surface, and an upright portion mounted on the base portion. The upright portion may be movable with respect to the base portion between collapsed and deployed positions. The collapsed position may be characterized by the upright portion oriented substantially parallel to the base portion and the deployed position being characterized by the upright portion oriented substantially perpendicular to the base portion. At least one shelf portion may be mounted on the upright portion, and may be movable between a lowered position and a raised position. The raised position may be characterized by the shelf portion oriented substantially perpendicular to the upright portion and the lowered position being characterized by the shelf portion oriented substantially parallel to the upright portion.
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公开(公告)号：US20120231242A1
公开(公告)日：2012-09-13
申请号：US13473001
申请日：2012-05-16
CPC分类号： C08J9/0066 , A61L9/042 , A61L9/12 , B01D39/00 , B01D39/1676 , B01D2239/0471 , C08J5/18 , C08J9/28 , C08J9/365 , C08J2201/0502 , C08J2205/044 , C08J2429/00 , Y10T428/24942 , Y10T428/249921 , Y10T428/249978 , Y10T428/24998 , Y10T428/249986 , Y10T428/249991 , Y10T428/249992
摘要： Microporous materials that include thermoplastic organic polyolefin polymer (e.g., ultrahigh molecular weight polyolefin, such as polyethylene), particulate filler (e.g., precipitated silica), and a network of interconnecting pores, are described. The microporous materials of the present invention possess controlled volatile material transfer properties. The microporous materials can have a density of at least 0.8 g/cm3; and a volatile material transfer rate, from the volatile material contact surface to the vapor release surface of the microporous material, of from 0.04 to 0.6 mg/(hour*cm2). In addition, when volatile material is transferred from the volatile material contact surface to the vapor release surface, the vapor release surface is substantially free of volatile material in liquid form.
摘要翻译： 描述了包括热塑性有机聚烯烃聚合物（例如超高分子量聚烯烃，例如聚乙烯），颗粒填料（例如沉淀二氧化硅）和互连孔网络的微孔材料。 本发明的微孔材料具有控制的挥发性物质转移性能。 微孔材料可以具有至少0.8g / cm 3的密度; 以及从微孔材料的挥发性物质接触表面到蒸汽释放表面的挥发性物质转移速率为0.04至0.6mg /（小时* cm2）。 此外，当挥发性物质从挥发性物质接触表面转移到蒸汽释放表面时，蒸汽释放表面基本上不含液体形式的挥发性物质。
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公开(公告)号：US20060254706A1
公开(公告)日：2006-11-16
申请号：US11489331
申请日：2006-07-19
申请人： Robert Swisher , Alan Wang , William Allison
发明人： Robert Swisher , Alan Wang , William Allison
IPC分类号： B29C44/04
CPC分类号： B24B37/205 , Y10T156/1057
摘要： The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.
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公开(公告)号：US20060089095A1
公开(公告)日：2006-04-27
申请号：US10974528
申请日：2004-10-27
申请人： Robert Swisher , Alan Wang , William Allison
发明人： Robert Swisher , Alan Wang , William Allison
IPC分类号： B24D11/00
CPC分类号： B24B37/205 , Y10T156/1057
摘要： The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.
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公开(公告)号：US20060089094A1
公开(公告)日：2006-04-27
申请号：US10974517
申请日：2004-10-27
申请人： Robert Swisher , Alan Wang , William Allison
发明人： Robert Swisher , Alan Wang , William Allison
IPC分类号： B24D11/00
CPC分类号： B24B37/205 , B24D3/32 , B32B3/18 , B32B5/18 , B32B5/20 , B32B27/065 , B32B27/36 , B32B2264/102 , B32B2266/0278 , B32B2266/08 , B32B2307/412 , B32B2307/554 , B32B2432/00 , B32B2457/14 , B32B2475/00
摘要： The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.
摘要翻译： 本发明涉及用于改变工件表面的制品或具有窗口的抛光垫。 特别地，抛光垫包括聚氨酯脲材料，其中聚氨酯脲材料含有至少部分填充有气体的电池。 聚氨酯脲材料可以通过混合多异氰酸酯和/或聚氨酯预聚物，含羟基的材料，含胺材料和发泡剂来制备。 根据本发明的抛光垫可用于抛光制品，并且特别适用于微电子和光电子器件的化学机械抛光或平面化，例如但不限于半导体晶片。 抛光垫的窗口至少部分是透明的，因此，可以特别有用于抛光或平面化具有通过压板晶片计量的工具。
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