Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure
    1.
    发明授权
    Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure 有权
    用于制造用于非易失性存储器单元矩阵的字节选择晶体管和相应结构的工艺

    公开(公告)号:US07456467B2

    公开(公告)日:2008-11-25

    申请号:US11258675

    申请日:2005-10-25

    IPC分类号: H01L29/788 H01L21/336

    摘要: A process for manufacturing a matrix of non volatile memory cells includes forming a floating gate transistor and a cell selection transistor in a first active area, and a byte selection transistor in a second active area. A multilayer structure is deposited, comprising a gate oxide layer, a first polysilicon layer, a dielectric layer, and a second polysilicon layer. The multilayer structure is defined to form two bands, the first band defining gate regions of the byte selection transistor and the cell selection transistor, and the second band defining the gate region of the floating gate transistor. A portion of the first band extends over a portion of insulating layer adjacent to the byte selection transistor. An opening is formed in the portion of the first band, exposing the first polysilicon layer, and a conductive layer is formed in the opening, electrically coupling the first polysilicon layer with the second polysilicon layer.

    摘要翻译: 一种用于制造非易失性存储单元的矩阵的工艺包括在第一有源区中形成浮栅晶体管和单元选择晶体管,以及在第二有源区中形成字节选择晶体管。 沉积多层结构,包括栅极氧化物层,第一多晶硅层,电介质层和第二多晶硅层。 多层结构被定义为形成两个带,第一带限定了字节选择晶体管和单元选择晶体管的栅极区,而第二条限定了浮栅晶体管的栅极区。 第一带的一部分在与字节选择晶体管相邻的绝缘层的一部分上延伸。 在第一带的部分形成开口,露出第一多晶硅层,并且在开口中形成导电层,将第一多晶硅层与第二多晶硅层电耦合。

    Manufacturing process for a high voltage transistor integrated on a semiconductor substrate with non-volatile memory cells and corresponding transistor
    2.
    发明授权
    Manufacturing process for a high voltage transistor integrated on a semiconductor substrate with non-volatile memory cells and corresponding transistor 失效
    集成在具有非易失性存储单元和相应晶体管的半导体衬底上的高压晶体管的制造工艺

    公开(公告)号:US06949803B2

    公开(公告)日:2005-09-27

    申请号:US10675245

    申请日:2003-09-29

    摘要: A process for fabricating high-voltage drain-extension transistors, whereby the transistors are integrated in a semiconductor substrate along with non-volatile memory cells that include floating gate transistors. The process includes: defining respective active areas for HV transistors and floating gate transistors in a semiconductor substrate, with the active areas separated from each other by insulating regions; forming insulated gate regions of the HV transistors; performing a first dopant implantation to form first portions of the HV transistor junctions; conformably depositing a dielectric layer onto the whole substrate to provide an interpoly layer of the floating gate transistor; making openings at the first portions of the HV transistor junctions; performing, through the openings, a second dopant implantation to form second portions of the high-voltage transistor junctions, with perimeter areas of the gate regions and the active area of the floating gate transistor being screened off by the dielectric layer.

    摘要翻译: 一种用于制造高压漏极延伸晶体管的工艺,其中晶体管与包括浮动栅极晶体管的非易失性存储器单元一体地集成在半导体衬底中。 该方法包括:为半导体衬底中的HV晶体管和浮置栅极晶体管定义相应的有源区,其中有源区通过绝缘区彼此分离; 形成HV晶体管的绝缘栅极区域; 执行第一掺杂剂注入以形成HV晶体管结的第一部分; 在整个衬底上顺应地沉积介电层,以提供浮置晶体管的互补层; 在HV晶体管接头的第一部分处形成开口; 通过开口执行第二掺杂剂注入以形成高压晶体管结的第二部分,栅极区域的周边区域和浮置栅极晶体管的有源区域被电介质层屏蔽。

    Reading voltage generator for a non-volatile EEPROM memory cell matrix of a semiconductor device and corresponding manufacturing process
    3.
    发明授权
    Reading voltage generator for a non-volatile EEPROM memory cell matrix of a semiconductor device and corresponding manufacturing process 有权
    读取电压发生器用于半导体器件的非易失性EEPROM存储单元阵列和相应的制造工艺

    公开(公告)号:US07663927B2

    公开(公告)日:2010-02-16

    申请号:US11941650

    申请日:2007-11-16

    IPC分类号: G11C16/06

    摘要: A reference voltage generator for a matrix of non-volatile memory cells of the EEPROM type, comprises at least one array enabled by an access transistor. The array comprises at least one reference cell associated with a relative select transistor, the transistors and the cell being realized on a semiconductor substrate and having active regions delimited by suitable field oxide regions and covered by a tunnel oxide layer and comprising at least one floating gate realized by a first polysilicon layer and covered by a dielectric layer and by a second polysilicon layer. Advantageously, the floating gate of the reference cells is contacted by a first contact terminal connected to a discharge transistor for the periodical discharge of possibly present charges. A process manufactures such a voltage generator.

