摘要:
The present invention provides a semiconductor device which includes a semiconductor chip formed with an electrode pad on one surface thereof, a wiring board having a wiring pattern, with its one surface opposing the other surface of the semiconductor chip, a wire for electrically connecting the electrode pad of the semiconductor chip with the wiring pattern of the wiring board, an external terminal arranged on the other surface of the wiring board for electrical connection with the electrode pad through the wire and wiring pattern, and a sealant for fixing the semiconductor chip on one surface of the wiring board such that a hollow is formed between the other surface of the semiconductor chip and the one surface of the wiring board. The wiring board includes a throughhole communicating with the hollow.
摘要:
The present invention provides a semiconductor device which includes a semiconductor chip formed with an electrode pad on one surface thereof, a wiring board having a wiring pattern, with its one surface opposing the other surface of the semiconductor chip, a wire for electrically connecting the electrode pad of the semiconductor chip with the wiring pattern of the wiring board, an external terminal arranged on the other surface of the wiring board for electrical connection with the electrode pad through the wire and wiring pattern, and a sealant for fixing the semiconductor chip on one surface of the wiring board such that a hollow is formed between the other surface of the semiconductor chip and the one surface of the wiring board. The wiring board includes a throughhole communicating with the hollow.