公开(公告)号：US07538436B2

公开(公告)日：2009-05-26

申请号：US10527993

申请日：2003-09-29

申请人： Satish Gunturi ,  Daniel Schneider

发明人： Satish Gunturi ,  Daniel Schneider

IPC分类号： H01L23/48

CPC分类号： H01L24/72 ,  H01L23/051 ,  H01L23/4924 ,  H01L24/29 ,  H01L25/072 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3011 ,  H01L2924/00

摘要： The high-power pack semiconductor module (1) comprises a layer (3, 4), which is brought into direct contact with one or both of the main electrodes of the Si semiconductor chip, (2), said layer being made of a metal matrix composite material whose coefficient of thermal expansion can be tailored to a value either close or matching that of Si.

摘要翻译： 高功率封装半导体模块（1）包括与Si半导体芯片（2）的一个或两个主电极直接接触的层（3,4），所述层由金属制成 基体复合材料，其热膨胀系数可以被定制成与Si接近或匹配的值。

公开(公告)号：US20080283579A1

公开(公告)日：2008-11-20

申请号：US12149410

申请日：2008-05-01

申请人： Satish Gunturi ,  Raymond Zehringer ,  Wolfgang Knapp

发明人： Satish Gunturi ,  Raymond Zehringer ,  Wolfgang Knapp

IPC分类号： B23K31/02

CPC分类号： H01L24/80 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/7511 ,  H01L2224/75251 ,  H01L2224/75315 ,  H01L2224/83209 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/00 ,  H01L2924/3512

摘要： A first electronic component, e.g., a semiconductor die and a second electronic component, e.g., a substrate, each with a main surface, are bonded to each other by applying at least one metal layer comprising an indium layer on each of the main surfaces. Then the semiconductor die and the substrate are aligned against each other with their main surfaces facing each other. The die and substrate with the metal layers in between form an arrangement, which is introduced into a compression means. Afterwards the arrangement is compressed in the compression means at a pressure in a range of 10 to 35 MPa, and heat in a range of 230 to 275° C. is applied to the arrangement, by which temperature and pressure the electronic components are bonded to each other. The compression process is performable in oxygeneous gas atmosphere inside the compression means.

摘要翻译： 通过在每个主表面上施加包含铟层的至少一个金属层，将第一电子部件（例如半导体管芯）和第二电子部件（例如，各自具有主表面的基板）彼此接合。 然后半导体管芯和衬底彼此对准，其主表面彼此相对。 在其间具有金属层的管芯和衬底形成被引入到压缩装置中的布置。 之后，在10〜35MPa的压力下，在压缩机构中压缩该配置，在该结构中施加230〜275℃的范围内的热量，将电子部件的温度和压力结合到 彼此。 压缩过程在压缩装置内的氧气气氛中是可执行的。

公开(公告)号：US20060118816A1

公开(公告)日：2006-06-08

申请号：US10527993

申请日：2003-09-29

申请人： Satish Gunturi ,  Daniel Schneider

发明人： Satish Gunturi ,  Daniel Schneider

IPC分类号： H01L29/73

CPC分类号： H01L24/72 ,  H01L23/051 ,  H01L23/4924 ,  H01L24/29 ,  H01L25/072 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3011 ,  H01L2924/00

摘要： The high-power pack semiconductor module (1) comprises a layer (3, 4), which is brought into direct contact with one or both of the main electrodes of the Si semiconductor chip, (2), said layer being made of a metal matrix composite material whose coefficient of thermal expansion can be tailored to a value either close or matching that of Si.