    摘要翻译: 用于EEPROM类型的非易失性存储器单元的矩阵的参考电压发生器包括由存取晶体管使能的至少一个阵列。 该阵列包括与相对选择晶体管相关联的至少一个参考单元,晶体管和单元被实现在半导体衬底上,并且具有由合适的场氧化物区域限定并被隧道氧化物层覆盖并且包括至少一个浮置栅极 由第一多晶硅层实现并被介电层和第二多晶硅层覆盖。 有利地,参考单元的浮置栅极与连接到放电晶体管的第一接触端子接触,用于可能存在的电荷的周期性放电。 一个工艺制造这样的电压发生器。

    Non-volatile memory architecture and method, in particular of the EEPROM type
    4.
    发明申请
    Non-volatile memory architecture and method, in particular of the EEPROM type 有权
    非易失性存储器架构和方法,特别是EEPROM类型

    公开(公告)号:US20070247919A1

    公开(公告)日:2007-10-25

    申请号:US11701165

    申请日:2007-01-31

    IPC分类号: G11C16/06

    CPC分类号: G11C16/0433

    摘要: A memory architecture includes at least one matrix of memory cells of the EEPROM type organized in rows or word lines and columns or bit lines. Each memory cell includes a floating gate cell transistor and a selection transistor and is connected to a source line shared by the matrix. The memory cells are organized in words, all the memory cells belonging to a same word being driven by a byte switch, which is, in turn, connected to at least one control gate line. The memory cells further have accessible substrate terminals connected to a first additional line.

    摘要翻译: 存储器架构包括以行或字线和列或位线组织的EEPROM类型的至少一个存储器单元矩阵。 每个存储单元包括浮栅单元晶体管和选择晶体管,并连接到由矩阵共享的源极线。 存储器单元以字为单位,属于相同字的所有存储单元由字节开关驱动,该字节开关依次连接至至少一个控制栅极线。 存储单元还具有连接到第一附加线路的可访问基板端子。

    Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure
    5.
    发明申请
    Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure 有权
    用于制造用于非易失性存储器单元矩阵的字节选择晶体管和相应结构的工艺

    公开(公告)号:US20060043461A1

    公开(公告)日:2006-03-02

    申请号:US11258675

    申请日:2005-10-25

    IPC分类号: H01L29/788 H01L29/76

    摘要: A process for manufacturing a byte selection transistor for a matrix of non volatile memory cells organised in rows and columns integrated on a semiconductor substrate, each memory cell comprising a floating gate transistor and a selection transistor, the process providing the following steps: defining on a same semiconductor substrate respective active areas for the byte selection transistor, for the floating gate transistor and for the selection transistor split by portions of insulating layer; depositing a multilayer structure comprising at least a gate oxide layer, a first polysilicon layer, a dielectric layer on the whole substrate and a second polysilicon layer, characterised in that it comprises the following steps: removing through a traditional photolithographic technique the multilayer structure to form at least a couple of two bands developing substantially in a parallel way to the columns of the matrix of memory cells, the first band being effective to define the gate regions of the byte selection transistor and of the selection transistor, the second band being effective to define the gate region of the floating gate transistor, a portion of the first band further extending on the portion of insulating layer which is adjacent to the byte selection transistor, forming an opening in the portion up to expose the first polysilicon layer, forming a conductive layer in the opening to put said first polysilicon layer in electric contact with said second polysilicon layer.

    摘要翻译: 一种用于制造用于集成在半导体衬底上的行和列组织的非易失性存储器单元的矩阵的字节选择晶体管的处理,每个存储单元包括浮置栅晶体管和选择晶体管,该过程提供以下步骤: 相同的半导体衬底用于字节选择晶体管的相应有效区域,用于浮置栅极晶体管和用于分离绝缘层的选择晶体管; 沉积包括至少栅极氧化物层,第一多晶硅层,整个衬底上的电介质层和第二多晶硅层的多层结构,其特征在于其包括以下步骤:通过传统的光刻技术去除形成的多层结构 至少两个条带基本上以并行方式发展到存储器单元矩阵的列,第一条带有效地限定字节选择晶体管和选择晶体管的栅极区域,第二条带有效地 限定浮栅晶体管的栅极区,第一带的一部分在绝缘层的与字节选择晶体管相邻的部分上进一步延伸,在该部分中形成开口以暴露第一多晶硅层,形成导电 以使所述第一多晶硅层与所述第二多晶硅层电接触。

    READING VOLTAGE GENERATOR FOR A NON-VOLATILE EEPROM MEMORY CELL MATRIX OF A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS
    6.
    发明申请
    READING VOLTAGE GENERATOR FOR A NON-VOLATILE EEPROM MEMORY CELL MATRIX OF A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS 有权
    读取电压发生器用于半导体器件的非易失性EEPROM存储单元矩阵和相应的制造工艺

