公开(公告)号：US5145553A

公开(公告)日：1992-09-08

申请号：US696435

申请日：1991-05-06

申请人： Stanley M. Albrechta ,  Robert J. Clementi ,  Thomas E. Kindl

发明人： Stanley M. Albrechta ,  Robert J. Clementi ,  Thomas E. Kindl

IPC分类号： H01B5/02 ,  C23F1/28 ,  G11B5/48 ,  H01B7/04 ,  H05K1/00 ,  H05K1/05 ,  H05K3/06 ,  H05K3/44

CPC分类号： C23F1/28 ,  G11B5/484 ,  H05K1/056 ,  H05K3/067 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2203/0323 ,  H05K2203/1572

摘要： A method of making a flexible circuit member including a stainless steel base member, a dielectric layer (polyimide) on the base member and a conductive circuit (copper) on the dielectric. The circuit member may be first formed as a laminate structure wherein the dielectric polyimide is coated on the stainless steel and appropriately treated (cured). The copper circuitry is then formed utilizing resist application and exposure techniques. Significantly, the copper-containing circuitry and stainless steel base member are simultaneously etched using a cupric chloride etchant solution to effectively remove desired portions of these metallic materials and produce the desired flexible circuit member.

摘要翻译： 一种制造柔性电路构件的方法，该电路构件包括不锈钢基底构件，在基底构件上的介电层（聚酰亚胺）和电介质上的导电电路（铜）。 电路构件可以首先形成为层压结构，其中电介质聚酰亚胺涂覆在不锈钢上并进行适当处理（固化）。 然后利用抗蚀剂应用和曝光技术形成铜电路。 重要的是，使用氯化铜蚀刻剂溶液同时蚀刻含铜电路和不锈钢基底构件，以有效地去除这些金属材料的所需部分并产生所需的柔性电路构件。

公开(公告)号：US4906803A

公开(公告)日：1990-03-06

申请号：US268449

申请日：1988-11-08

申请人： Stanley M. Albrechta ,  Francis C. Burns ,  Gary R. Carden ,  William T. Chen ,  Andrew R. Gresko ,  John J. Kaufman ,  Eugene P. Skarvinko ,  Nadia Tonsi

发明人： Stanley M. Albrechta ,  Francis C. Burns ,  Gary R. Carden ,  William T. Chen ,  Andrew R. Gresko ,  John J. Kaufman ,  Eugene P. Skarvinko ,  Nadia Tonsi

IPC分类号： H01B7/08 ,  H01B13/00 ,  H01R27/00 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/38

CPC分类号： H05K1/056 ,  H05K1/112 ,  H05K1/118 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/0723 ,  H05K2203/107 ,  H05K3/002 ,  H05K3/388

摘要： A flexible supporting cable for an electronic device which includes a steel foil substrate, a layer of polymer on portions of the substrate, circuit pads on the polymer layer having both the bottom and top surfaces of the pads exposed; circuit lines extending from the top surface of the pads, a window free from steel beneath a portion of the circuit lines, and a second, smaller window free from both steel and the polymer beneath a portion of the circuit lines. Methods are provided for fabricating these flexible supporting cables.