Abstract:
The invention is a transistor or array thereof and method for producing same in VLSI dimensions on a silicon substrate doped P or N type by forming intersecting slots in spaced apart relation across the substrate to define semi-arrays of V shaped intermediate regions which will become transistors. Silicon oxide fills these slots and separates the transistor regions from the substrate. Orthogonal slots divided the semi-arrays into individual transistor active regions which are doped by one of N or P doping introduced into each active regions via the orthogonal slots and driven in to comprise the emitter and collector regions on respective sides of original substrate comprising the base regions. Metallization patterns complete electrical connections to the emitter base and collector regions and silicon oxide substantially covers the periphery of each active region for total isolation. Each transistor may further comprise a doped region called P or N doping extending into and across the top of the base region underneath the interconnect metallization to reduce space region contact resistance and to provide an electron reflecting potential barrier. Each transistor may further comprise a doped skin of either P or N doping to force electrons toward the center of the base region.
Abstract:
The invention provides a unique sub-micron dimensioned resistor and methods of making the same, wherein hundreds of such resistors may be fabricated on a single chip with each comprising an active region surrounded by field oxide completely isolating it from the substrate and its effects on operation. Spaced apart slots made in the substrate permit the introduction of orientation dependent etching fluid therein to at least substantially etch semi-arrays of active regions of the substrate away from the substrate except for spaced apart supports therealong. Oxidation serves to support the semi-arrays and subsequent steps directly from the substrate or by webs of oxidation along the tops of the semi-arrays connected to the substrate. The support is necessary while orthogonal slots are provided permitting access to opposed sides of the active regions for doping from each end, which doping is driven in from both sides to provide a resistor active region to which electrical connections are applied using conventional techniques providing almost complete reduction of the parasitic capacitances because of the total oxide isolation of the active regions from the substrate.The resistors may also be made by forming intersecting slots in spaced apart relation across the substrate to define semi-arrays of V shaped intermediate regions which will become resistors. Silicon oxide fills these slots and separates the resistor regions from the substrate. Orthogonal slots divide the semi-arrays into individual resistor active regions which are optionally doped by one of N or P doping introduced into each active regions via the orthogonal slots and driven in to comprise the resistors.
Abstract:
The invention provides a unique sub-micron dimensioned PNP-type transistor wherein hundreds of such transistors may be fabricated on a single chip with each transistor comprising an active region surrounded by field oxide completely isolating it from the substrate and its effects on operation. Slots made in the substrate permit angle evaporation of etch-resist to protect the active region while it is disconnected from the substrate by etching therebeneath via the slots. Substrate oxidation supports the active regions while orthogonal slots are provided permitting access to opposed sides of the active regions for doping N+ which is driven in from one side only while P or P+ is introduced and driven in from both sides, thereby providing a P+ N+N, P+ emitter, base, collector transistor active region to which electrical connections are applied using conventional techniques, providing almost complete reduction of the parasitic capacitances and resistances because of the total oxide isolation of the active regions from the substrate.
Abstract:
The invention provides a unique VLSI dimensioned NPN type transistor and method of making the same, wherein hundreds of such transistors may be fabricated on a single chip with each transistor comprising an active region surrounded by field oxide completely isolating it from the substrate and its effects on operation. Spaced apart slots made in the substrate permit the introduction of orientation dependent etching fluid therein to at least substantially etch semi-arrays of active regions of the substrate away from the substrate except for spaced apart supports therealong. Oxidation serves to support the semi-arrays directly from the substrate or by webs of oxidation along the tops of the semi-arrays connected to the substrate. The support is necessary while orthogonal slots are provided permitting access to opposed sides of the active regions for doping n+ from each end, which n+ is driven in from both sides to provide an n+p n+ emitter-base-collector transistor active region to which electrical connections are applied using conventional techniques providing almost complete reduction of the parasitic capacitances and resistances because of the total oxide isolation of the active regions from the substrate.
Abstract translation:本发明提供了一种独特的VLSI尺寸尺寸的NPN型晶体管及其制造方法,其中可以在单个芯片上制造数百个这样的晶体管,其中每个晶体管包括由场氧化物包围的有源区域,其完全将其与衬底隔离,并且其对 操作。 在衬底中形成的间隔开的槽允许在其中引入取向相关的蚀刻流体,以至少基本上蚀刻基板的有源区的半阵列远离衬底,除了其间隔开的支撑。 氧化用于从衬底直接支撑半阵列,或者通过连接到衬底的半阵列顶部的氧化纤维网。 支撑是必需的,同时提供正交槽,允许进入有源区的相对侧,用于从两端掺杂n +,n +从两侧驱动,以提供n + p n +发射极 - 基极 - 集电极晶体管有源区, 使用常规技术施加电连接,由于活性区域与衬底的总氧化物隔离,几乎完全降低了寄生电容和电阻。
Abstract:
The invention provides a unique sub-micron dimensioned resistor and methods of making the same, wherein hundreds of such resistors may be fabricated on a single chip with each comprising an active region surrounded by field oxide completely isolating it from the substrate and its effects on operation. Spaced apart slots made in the substrate permit the introduction of orientation dependent etching fluid therein to at least substantially etch semi-arrays of active regions of the substrate away from the substrate except for spaced apart supports therealong. Oxidation serves to support the semi-arrays and subsequent steps directly from the substrate or by webs of oxidation along the tops of the semi-arrays connected to the substrate. The support is necessary while orthogonal slots are provided permitting access to opposed sides of the active regions for doping from each end, which doping is driven in from both sides to provide a resistor active region to which electrical connections are applied using conventional techniques providing almost complete reduction of the parasitic capacitances because of the total oxide isolation of the active regions from the substrate.The resistors may also be made by forming intersecting slots in spaced apart relation across the substrate to define semi-arrays of V shaped intermediate regions which will become resistors. Silicon oxide fills these slots and separates the resistor regions from the substrate. Orthogonal slots divide the semi-arrays into individual resistor active regions which are optionally doped by one of N or P doping introduced into each active region via the orthogonal slots and driven in to comprise the resistors.
