摘要:
An array substrate comprises a base substrate on which data lines and gate lines intersecting with each other are formed to define pixel units, and a switching element is provided in each of the pixel units and comprises a gate electrode, an active layer, a source electrode and a drain electrode, and end parts of the source electrode and the drain electrode located directly on the active layer are opposite to each other to define a channel region. An extension conductive part is formed close to the source electrode or the drain electrode and to electrically contact the source electrode or the drain electrode, one end of the extension conductive part extends toward the channel to protrude from the source electrode or the drain electrode contacting with the extension conductive part and to contact the active layer at least within the channel region.
摘要:
Embodiments of the invention provide a color filter substrate, a TFT array substrate, a manufacturing method of the color filter substrate, a manufacturing method of the TFT array substrate, and a liquid crystal display (LCD) panel. The color filter substrate comprises color filter substrate units of different sizes. The manufacturing method of the color filter substrate comprises: coating a common electrode layer on a base substrate for forming the color filter substrate; and forming common electrodes of different thicknesses for the color filter substrate units of different sizes by a patterning process.
摘要:
There is provided a fluid dynamic bearing assembly including: a sleeve having a shaft insertedly mounted therein; and upper and lower radial bearing parts formed on at least one of an outer circumferential surface of the shaft and an inner circumferential surface of the sleeve, wherein a clearance between the lower radial bearing part and a surface disposed to face the lower radial bearing part is wider than a clearance between the upper radial bearing part and a surface disposed to face the upper radial bearing part.
摘要:
A secondary battery including: an electrode assembly; a case containing the electrode assembly; a cap plate covering an opening of the case; a safety device on the cap plate and including a first lead; and an electrode terminal electrically connecting the electrode assembly and the first lead, the cap plate including a conductive member and an insulating portion, and the first lead is supported on the insulating portion, and the conductive member and the insulating portion being integrally formed.
摘要:
Disclosed is a method for recovering carbon dioxide from exhaust gas, more particularly, a method for recovering carbon dioxide from exhaust gas for saving the cost for recovery of carbon dioxide by decreasing energy required for recycling a carbon dioxide absorbent solution. In particular, a circulating solvent, whose heat of vaporization and/or sensible heat is lower than that of a solvent of an absorbent solution introduced to a recycling tower, is supplied to the lower portion of the recycling tower and mixed with the heated absorbent solution. As a result, the pressure inside the recycling tower is maintained so that carbon dioxide released from the absorbent solution is discharged to a storage tank/drum.
摘要:
Disclosed herein is a spindle motor including a rotating part including a rotating shaft, a hub, and a magnet and a fixing part including a sleeve supporting the rotating shaft and an armature opposite to the magnet, wherein a working fluid is injected between the rotating shaft and the sleeve so as to form a fluid dynamic bearing part, and the sleeve is as a sintered sleeve by sintering and a top and a bottom of an inner peripheral surface of the sleeve is protruded toward the rotating shaft, whereby the spindle motor improving dynamic pumping capability and extending a span of a radial bearing part to a top end and a bottom end of the sleeve as compared with the spindle motor according to the prior art can be provided.
摘要:
A method of forming a vertical diode and a method of manufacturing a semiconductor device (e.g., a semiconductor memory device such as a phase-change memory device) includes forming an insulating structure having an opening on a substrate and filling the opening with an amorphous silicon layer. A metal silicide layer is formed to contact at least a portion of the amorphous silicon layer and a polysilicon layer is then formed in the opening by crystallizing the amorphous silicon layer using the metal silicide layer. A doped polysilicon layer is formed by implanting impurities into the polysilicon layer. Thus, the polysilicon layer is formed in the opening without performing a selective epitaxial growth (SEG) process, so that electrical characteristics of the diode may be improved.