公开(公告)号：US20110020975A1

公开(公告)日：2011-01-27

申请号：US12784961

申请日：2010-05-21

申请人： Chan Shin Wu ,  Yung-Yi Tu ,  Shan Hua Wu

发明人： Chan Shin Wu ,  Yung-Yi Tu ,  Shan Hua Wu

IPC分类号： H01L31/18

CPC分类号： H01L31/035281 ,  H01L31/022425 ,  H01L31/0725 ,  H01L31/0735 ,  Y02E10/544

摘要： A method of manufacturing photodiode device includes the following steps: providing a wafer having a substrate and an epitaxy layer, the substrate having a first surface and a second surface and the epitaxy layer formed on the first surface; forming a first conductive layer on the second surface of the substrate; forming a patterned conductive layer above the epitaxy layer; and etching the patterned conductive layer by a reactive ion etching (RIE) process performed under argon gas and helium gas.

摘要翻译： 制造光电二极管器件的方法包括以下步骤：提供具有衬底和外延层的晶片，所述衬底具有第一表面和第二表面，所述外延层形成在所述第一表面上; 在所述基板的第二表面上形成第一导电层; 在外延层上形成图案化的导电层; 并通过在氩气和氦气下进行的反应离子蚀刻（RIE）工艺蚀刻图案化的导电层。

公开(公告)号：US20060199393A1

公开(公告)日：2006-09-07

申请号：US11383931

申请日：2006-05-17

申请人： Yuan-Bang Lee ,  Tzu-Yang Wu ,  Sheng-Liang Pan ,  U. Lin ,  Yu-Chih Lai ,  De-Fang Chen ,  Pei-Hsuan Lin ,  Shan-Hua Wu ,  Hung-Hsin Liu

发明人： Yuan-Bang Lee ,  Tzu-Yang Wu ,  Sheng-Liang Pan ,  U. Lin ,  Yu-Chih Lai ,  De-Fang Chen ,  Pei-Hsuan Lin ,  Shan-Hua Wu ,  Hung-Hsin Liu

IPC分类号： H01L21/302

CPC分类号： H01L21/31138 ,  G03F7/427 ,  H01L21/67069

摘要： An in-situ performed method utilizing a pure H2O plasma to remove a layer of resist from a substrate or wafer without substantially accumulating charges thereon. Also, in-situ performed methods utilizing a pure H2O plasma or a pure H2O vapor to release or remove charges from a surface or surfaces of a substrate or wafer that have accumulated during one or more IC fabrication processes.

摘要翻译： 使用纯H 2 O 2等离子体的原位执行方法从衬底或晶片上去除一层抗蚀剂，而基本上不累积电荷。 而且，使用纯H 2 O 2等离子体或纯H 2 O 2蒸气的原位实施方法从基板或晶片的表面或表面释放或去除电荷 其在一个或多个IC制造过程中积累。

公开(公告)号：US06685842B2

公开(公告)日：2004-02-03

申请号：US10039477

申请日：2001-12-31

申请人： Ruei-Hung Jang ,  Chih-Lin Ying ,  Tien-Hsing Woo ,  Shan-Hua Wu ,  Ming-Kuo Yu

发明人： Ruei-Hung Jang ,  Chih-Lin Ying ,  Tien-Hsing Woo ,  Shan-Hua Wu ,  Ming-Kuo Yu

IPC分类号： B01D1709

CPC分类号： B01D21/009

摘要： A method and apparatus for carrying out a method for thermophoretically removing particles from a particulate containing liquid the method including providing a heated turbulent flowing particulate contain liquid through a first conduit; redirecting a portion of the particulate containing liquid through a second conduit to provide laminar flow having a flow direction substantially parallel to the first conduit; forming a thermal gradient in said second conduit substantially perpendicular to the flow direction; concentrating particles in the particulate containing liquid in a portion of the second conduit aided at least in part by thermophoretic forces; and, separating the particulate containing liquid into at least a relatively concentrated particle containing portion and a relatively unconcentrated particle containing portion.

摘要翻译： 一种用于实施用于从含颗粒的液体中热去除颗粒的方法的方法和装置，该方法包括提供加热的紊流流动的颗粒通过第一导管容纳液体; 通过第二导管将含部分颗粒的液体重新定向以提供具有基本上平行于第一导管的流动方向的层流; 在所述第二导管中基本上垂直于所述流动方向形成热梯度; 在第二导管的一部分中将颗粒聚集在含微粒的液体中至少部分地通过热电解力来辅助; 并且将含微粒的液体分离成至少相对浓缩的含有颗粒的部分和相对不浓缩的含颗粒的部分。

