摘要:
A probe card is provided which includes: probe needles electrically contacting input/output terminals of an IC device formed on a semiconductor wafer W; a mount base on which the probe needles are mounted; a support column supporting the mount base, a circuit board having interconnect patterns electrically connected to the probe needles via bonding wires; and a base member and stiffener for reinforcing the probe card. The mount base and the circuit board are noncontact.
摘要:
A probe card is provided which includes: probe needles electrically contacting input/output terminals of an IC device formed on a semiconductor wafer W; a mount base on which the probe needles are mounted; a support column supporting the mount base, a circuit board having interconnect patterns electrically connected to the probe needles via bonding wires; and a base member and stiffener for reinforcing the probe card. The mount base and the circuit board are noncontact.
摘要:
An interface apparatus 5 mounted on a test head 4 comprises: an electrical cable 54 having one end electrically connected to a socket board 66; a device side connector 541 attached to the other end of the electrical cable 54; and a intermediate connector 53 electrically connecting a test head side connector 41 provided on the test head 4 and the device side connector 541 and the intermediate connector 53 having a connector body 531 provided at a bottommost part of the interface apparatus 5; an engagement hole 532 provided at the connector body 531 and having the device side connector 541 detachably connected to it; and an output terminal 537 provided at the connector body 531 and having the test head side connector 41 detachably connected to it.
摘要:
A contact terminal for measurement is provided, for transmitting a signal between a desired probe pin among a plurality of probe pins arranged in parallel at a predetermined distance in a predetermined direction on the surface of a probe substrate and an external measurement apparatus. The contact terminal for measurement includes: a signal terminal having an width smaller than the distance between the probe pins provided on both sides of one probe pin in the arrangement direction; two ground terminals to which a ground potential is applied, which are provided on both sides of the signal terminal in the arrangement direction and which have each width larger than that of the signal terminal in the arrangement direction; and a signal line electrically connecting the signal terminal to a signal input terminal of the external measurement apparatus.
摘要:
A connector mounted on a board having a plurality of board signal lines for transmitting a signal and a board ground line grounded. Each of the plurality of board signal lines includes a plurality of signal terminals formed in correspondence to each of the signal lines. Each of the signal terminals comprises: a signal core line formed of conductor by extension in the shape of a line; a shield for core line formed of conductor insulated from the signal core line electrically so as to extend in an axis direction of the signal core line and enclose the signal core line; a signal electrode formed by extension from the signal core line for connecting the signal core line with the board signal line corresponding to the signal terminal; and a plurality of ground electrodes extended from the shield for core line and opposed to each other by intervention of the signal electrode for connecting the shield for core line with the board ground line respectively.
摘要:
A connector mounted on a board having a plurality of board signal lines for transmitting a signal and a board ground line grounded. Each of the plurality of board signal lines includes a plurality of signal terminals formed in correspondence to each of the signal lines. Each of the signal terminals comprises: a signal core line formed of conductor by extension in the shape of a line; a shield for core line formed of conductor insulated from the signal core line electrically so as to extend in an axis direction of the signal core line and enclose the signal core line; a signal electrode formed by extension from the signal core line for connecting the signal core line with the board signal line corresponding to the signal terminal; and a plurality of ground electrodes extended from the shield for core line and opposed to each other by intervention of the signal electrode for connecting the shield for core line with the board ground line respectively.
摘要:
A device interface apparatus for providing a device under test with a test signal to test the device under test and receiving an output signal outputted from the device under test includes a pin electronics board, a board-side connector provided on an end section of the pin electronics board, wherein the board-side connector includes a plurality of board-side core wires and a board-side shield, a socket for holding the device under test, a socket-side connector including a plurality of socket-side core wires and a socket-side shield, and a cable unit for transmitting the transmission signal between the socket and the pin electronics board, wherein the cable unit includes a board fitting connector, a socket fitting connector, and a plurality of transmission cables.
摘要:
A pin connector has an outer contact bent outwardly from at least a portion of a side wall of a metallic slender sleeve and an inner contact bent inwardly from at least a portion of a side wall of the metallic slender sleeve. The outer contact and the inner contact are resilient radially of the metallic slender sleeve. An electronic component packaging board comprises a board having a through hole defined therein in alignment with an external lead of an electronic component, the pin connector being inserted and held in the through hold. The electronic component packaging board also has another board disposed on the reverse side of the board and having a through hole defined therein. An end portion of the pin connector projects from the through hole in the board and is soldered to the other board in the through hole thereof. A positioning structure such as a pin positions the pin connector inserted in the through hole in the board with respect to the through hole in the other board.
摘要:
A ball grid array semiconductor measuring socket is provided in which a contact pressure force to a solder ball is generated in the direction substantially orthogonal to the longitudinal direction of a forked contact pin and the length of the forked contact pin can be designed to the required minimum length independently of the contact pressure force. The forked contact pin formed by stamping out a sheet metal having a resilience into a tuning fork shape is mounted in a receiving hole formed through an insulating housing. Each forked contact pin is constructed so that the tip portions of a pair of elastic forked portions form contact portions for contacting with a solder ball 12 and that the tip portions contact with a solder ball at two points. In addition, the direction of opposed areas in which a pair of elastic forked portions of the forked contact pin is accommodated is selected to be oblique to the direction of the alignment of the receiving holes, and thus the mounting density of the forked contact pins can be improved.