公开(公告)号：US06219840B1

公开(公告)日：2001-04-17

申请号：US08625499

申请日：1996-03-29

Applicant: Richard J. Corrigan ,  Alan Lee Grau ,  Kurt Steinbrenner ,  Srinivasan Anand

Inventor： Richard J. Corrigan ,  Alan Lee Grau ,  Kurt Steinbrenner ,  Srinivasan Anand

IPC: H04N7173

CPC classification number: H04W72/0453 ,  H04J1/12 ,  H04J4/00 ,  H04W4/00 ,  H04W72/0413

Abstract: A method for assigning communication resources includes assigning communication resources (216, 218, 220) in the nature of bandwidth according to various selection schemes based upon the type of communication service being provided, and based upon the nature of the service area (128, 130) and subscriber premises (132, 134).

Abstract translation: 用于分配通信资源的方法包括：根据所提供的通信服务的类型，根据各种选择方案，根据服务区域（128,130）的性质，分配带宽性质的通信资源（216,218,220） ）和用户住宅（132,134）。

公开(公告)号：US20060289977A1

公开(公告)日：2006-12-28

申请号：US11167425

申请日：2005-06-27

Applicant: Raj Master ,  Srinivasan Anand ,  Srinivasan Parthasarathy ,  Yew Mui

Inventor： Raj Master ,  Srinivasan Anand ,  Srinivasan Parthasarathy ,  Yew Mui

IPC: H01L23/02

CPC classification number: C22C13/02 ,  B23K35/262 ,  H01L23/49811 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19105 ,  H05K3/3463 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2203/047 ,  H01L2224/81 ,  H01L2224/0401

Abstract: A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.

Abstract translation: 封装衬底包括管芯焊盘和焊脚焊脚。 针焊料焊片可以包含约90重量％至约99重量％的锡和约10重量％至1重量％的锑。 模焊盘可以包括约4重量％至约8重量％的铋，约2重量％至约4重量％的银，约0重量％至约0.7重量％的铜，以及约87重量％至约92重量％ 锡。 模焊盘可以包括约7重量％至约20重量％的铟，约2重量％至约4.5重量％的银之间，约0重量％至约0.7重量％的铜之间，约0重量％至约0.5重量％ 重量锑，以及约74.3重量％至约90重量％的锡。