公开(公告)号：US20070042514A1

公开(公告)日：2007-02-22

申请号：US11507943

申请日：2006-08-22

申请人： Shan Ping Wu ,  Shan Hua Wu

发明人： Shan Ping Wu ,  Shan Hua Wu

IPC分类号： H01L21/66

CPC分类号： H05K7/20727 ,  G06F1/183 ,  G06F1/20 ,  H05K7/20809

摘要： A method and apparatus adapted to cool a circuit board in a rack-mountable housing includes transferring heat from a heat source on the board to a primary heat storage medium positioned at an edge of the board or within a rack-mountable housing using at least one heat pipe, transferring heat from the primary heat storage medium to a secondary heat storage medium positioned in the rack-mountable housing through contacting surfaces of the primary and secondary heat storage mediums, transferring heat from the secondary heat storage medium to a heat exchanger, which may be positioned within the rack-mountable housing, using at least one heat pipe, and cooling the heat exchanger. A method and apparatus adapted to cool a printed circuit board includes transferring heat from a heat source on the board to a heat exchanger positioned in the rack-mountable housing using at least one heat pipe, and cooling the heat exchanger.

摘要翻译： 适于冷却可机架安装的壳体中的电路板的方法和装置包括：将热量从板上的热源转移到位于板的边缘处或在可机架安装的壳体内的主要蓄热介质，使用至少一个 热管，其通过所述主蓄热介质和所述二次蓄热介质的接触表面将热量从所述主蓄热介质传递到定位在所述机架安装壳体中的二次蓄热介质，将热量从所述二次蓄热介质传递到热交换器，所述热交换器 可以使用至少一个热管定位在机架安装的外壳内，并且冷却热交换器。 适于冷却印刷电路板的方法和装置包括使用至少一个热管将热量从板上的热源转移到位于可安装架架的热交换器中，并且冷却热交换器。

公开(公告)号：US20060001945A1

公开(公告)日：2006-01-05

申请号：US11002766

申请日：2004-12-02

申请人： Shan-Hua Wu ,  Fei-Yun Chen ,  Wei-Ya Wang ,  Hung-Hsin Liu ,  Sheng-Liang Pan

发明人： Shan-Hua Wu ,  Fei-Yun Chen ,  Wei-Ya Wang ,  Hung-Hsin Liu ,  Sheng-Liang Pan

IPC分类号： G02B26/00

CPC分类号： G02B26/0833

摘要： A method for use in manufacturing a microelectromechanical system, such as a reflective stealth mirror includes the steps of: forming an I-shape mirror structure; forming a spacer layer over the I-shape mirror structure; and patterning the spacer layer to form at least one spacer along a side of the I-shape mirror structure.

摘要翻译： 一种用于制造诸如反射式隐形镜的微机电系统的方法包括以下步骤：形成I形镜结构; 在所述I形镜结构上形成间隔层; 以及图案化间隔层以沿着I形镜结构的一侧形成至少一个间隔物。

公开(公告)号：US20110284983A1

公开(公告)日：2011-11-24

申请号：US13019194

申请日：2011-02-01

申请人： Chan Shin WU ,  Yung-Yi TU ,  Shan Hua WU

发明人： Chan Shin WU ,  Yung-Yi TU ,  Shan Hua WU

IPC分类号： H01L31/0203 ,  H01L31/0224 ,  H01L31/18

CPC分类号： H01L31/022425 ,  H01L31/035281 ,  H01L31/0725 ,  H01L31/0735 ,  Y02E10/544

摘要： A photodiode device and the manufacturing method of the same are provided. The photodiode device includes a substrate; an epitaxy layer on the substrate, the epitaxy layer including a window layer and a cap layer on the window layer, the cap layer covering a portion of the window layer; and a patterned conductive layer on the cap layer, the patterned conductive layer being formed with a bottom area and a top area wherein the bottom area is greater than the top area.

摘要翻译： 提供一种光电二极管装置及其制造方法。 光电二极管装置包括基板; 所述外延层在所述窗口层上包括窗口层和覆盖层，所述覆盖层覆盖所述窗口层的一部分; 以及在盖层上的图案化导电层，所述图案化导电层形成有底部区域和顶部区域，其中底部区域大于顶部区域。

公开(公告)号：US20090063834A1

公开(公告)日：2009-03-05

申请号：US11850089

申请日：2007-09-05

申请人： An-Sheng Huang ,  Shan-Hua Wu

发明人： An-Sheng Huang ,  Shan-Hua Wu

IPC分类号： G06F15/177

CPC分类号： G06F9/4401

摘要： An auto-switching BIOS system and the method thereof, switches to dual BIOS by a hardware control circuit. After the system has been started with the first BIOS to the predetermined period of time and the BIOS_READY signal is detected as disabled, the hardware control circuit switches the system from the first BIOS to the second BIOS and restarts the system with the second BIOS.