    公开(公告)号:US20080123404A1

    公开(公告)日:2008-05-29

    申请号:US11941650

    申请日:2007-11-16

    IPC分类号: G11C16/28 H01L21/8247

    摘要: A reference voltage generator for a matrix of non-volatile memory cells of the EEPROM type, comprises at least one array enabled by an access transistor. The array comprises at least one reference cell associated with a relative select transistor, the transistors and the cell being realized on a semiconductor substrate and having active regions delimited by suitable field oxide regions and covered by a tunnel oxide layer and comprising at least one floating gate realized by a first polysilicon layer and covered by a dielectric layer and by a second polysilicon layer. Advantageously, the floating gate of the reference cells is contacted by a first contact terminal connected to a discharge transistor for the periodical discharge of possibly present charges. A process manufactures such a voltage generator.

    摘要翻译: 用于EEPROM类型的非易失性存储器单元的矩阵的参考电压发生器包括由存取晶体管使能的至少一个阵列。 该阵列包括与相对选择晶体管相关联的至少一个参考单元,晶体管和单元被实现在半导体衬底上,并且具有由合适的场氧化物区域限定并被隧道氧化物层覆盖并且包括至少一个浮置栅极 由第一多晶硅层实现并被介电层和第二多晶硅层覆盖。 有利地,参考单元的浮置栅极与连接到放电晶体管的第一接触端子接触,用于可能存在的电荷的周期性放电。 一个工艺制造这样的电压发生器。

    Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure
    7.
    发明授权
    Process for manufacturing a byte selection transistor for a matrix of non volatile memory cells and corresponding structure 失效
    用于制造用于非易失性存储器单元矩阵的字节选择晶体管和相应结构的工艺

    公开(公告)号:US06972454B2

    公开(公告)日:2005-12-06

    申请号:US10715887

    申请日:2003-11-18

    摘要: In a matrix of non volatile memory cells integrated on a semiconductor substrate, each memory cell includes a floating gate transistor and a selection transistor formed in a first active area, while each byte includes a byte selection transistor formed in a second active area separated from the first by portions of insulating layer. A portion of a multilayer structure including a gate oxide layer, a first polysilicon layer, a dielectric layer, and a second polysilicon layer extends over the byte selection and selection transistors, forming the gate regions thereof, and further extending on a portion of insulating layer. A conductive layer is formed in an opening in the second polysilicon and dielectric layers, over the portion of insulating layer, putting the first polysilicon layer in electric contact with the second polysilicon layer. Another portion of the multiplayer structure comprises the gate region of the floating gate transistor.

    摘要翻译: 在集成在半导体衬底上的非易失性存储单元的矩阵中,每个存储单元包括浮置晶体管和形成在第一有源区中的选择晶体管,而每个字节包括形成在与第一有源区分离的第二有源区中的字节选择晶体管 首先是绝缘层的一部分。 包括栅极氧化物层,第一多晶硅层,电介质层和第二多晶硅层的多层结构的一部分在字节选择和选择晶体管上延伸,形成其栅极区域,并且还在绝缘层的一部分上延伸 。 在第二多晶硅和电介质层的开口中,在绝缘层的部分上形成导电层,使第一多晶硅层与第二多晶硅层电接触。 多人结构的另一部分包括浮置栅极晶体管的栅极区域。

    ESD protection network for circuit structures formed in a semiconductor
    8.
    发明授权
    ESD protection network for circuit structures formed in a semiconductor 有权
    用于在半导体中形成的电路结构的ESD保护网络

    公开(公告)号:US06266222B1

    公开(公告)日:2001-07-24

    申请号:US09223621

    申请日:1998-12-30

    IPC分类号: H02H904

    CPC分类号: H01L27/0259 H01L27/0251

    摘要: An ESD protection network protects a CMOS circuit structure integrated in a semiconductor substrate. The circuit structure includes discrete circuit blocks formed in respective substrate portions which are electrically isolated from one another and independently powered from at least one primary voltage supply having a respective primary ground, and from at least one secondary voltage supply having a respective secondary ground. This network includes a first ESD protection element for an input stage of the circuit structure; a second ESD protection element for an output stage of the circuit structure, the first and second protection elements having an input/output pad of the integrated circuit structure in common; a first ESD protection element between the primary supply and the primary ground; and a second ESD protection element between the secondary supply and the secondary ground.

    摘要翻译: ESD保护网络保护集成在半导体衬底中的CMOS电路结构。 电路结构包括形成在相应的衬底部分中的分立电路块,它们彼此电绝缘并且由至少一个具有各自的初级接地的初级电压源以及至少一个具有相应次级接地的次级电压源独立供电。 该网络包括用于电路结构的输入级的第一ESD保护元件; 用于所述电路结构的输出级的第二ESD保护元件,所述第一和第二保护元件具有所述集成电路结构的输入/输出焊盘; 主要供电和主地面之间的第一个ESD保护元件; 以及在次级电源和次级接地之间的第二ESD保护元件。