摘要:
An electric wire protection structure has a structure in which a branch portion of an electric wire bundle is protected. In the electric wire protection structure, a protection portion covers the branch portion of the electric wire bundle, the protection portion being formed by heating and compressing a thermoplastic material in a state of covering at least the branch portion of the electric wire bundle.
摘要:
A connector fixing structure includes a connector provided at one end of an electric wire, a protector surrounding a portion of the electric wire, and a fixing portion integrally formed with the protector and fixating the connector. The protector and the fixing portion are formed of a protection material that includes a base material and a binder material having a melting point lower than that of the base material. The protector and the fixing portion are joined at each joint portion by cooling and solidifying the melted binder material.
摘要:
A wire harness includes a bundle of electric wires and a protector protecting the bundle of electric wires by extending in a longitudinal direction of the bundle of electric wires and surrounding a portion thereof. The protector includes a base material and a binder material having a lower melting point than the base material, the protector being joined in a joint portion thereof by cooling and solidifying the melted binder material. In a case where a first side portion and a second side portion are each provided as a portion along the longitudinal direction in an outer peripheral surface of the protector and the second side portion is disposed opposite the first side portion with the bundle of electric wires therebetween, a portion of the binder material in each of the first side portion and the second side portion is melted, cooled, and solidified such that the second side portion is harder than the first side portion.
摘要:
A photomask is manufactured from a photomask blank comprising a transparent substrate and a light-shielding film consisting of upper and lower layers of transition metal-containing silicon base materials, the content of O+N in the upper layer being higher than that of the lower layer. The light-shielding film is processed in two steps by fluorine dry etching through a resist pattern such that a lower portion of the film is left behind, and oxygen-containing chlorine dry etching for removing the remainder of the film.
摘要:
A photomask is manufactured from a photomask blank comprising a transparent substrate and a light-shielding film consisting of upper and lower layers of transition metal-containing silicon base materials, the content of O+N in the upper layer being higher than that of the lower layer. The light-shielding film is processed in two steps by fluorine dry etching through a resist pattern such that a lower portion of the film is left behind, and oxygen-containing chlorine dry etching for removing the remainder of the film.
摘要:
Disclosed herein is a dry etching method for a work layer formed over a substrate, including the steps of forming a hard mask layer over the work layer formed over the substrate, forming a resist pattern over the hard mask layer, transferring the resist pattern to the hard mask layer by first dry etching conducted using the resist pattern, and patterning the work layer by second dry etching conducted using a hard mask pattern obtained upon the transfer to the hard mask layer, wherein after the hard mask layer is patterned by the first dry etching, the patterning of the work layer by the second dry etching is conducted through changing the concentration of an auxiliary ingredient of a dry etching gas, without changing a main ingredient of the dry etching gas, in an etching apparatus in which the first dry etching has been conducted.
摘要:
A wire harness has an exterior component (11a) that covers a certain part of at least one wires (12). The exterior component (11a) has parts having different hardness, including a relatively hard first part (111a), a relatively soft second part (112a), and a third part (113a) having an intermediate hardness between that of the first parts (111a, 112a). The first part is formed on a surface of the exterior component and functions as a shape keeping member and a protector. The second and third parts (112a, 113a) surround the certain part of the at least one wire 12 and each functions as a cushioning material and a muffler/soundproofing material. The first part (111a), the second part (112a), and the third part (113a) are formed integrally from a non-woven fabric (2) with thermo plasticity.
摘要:
Disclosed herein is a dry etching method for a work layer formed over a substrate, including the steps of forming a hard mask layer over the work layer formed over the substrate, forming a resist pattern over the hard mask layer, transferring the resist pattern to the hard mask layer by first dry etching conducted using the resist pattern, and patterning the work layer by second dry etching conducted using a hard mask pattern obtained upon the transfer to the hard mask layer, wherein after the hard mask layer is patterned by the first dry etching, the patterning of the work layer by the second dry etching is conducted through changing the concentration of an auxiliary ingredient of a dry etching gas, without changing a main ingredient of the dry etching gas, in an etching apparatus in which the first dry etching has been conducted.
摘要:
A photomask blank is provided comprising a transparent substrate, a single or multi-layer film including an outermost layer composed of chromium base material, and an etching mask film. The etching mask film is a silicon oxide base material film formed of a composition comprising a hydrolytic condensate of a hydrolyzable silane, a crosslink promoter, and an organic solvent and having a thickness of 1-10 nm. The etching mask film has high resistance to chlorine dry etching, ensuring high-accuracy processing of the photomask blank.
摘要:
A novel two-dimensional patterning method enabling two-dimension patterning without using any photosensitive material and ion milling, wherein a two-dimensional pattern is formed by destroying a blister provided on a substrate by electron or ion irradiation.