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公开(公告)号:US08450624B2
公开(公告)日:2013-05-28
申请号:US12854040
申请日:2010-08-10
Applicant: Meng-Han Lee , Shao-Yang Lu , Bor-Shyang Liao
Inventor: Meng-Han Lee , Shao-Yang Lu , Bor-Shyang Liao
IPC: H05K1/11
CPC classification number: H05K1/11 , C25D5/022 , C25D7/12 , H01L21/486 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L2924/0002 , H05K3/0035 , H05K3/3484 , H05K3/4007 , H05K3/4069 , H01L2924/00
Abstract: The invention provides a supporting substrate and method for fabricating the same. The supporting substrate includes: a substrate; a first surface metal layer formed on the substrate, wherein the first surface metal layer has a first opening; a second surface metal layer formed on the substrate and disposed oppositely to the first surface metal layer, wherein the substrate has a through hole, and the through hole is formed along the first opening to expose the second surface metal layer; a protective layer formed on the first surface metal layer and the second surface metal layer, wherein the protective layer has a second opening which exposes the through hole; and a conductive bump formed in the through hole, the first opening and the second opening, wherein the conductive bump is electrically connected to the second surface metal layer.
Abstract translation: 本发明提供一种支撑基板及其制造方法。 支撑基板包括:基板; 形成在所述基板上的第一表面金属层,其中所述第一表面金属层具有第一开口; 第二表面金属层,形成在所述基板上并且与所述第一表面金属层相对设置,其中所述基板具有通孔,并且所述通孔沿着所述第一开口形成以暴露所述第二表面金属层; 形成在所述第一表面金属层和所述第二表面金属层上的保护层,其中所述保护层具有暴露所述通孔的第二开口; 以及形成在通孔,第一开口和第二开口中的导电凸块,其中导电凸块电连接到第二表面金属层。
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公开(公告)号:US20130161298A1
公开(公告)日:2013-06-27
申请号:US13591988
申请日:2012-08-22
Applicant: Jyh-Ming Yan , Ming-Song Yang , Chin-Ching Tzeng , Yo-Ming Chang , Kuo-Chao Liang , Chen-Yuan Hsu , Shao-Yang Lu
Inventor: Jyh-Ming Yan , Ming-Song Yang , Chin-Ching Tzeng , Yo-Ming Chang , Kuo-Chao Liang , Chen-Yuan Hsu , Shao-Yang Lu
IPC: B23K10/00
CPC classification number: H05H1/40
Abstract: The present invention provides a plasma torch device. The device comprises a front electrode, a back electrode and a vortex flow generator. The torch roots of the back electrode are moved by fixed magnets. By controlling the magnets coordinated with vortex air flow, the torch roots are moved back and forth periodically on inner surface of the back electrode. The torch roots do not stay at the same place for long for preventing increasing local heat burden of the electrode. Thus, life time and maintenance cycle of the electrode is prolonged with reduced operational cost of plasma torch and enhanced reliability of the device.
Abstract translation: 本发明提供一种等离子体焰炬装置。 该装置包括前电极,背电极和涡流发生器。 背面电极的割炬根由固定磁铁移动。 通过控制与涡流空气流动协调的磁体,焊炬根部在后电极的内表面周期性地前后移动。 手电根不会长时间停留在同一处,以防止电极的局部热负荷增加。 因此,延长了电极的寿命和维护周期,降低了等离子体焰炬的运行成本,提高了设备的可靠性。
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公开(公告)号:US20110253440A1
公开(公告)日:2011-10-20
申请号:US12854040
申请日:2010-08-10
Applicant: Meng-Han LEE , Shao-Yang LU , Bor-Shyang LIAO
Inventor: Meng-Han LEE , Shao-Yang LU , Bor-Shyang LIAO
CPC classification number: H05K1/11 , C25D5/022 , C25D7/12 , H01L21/486 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L2924/0002 , H05K3/0035 , H05K3/3484 , H05K3/4007 , H05K3/4069 , H01L2924/00
Abstract: The invention provides a supporting substrate and method for fabricating the same. The supporting substrate includes: a substrate; a first surface metal layer formed on the substrate, wherein the first surface metal layer has a first opening; a second surface metal layer formed on the substrate and disposed oppositely to the first surface metal layer, wherein the substrate has a through hole, and the through hole is formed along the first opening to expose the second surface metal layer; a protective layer formed on the first surface metal layer and the second surface metal layer, wherein the protective layer has a second opening which exposes the through hole; and a conductive bump formed in the through hole, the first opening and the second opening, wherein the conductive bump is electrically connected to the second surface metal layer.
Abstract translation: 本发明提供一种支撑基板及其制造方法。 支撑基板包括:基板; 形成在所述基板上的第一表面金属层,其中所述第一表面金属层具有第一开口; 第二表面金属层,形成在所述基板上并且与所述第一表面金属层相对设置,其中所述基板具有通孔,并且所述通孔沿着所述第一开口形成以暴露所述第二表面金属层; 形成在所述第一表面金属层和所述第二表面金属层上的保护层,其中所述保护层具有暴露所述通孔的第二开口; 以及形成在通孔,第一开口和第二开口中的导电凸块,其中导电凸块电连接到第二表面金属层。
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