Formation of openings in dielectric sheet
    1.
    发明授权
    Formation of openings in dielectric sheet 失效
    电介质片中开口的形成

    公开(公告)号:US4023999A

    公开(公告)日:1977-05-17

    申请号:US522959

    申请日:1974-11-11

    摘要: There is disclosed a method for producing in thick (0.005 inches) polyimide films or sheets, openings, or windows across each of which an electrical conductor, such as copper or aluminum extends. The windows may be of substantial dimensions typically 0.05 inches by 0.1 inches. The conductor is of substantial thickness of about 0.0008 to 0.001 inches. The method is practiced with a sheet in which holes have been preformed. The sheet is coated with the conductor on both surfaces by being rotated in a stream of vapor of the conductor produced by impinging an electron beam (typically at 10 KV and 300 milliamperes) on a block of the conducting material. As the sheet is rotated in the stream of vapor, the walls of the holes as well as the surface of the sheet are coated with a conductor. Photoresist is then deposited on both coated surfaces of the sheet and in the holes and is exposed under masks and developed so as to expose the conducting coating on each surface in the areas of the windows. The exposed coating is then removed with an acid etchant while the remainder of the surfaces including the coating on the walls of the holes remain protected by the developed photoresist. The polyimide in the areas of the windows is thus exposed. The exposed polyimide is then removed by hydrazine leaving windows in each surface with conductors extending across the windows on the respective opposite surfaces.

    摘要翻译: 公开了一种用于生产厚(0.005英寸)聚酰亚胺膜或片,开口或窗口的方法,其中每个电导体如铜或铝延伸。 窗口可以具有通常为0.05英寸×0.1英寸的实质尺寸。 导体的厚度约为0.0008至0.001英寸。 该方法用已经进行了孔的片材实施。 通过在导电材料的块上撞击电子束(通常为10KV和300毫安)而产生的导体的蒸汽流中旋转,在两个表面上涂覆导体。 当片材在蒸汽流中旋转时,孔的壁以及片材的表面涂覆有导体。 然后将光致抗蚀剂沉积在片材的两个涂覆表面和孔中,并在掩模下暴露并显影,以暴露窗户区域中每个表面上的导电涂层。 然后用酸蚀刻剂除去暴露的涂层,而包括在孔壁上的涂层的其余表面保持被显影的光致抗蚀剂保护。 因此,在窗户的区域中的聚酰亚胺被暴露。 然后通过肼除去暴露的聚酰亚胺,在每个表面中留下窗口,导体延伸穿过相应相对表面上的窗口。

    Formation of openings in dielectric sheet
    2.
    发明授权
    Formation of openings in dielectric sheet 失效
    电介质片中开口的形成

    公开(公告)号:US3971661A

    公开(公告)日:1976-07-27

    申请号:US523946

    申请日:1974-11-14

    摘要: There is disclosed a method for producing in thick (0.005 inches) polyimide films or sheets, openings, or windows across each of which an electrical conductor, such as copper or aluminum extends. The windows may be of substantial dimensions typically 0.05 inches by 0.1 inches. The conductor is of substantial thickness of about 0.0008 to 0.001 inches. The sheet is coated with the conductor on both surfaces by being rotated in a stream of vapor of the conductor produced by impinging an electron beam (typically at 10 KV and 300 milliamperes) on a block of the conducting material. Photoresist is then deposited on both coated surfaces of the sheet and exposed under masks and developed so as to expose the conducting coating on each surface in the areas of the windows. The exposed coating is then removed with an acid etchant while the remainder of the surfaces remain protected by the developed photoresist. The polyimide in the areas of the windows is thus exposed. The exposed polyimide is then removed by hydrazine leaving windows in each surface with conductors extending across the windows on the respective opposite surfaces.

    摘要翻译: 公开了一种用于生产厚(0.005英寸)聚酰亚胺膜或片,开口或窗口的方法,其中每个电导体如铜或铝延伸。 窗口可以具有通常为0.05英寸×0.1英寸的实质尺寸。 导体的厚度约为0.0008至0.001英寸。 通过在导电材料的块上撞击电子束(通常为10KV和300毫安)而产生的导体的蒸汽流中旋转,在两个表面上涂覆导体。 然后将光致抗蚀剂沉积在片材的两个涂覆表面上,并在掩模下暴露并显影,以暴露窗户区域中每个表面上的导电涂层。 然后用酸蚀刻剂除去暴露的涂层,而剩余的表面保持被显影的光致抗蚀剂保护。 因此,在窗户的区域中的聚酰亚胺被暴露。 然后通过肼除去暴露的聚酰亚胺,在每个表面中留下窗口,导体延伸穿过相应相对表面上的窗口。