摘要翻译： 高功率封装半导体模块（1）包括与Si半导体芯片（2）的一个或两个主电极直接接触的层（3,4），所述层由金属制成 基体复合材料，其热膨胀系数可以被定制成与Si接近或匹配的值。

公开(公告)号：US20080202257A1

公开(公告)日：2008-08-28

申请号：US11984301

申请日：2007-11-15

申请人： Satish Gunturi ,  Frank Kassubek ,  Jorg Gebhardt ,  Lothar Deppe ,  Matthias Dettmer ,  Rene Friedrichs ,  Robert Huber ,  Steffen Keller

发明人： Satish Gunturi ,  Frank Kassubek ,  Jorg Gebhardt ,  Lothar Deppe ,  Matthias Dettmer ,  Rene Friedrichs ,  Robert Huber ,  Steffen Keller

IPC分类号： G01F1/84

CPC分类号： G01F1/849 ,  G01F1/8413 ,  G01F1/8418

摘要： The disclosure relates to a Coriolis mass flowmeter with an oscillatable straight measuring tube consisting of a corrosion-resistant metal, in particular of titanium or a titanium alloy, to which are attached mounted parts connected directly to the measuring tube for the implementation of the Coriolis measurement principle. Furthermore, stabilizing elements running parallel to the measuring tube are coupled to the measuring tube via mounted parts connected directly to the measuring tube, the mounted parts and the stabilizing elements consisting of a metal other than that of the measuring tube. The stabilizing elements are manufactured from a second material which possesses a coefficient of thermal expansion adapted to the metal of the measuring tube. The mounted parts connected directly to the measuring tube are manufactured from a third material which possesses a higher coefficient of thermal expansion than the metal of the measuring tube.

摘要翻译： 本公开涉及一种科里奥利质量流量计，其具有由耐腐蚀金属，特别是钛或钛合金组成的可振荡直测量管，附接的安装部件直接连接到测量管，用于实施科里奥利测量 原理。 此外，平行于测量管行进的稳定元件通过直接连接到测量管，安装部件和稳定元件的测量管连接到测量管以外的金属。 稳定元件由具有适合于测量管的金属的热膨胀系数的第二材料制成。 与测量管直接连接的安装部件由具有比测量管的金属更高的热膨胀系数的第三材料制造。

公开(公告)号：US07874220B2

公开(公告)日：2011-01-25

申请号：US11984301

申请日：2007-11-15

申请人： Satish Gunturi ,  Frank Kassubek ,  Jörg Gebhardt ,  Lothar Deppe ,  Matthias Dettmer ,  René Friedrichs ,  Robert Huber ,  Steffen Keller

发明人： Satish Gunturi ,  Frank Kassubek ,  Jörg Gebhardt ,  Lothar Deppe ,  Matthias Dettmer ,  René Friedrichs ,  Robert Huber ,  Steffen Keller

IPC分类号： G01F1/84

CPC分类号： G01F1/849 ,  G01F1/8413 ,  G01F1/8418

摘要： The disclosure relates to a Coriolis mass flowmeter with an oscillatable straight measuring tube consisting of a corrosion-resistant metal, in particular of titanium or a titanium alloy, to which are attached mounted parts connected directly to the measuring tube for the implementation of the Coriolis measurement principle. Furthermore, stabilizing elements running parallel to the measuring tube are coupled to the measuring tube via mounted parts connected directly to the measuring tube, the mounted parts and the stabilizing elements consisting of a metal other than that of the measuring tube. The stabilizing elements are manufactured from a second material which possesses a coefficient of thermal expansion adapted to the metal of the measuring tube. The mounted parts connected directly to the measuring tube are manufactured from a third material which possesses a higher coefficient of thermal expansion than the metal of the measuring tube.

摘要翻译： 本公开涉及一种科里奥利质量流量计，其具有由耐腐蚀金属，特别是钛或钛合金组成的可振荡直测量管，附接的安装部件直接连接到测量管，用于实施科里奥利测量 原理。 此外，平行于测量管行进的稳定元件通过直接连接到测量管，安装部件和稳定元件的测量管连接到测量管以外的金属。 稳定元件由具有适合于测量管的金属的热膨胀系数的第二材料制成。 与测量管直接连接的安装部件由具有比测量管的金属更高的热膨胀系数的第三材料制造。