公开(公告)号：US06977555B2

公开(公告)日：2005-12-20

申请号：US10706086

申请日：2003-11-13

申请人： Sadao Kotera ,  Hiroshi Taniguchi

发明人： Sadao Kotera ,  Hiroshi Taniguchi

IPC分类号： H04B1/16 ,  H03F3/191 ,  H03G1/00 ,  H03G3/30 ,  H04B1/18

CPC分类号： H03G3/3052 ,  H03F3/191 ,  H03F2200/372 ,  H03G1/0058

摘要： A tuner circuit includes a variable attenuator circuit including a PIN diode, disposed upstream of a variable-gain amplifier circuit and controlled according to the same AGC voltage used to control the variable-gain amplifier circuit. The operations of the variable-gain amplifier circuit and the variable attenuator circuit in relation to the AGC voltage are set such that when an input RF signal is at a maximum assumed level, a direct current that flows through the PIN diode will be less than a value of a direct current that maximizes intermodulation distortion.

摘要翻译： 调谐器电路包括可变衰减器电路，该可变衰减器电路设置在可变增益放大器电路的上游并根据用于控制可变增益放大器电路的相同AGC电压进行控制的PIN二极管。 可变增益放大器电路和可变衰减器电路相对于AGC电压的操作被设置为使得当输入RF信号处于最大假设电平时，流过PIN二极管的直流电流将小于 使互调失真最大化的直流电流值。

公开(公告)号：US5581875A

公开(公告)日：1996-12-10

申请号：US389485

申请日：1995-02-16

申请人： Eiichi Hibino ,  Yoji Maeda ,  Sadao Kotera ,  Kazunori Kinoshita

发明人： Eiichi Hibino ,  Yoji Maeda ,  Sadao Kotera ,  Kazunori Kinoshita

IPC分类号： B23P21/00 ,  H05K3/34 ,  H05K9/00 ,  H05K13/04 ,  H05K7/14

CPC分类号： H05K3/3415 ,  H05K3/3405 ,  H05K9/0039 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/1572 ,  H05K3/3447 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49153

摘要： An electronic component is mounted on one major surface of a dual side wiring substrate. A terminal is press-fitted into a mounting hole in the dual side wiring substrate from the one major surface side to be temporarily fixed in the substrate, and an electronic component is mounted on the other major surface of the dual side wiring substrate after soldering paste is applied. A frame having a plurality of bent pieces extending inwardly is mounted onto the dual face wiring substrate from a position above the substrate so that the bent pieces abut against the pattern of the dual side wiring substrate. The terminal press-fitted from the one major surface side, the electronic component mounted on the other major surface, and the frame are soldered simultaneously by a reflow method.

摘要翻译： 电子部件安装在双面布线基板的一个主表面上。 将端子从一个主表面侧压配合到双面布线基板的安装孔中，以临时固定在基板中，并且在焊膏之后将电子部件安装在双面布线基板的另一个主表面上 被申请;被应用。 具有向内延伸的多个弯曲片的框架从基板上方的位置安装到双面布线基板上，使得弯曲的片抵靠双面布线基板的图案。 从一个主表面压入的端子，安装在另一个主表面上的电子部件和框架通过回流方式同时焊接。