公开(公告)号：US20110101072A1

公开(公告)日：2011-05-05

申请号：US12612687

申请日：2009-11-05

申请人： Wai Keong WANG ,  Sik Pong LEE

发明人： Wai Keong WANG ,  Sik Pong LEE

IPC分类号： B23K31/12 ,  B23K37/04

CPC分类号： B23K20/004 ,  B23K37/0408 ,  B23K37/0426 ,  B23K2101/42 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/78 ,  Y10S228/904

摘要： A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity. In operation, after the lead frame is clamped between the base clamping surface and clamping members, the controller allows the drive to provide the relative movement until the position sensor detects that an underside of the lead frame has abutted the die assembly support.

摘要翻译： 一种用于在引线接合期间夹紧模具组件的方法和可调夹紧系统。 该系统包括至少一对相对的底壁，每个基壁具有底部夹紧表面。 存在至少一对夹紧构件，每个夹紧构件可朝向相应的底部夹紧表面移动，从而夹紧模具组件的引线框架。 模具组件支撑件设置在该对相对的底壁和模具组件支撑件之间，并且一对相对的底壁提供空腔。 存在耦合到控制器的位置传感器，并且还存在可由控制器控制的驱动器。 驱动器提供模具组件支撑件相对于每个基座夹紧表面的运动，从而调节空腔的深度。 在操作中，在引线框架夹紧在基座夹持表面和夹紧构件之后，控制器允许驱动器提供相对运动，直到位置传感器检测到引线框架的下侧已经抵靠模具组件支撑件。

公开(公告)号：US20130026212A1

公开(公告)日：2013-01-31

申请号：US13543576

申请日：2012-07-06

申请人： Samuel Waising Tam ,  Bryan Sik Pong Lee ,  Tak Shing Pang

发明人： Samuel Waising Tam ,  Bryan Sik Pong Lee ,  Tak Shing Pang

IPC分类号： H05K13/04

CPC分类号： H01L24/11 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11849 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/3012 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75253 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00

摘要： A manufacturing technique includes creating stud bumps on the electrical contacts on a die, either in wafer or die form. A separate stencil or carrier is provided with cavities that correspond to the electrical contacts on the die. The cavities are filled with solder paste and the die is brought into close proximity with the stencil so that the stud bumps extend into the cavities and come into contact with the solder paste. When the die is removed, the solder paste stays affixed to the stud bumps and thereby the solder paste is transferred and delivered to the stud bumps. The die can then be affixed to a substrate such as a PCB.

摘要翻译： 一种制造技术包括在晶片或模具形式的模具上的电触点上形成凸块凸块。 单独的模板或载体上设置有与模具上的电触点相对应的空腔。 这些空腔填充有焊膏，并且模具与模板紧密接近，使得凸块凸起延伸到空腔中并与焊膏接触。 当去除模具时，焊膏保持固定到柱形凸块上，由此焊膏被传送并传递到凸块凸块。 然后可以将模具固定到诸如PCB的基板。

公开(公告)号：US08016183B2

公开(公告)日：2011-09-13

申请号：US12612687

申请日：2009-11-05

申请人： Wai Keong Wong ,  Sik Pong Lee

发明人： Wai Keong Wong ,  Sik Pong Lee

IPC分类号： B23K31/00 ,  B23K11/16

CPC分类号： B23K20/004 ,  B23K37/0408 ,  B23K37/0426 ,  B23K2101/42 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/78 ,  Y10S228/904

摘要： A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity. In operation, after the lead frame is clamped between the base clamping surface and clamping members, the controller allows the drive to provide the relative movement until the position sensor detects that an underside of the lead frame has abutted the die assembly support.

摘要翻译： 一种用于在引线接合期间夹紧模具组件的方法和可调夹紧系统。 该系统包括至少一对相对的底壁，每个基壁具有底部夹紧表面。 存在至少一对夹紧构件，每个夹紧构件可朝向相应的底部夹紧表面移动，从而夹紧模具组件的引线框架。 模具组件支撑件设置在该对相对的底壁和模具组件支撑件之间，并且一对相对的底壁提供空腔。 存在耦合到控制器的位置传感器，并且还存在可由控制器控制的驱动器。 驱动器提供模具组件支撑件相对于每个基座夹紧表面的运动，从而调节空腔的深度。 在操作中，在引线框架夹紧在基座夹持表面和夹紧构件之后，控制器允许驱动器提供相对运动，直到位置传感器检测到引线框架的下侧已经抵靠模具组件支撑件。