Abstract:
The invention provides a unique sub-micron dimensioned NPN type transistor, wherein hundreds of such transistors may be fabricated on a single chip with each transistor comprising an active region surrounded by field oxide completely isolating it from the substrate and its effects on operation. Slots made in the substrate permit angle evaporation of etch-resist to protect the active region while it is disconnected from the substrate by etching therebeneath via the slots. Substrate oxidation supports the active regions while orthogonal slots are provided permitting access to opposed sides of the active regions for doping P+ which is driven in from one side only while N+ is introduced and driven in from both sides, thereby providing an N+ P+P, N+ emitter, base, collector transistor active region to which electrical connections are applied using conventional techniques, providing almost complete reduction of the parasitic capacitances and resistances because of the total oxide isolation of the active regions from the substrate.
Abstract:
The invention provides a unique sub-micron dimensioned NPN type transistor and method of making the same, wherein hundreds of such transistors may be fabricated on a single chip with each transistor comprising an active region surrounded by field oxide completely isolating it from the substrate and its effects on operation. Spaced apart slots made in the substrate permit the introduction of orientation dependent etching fluid therein to at least substantially etch semi-arrays of active regions of the substrate away from the substrate except for spaced apart supports therealong. Oxidation serves to support the semi-arrays and subsequent steps directly from the substrate or by webs of oxidation along the tops of the semi-arrays connected to the substrate. The support is necessary while orthogonal slots are provided permitting access to opposed sides of the active regions for doping n+ from each end, which n+ is driven in from both sides to provide an n+p n+ emitter base collector transistor active region to which electrical connections are applied using conventional techniques providing almost complete reduction of the parasitic capacitances and resistances because of the total oxide isolation of the active regions from the substrate.
Abstract translation:本发明提供了一种独特的亚微米尺寸的NPN型晶体管及其制造方法,其中可以在单个芯片上制造数百个这样的晶体管,其中每个晶体管包括由场氧化物包围的有源区域,其完全将其与衬底隔离, 对操作的影响。 在衬底中形成的间隔开的槽允许在其中引入取向相关的蚀刻流体,以至少基本上蚀刻基板的有源区的半阵列远离衬底,除了其间隔开的支撑。 氧化用于从衬底直接支撑半阵列和后续步骤,或者通过连接到衬底的半阵列顶部的氧化纤维网。 支撑是必需的,同时提供正交槽,允许进入有源区域的相对侧,用于从两端掺杂n +,n +从两侧驱动,以提供n + p n +发射极基极集电极晶体管有源区,电连接 使用常规技术施加,由于活性区域与基底的总氧化物隔离,几乎完全降低了寄生电容和电阻。
Abstract:
A light emitting bipolar transistor, adapted to produce light from cathodoluminescence, upon being biased into conduction, the light emitting bipolar transistor being formed on the top surface of a relatively flat semiconductor substrate and having active regions comprising: a collector region, and an emitter region, the collector and emitter regions being of a first conductivity type, and an extended base region of a second conductivity type, the extended base region being interposed between the collector and the emitter regions, and the base region having a coatable surface, a phosphor coating, the phosphor coating covering the base region coatable surface, and respective connections to the collector emitter and base regions; whereby, biasing the transistor into conduction produces an electric field in the base region, the electric field in the base field inducing electrons in the base region to increase energy to a high energy level and to drift, some drifting high energy electrons being scattered into the phosphor coating, thereby impacting the phosphor and producing light by cathodoluminescence.
Abstract:
An array of hundreds of devices may be simultaneously processed on a chip to sub-micron dimensions by establishing tiny active regions for each transistor surrounded by field oxide filled moats or slotted regions, wherein the slots are utilized to dope the substrate within the active region. The P type substrate is double energy arsenic planted through one surface to establish a N region to a given depth. This surface is oxidized and photoresist masked conventionally to open regions for the slots which are ion milled or ODE etched to a given depth. P+ regions are established by the slots by ion implanting at an angle such that the entire depth of the slot is not doped but rather the doping is confined to a region within the double energy N implanted depth. Drive-in diffusion enlarges the P+ areas for the emitter and collector and oxidation fills the moat insulating regions around the active area.The oxide is stripped and the N region enhanced to N+ at the surface, with silox being deposited and opened for metal contacts to the N+ region for the base and the emitter and collector regions. The doping profile of the base region provides a potential barrier to minimize the flow of electrons toward the surface because the emitter electrons are channeled through the less heavily doped part of the base region to the collector.
Abstract:
A device for reading information representing magnetization patterns on a medium by means of a time-of-flight magnetotransistor detector. The time-of-flight magnetotransistor detector consists of a bipolar transistor implemented on a semiconductor surface which is in a magnetic flux coupling with a plurality of magnetization patterns. Such magnetization patterns which may be generated by a magnetic bubble domain on an adjacent bubble domain device or by a magnetized region on an adjacent media such as a magnetic tape or disk. The magnetotransistor detector consists of an emitter region, an elongated base region, and a collector region, and a twin-lead thin-film transmission line in capacitive coupling with the base region of the magnetotransistor. The presence of a magnetic field in the base region creates a Hall voltage which produces a pulse on the transmission line.