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公开(公告)号：US20120235290A1
公开(公告)日：2012-09-20
申请号：US13498919
申请日：2010-10-07
申请人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
发明人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
IPC分类号： H01L23/488 , H01L21/50
CPC分类号： H05K1/144 , H01L23/10 , H01L23/36 , H01L23/49833 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/72 , H01L24/73 , H01L25/074 , H01L25/18 , H01L2224/0231 , H01L2224/0233 , H01L2224/02335 , H01L2224/0401 , H01L2224/13099 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/732 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H05K3/0061 , H05K2201/042 , H05K2201/1053 , Y10T29/4913 , H01L2224/13 , H01L2224/72 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterised in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.
摘要翻译： 本发明涉及一种优选用于车辆，特别是电动车辆的功率模块（10），其特征在于，所述模块包括两个垂直相邻的半导体芯片（12,14），每个芯片具有第一表面（20,22） 连接到散热器基板（24,26），以及与第一表面分开并且在其上布置至少一个电子部件（38a-44b）的第二表面（28,30），该模块被布置成使得 芯片的第二表面彼此相对布置。
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公开(公告)号：US08916963B2
公开(公告)日：2014-12-23
申请号：US13498919
申请日：2010-10-07
申请人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
发明人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
IPC分类号： H01L23/34 , H05K3/30 , H05K7/00 , H01L23/498 , H01L23/00 , H01L23/36 , H01L25/18 , H01L25/07 , H05K1/14 , H01L23/10 , H05K3/00
CPC分类号： H05K1/144 , H01L23/10 , H01L23/36 , H01L23/49833 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/72 , H01L24/73 , H01L25/074 , H01L25/18 , H01L2224/0231 , H01L2224/0233 , H01L2224/02335 , H01L2224/0401 , H01L2224/13099 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/732 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H05K3/0061 , H05K2201/042 , H05K2201/1053 , Y10T29/4913 , H01L2224/13 , H01L2224/72 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.
摘要翻译： 本发明涉及一种优选用于车辆，特别是电动车辆的功率模块（10），其特征在于，所述模块包括两个垂直相邻的半导体芯片（12,14），每个芯片具有第一表面（20,22） 连接到散热器基板（24,26），以及与第一表面分开并且在其上布置至少一个电子部件（38a-44b）的第二表面（28,30），该模块被布置成使得 芯片的第二表面彼此相对布置。
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公开(公告)号：US08958209B2
公开(公告)日：2015-02-17
申请号：US13499378
申请日：2010-10-07
申请人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hérve Lorin
发明人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hérve Lorin
CPC分类号： H05K1/0206 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L2224/4846 , H01L2224/48472 , H05K1/056 , H05K1/09 , H05K3/0061 , H05K2201/0323 , H05K2201/10166 , Y10T29/49155
摘要： Said electronic power module (10) includes: a stack (14) comprising a metal layer forming an electric circuit (26) and intended for supporting an electronic power component (18) such as a semiconductor; a metal body forming a heat drain (20); and a dielectric material layer (22) forming an electric insulator and inserted between the electric circuit (26) and the heat drain (20). The stack (14) includes a composite material body (24) having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body (24) is inserted between an area of the electric circuit (26) and the electric insulator (22), said area being intended for supporting the electronic power component (18).
摘要翻译： 所述电子功率模块（10）包括：堆叠（14），包括形成电路（26）的金属层并且用于支撑诸如半导体的电子功率部件（18）; 形成散热器（20）的金属体; 以及形成电绝缘体并插入在电路（26）和散热器（20）之间的电介质材料层（22）。 叠层（14）包括具有带碳金属基体的复合材料体（24）。 碳电荷为20至60体积％。 所述复合体（24）插入在电路（26）的区域和电绝缘体（22）之间，所述区域用于支撑电子功率部件（18）。
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公开(公告)号：US20120268895A1
公开(公告)日：2012-10-25
申请号：US13499378
申请日：2010-10-07
申请人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin
发明人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin
CPC分类号： H05K1/0206 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L2224/4846 , H01L2224/48472 , H05K1/056 , H05K1/09 , H05K3/0061 , H05K2201/0323 , H05K2201/10166 , Y10T29/49155
摘要： Said electronic power module (10) includes: a stack (14) comprising a metal layer forming an electric circuit (26) and intended for supporting an electronic power component (18) such as a semiconductor; a metal body forming a heat drain (20); and a dielectric material layer (22) forming an electric insulator and inserted between the electric circuit (26) and the heat drain (20). The stack (14) includes a composite material body (24) having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body (24) is inserted between an area of the electric circuit (26) and the electric insulator (22), said area being intended for supporting the electronic power component (18).
摘要翻译： 所述电子功率模块（10）包括：堆叠（14），包括形成电路（26）的金属层并且用于支撑诸如半导体的电子功率部件（18）; 形成散热器（20）的金属体; 以及形成电绝缘体并插入在电路（26）和散热器（20）之间的电介质材料层（22）。 叠层（14）包括具有带碳金属基体的复合材料体（24）。 碳电荷为20至60体积％。 所述复合体（24）插入在电路（26）的区域和电绝缘体（22）之间，所述区域用于支撑电子功率部件（18）。
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