公开(公告)号：US20050145991A1

公开(公告)日：2005-07-07

申请号：US11028305

申请日：2005-01-04

申请人： Shin Sakamoto ,  Isao Ogawa ,  Hideo Tamura

发明人： Shin Sakamoto ,  Isao Ogawa ,  Hideo Tamura

IPC分类号： F21V5/00 ,  H01L21/56 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/60 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An optical semiconductor device for emitting a light beam includes an outer envelope that forms an indentation in which a light emitting element is positioned. The indentation is divided into a first indentation part corresponding to a lower part of the indentation, and a second indentation part corresponding to an upper part of the indentation. A projection strip between the first and second indentation parts, projects from the inner surface of the outer envelope. A conductive lead supplies an electrical power to the light emitting element.

摘要翻译： 用于发射光束的光学半导体器件包括形成发光元件所在的凹陷的外封套。 凹陷分为对应于凹陷的下部的第一凹口部分和与凹陷的上部对应的第二凹口部分。 第一和第二压痕部分之间的突出条从外封套的内表面突出。 导电引线向发光元件提供电力。

公开(公告)号：US07210807B2

公开(公告)日：2007-05-01

申请号：US11028305

申请日：2005-01-04

申请人： Shin Sakamoto ,  Isao Ogawa ,  Hideo Tamura

发明人： Shin Sakamoto ,  Isao Ogawa ,  Hideo Tamura

IPC分类号： F21V9/16

CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/60 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An optical semiconductor device for emitting a light beam includes an outer envelope that forms an indentation in which a light emitting element is positioned. The indentation is divided into a first indentation part corresponding to a lower part of the indentation, and a second indentation part corresponding to an upper part of the indentation. A projection strip between the first and second indentation parts, projects from the inner surface of the outer envelope. A conductive lead supplies an electrical power to the light emitting element.

摘要翻译： 用于发射光束的光学半导体器件包括形成发光元件所在的凹陷的外封套。 凹陷分为对应于凹陷的下部的第一凹口部分和与凹陷的上部对应的第二凹口部分。 第一和第二压痕部分之间的突出条从外封套的内表面伸出。 导电引线向发光元件提供电力。