摘要翻译： 一种自动切换BIOS系统及其方法，通过硬件控制电路切换到双BIOS。 在将系统从第一BIOS开始到预定时间段并且BIOS_READY信号被检测为禁用之后，硬件控制电路将系统从第一BIOS切换到第二BIOS，并且用第二BIOS重新启动系统。

公开(公告)号：US07180651B2

公开(公告)日：2007-02-20

申请号：US11002766

申请日：2004-12-02

申请人： Shan-Hua Wu ,  Fei-Yun Chen ,  Wei-Ya Wang ,  Hung-Hsin Liu ,  Sheng-Liang Pan

发明人： Shan-Hua Wu ,  Fei-Yun Chen ,  Wei-Ya Wang ,  Hung-Hsin Liu ,  Sheng-Liang Pan

IPC分类号： G02F26/00

CPC分类号： G02B26/0833

摘要： A method for use in manufacturing a microelectromechanical system, such as a reflective stealth mirror includes the steps of: forming an I-shape mirror structure; forming a spacer layer over the I-shape mirror structure; and patterning the spacer layer to form at least one spacer along a side of the I-shape mirror structure.

摘要翻译： 一种用于制造诸如反射式隐形镜的微机电系统的方法包括以下步骤：形成I形镜结构; 在所述I形镜结构上形成间隔层; 以及图案化间隔层以沿着I形镜结构的一侧形成至少一个间隔物。

公开(公告)号：US06958906B2

公开(公告)日：2005-10-25

申请号：US10412841

申请日：2003-04-11

申请人： Shan Ping Wu ,  Shan Hua Wu

发明人： Shan Ping Wu ,  Shan Hua Wu

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20727 ,  G06F1/20

摘要： A computer system and a method for cooling the system incorporate removable modules within a housing. The housing includes a parallelepiped structure with at least four walls. The four walls include at least two sets of opposing walls. Both walls of one set of opposing walls include opposing first and second openings substantially aligned with each other to allow passage of a cooling medium therethough. The module is receivable through a third opening in the parallelepiped structure and includes an electrical component region. The housing includes a first airflow path in-line with the third opening and a second airflow path between the first opening and the second opening. The first airflow path and the second airflow path are directed across the component region of the module when the module is received within the housing.

摘要翻译： 用于冷却系统的计算机系统和方法将可移动模块并入壳体内。 壳体包括具有至少四个壁的平行六面体结构。 四面墙包括至少两套相对的墙壁。 一组相对的壁的两个壁包括彼此基本对齐的相对的第一和第二开口，以允许冷却介质通过。 模块可以通过平行六面体结构中的第三开口接收并且包括电气部件区域。 壳体包括与第三开口成一直线的第一气流路径和在第一开口和第二开口之间的第二气流路径。 当模块被容纳在壳体内时，第一气流路径和第二气流路径被引导穿过模块的组件区域。

公开(公告)号：US07719837B2

公开(公告)日：2010-05-18

申请号：US11507943

申请日：2006-08-22

申请人： Shan Ping Wu ,  Shan Hua Wu

发明人： Shan Ping Wu ,  Shan Hua Wu

IPC分类号： H05K7/20

CPC分类号： H05K7/20727 ,  G06F1/183 ,  G06F1/20 ,  H05K7/20809

摘要： A method and apparatus adapted to cool a circuit board in a rack-mountable housing includes transferring heat from a heat source on the board to a primary heat storage medium positioned at an edge of the board or within a rack-mountable housing using at least one heat pipe, transferring heat from the primary heat storage medium to a secondary heat storage medium positioned in the rack-mountable housing through contacting surfaces of the primary and secondary heat storage mediums, transferring heat from the secondary heat storage medium to a heat exchanger, which may be positioned within the rack-mountable housing, using at least one heat pipe, and cooling the heat exchanger. A method and apparatus adapted to cool a printed circuit board includes transferring heat from a heat source on the board to a heat exchanger positioned in the rack-mountable housing using at least one heat pipe, and cooling the heat exchanger.

摘要翻译： 适于冷却可机架安装的壳体中的电路板的方法和设备包括：将热量从板上的热源转移到位于板的边缘处或在可机架安装的壳体内的主蓄热介质，其使用至少一个 热管，其通过所述主蓄热介质和所述二次蓄热介质的接触表面将热量从所述主蓄热介质传递到定位在所述机架安装壳体中的二次蓄热介质，将热量从所述二次蓄热介质传递到热交换器，所述热交换器 可以使用至少一个热管定位在机架安装的外壳内，并且冷却热交换器。 适于冷却印刷电路板的方法和装置包括使用至少一个热管将热量从板上的热源转移到位于可安装架架的热交换器中，并且冷却热交换器。