公开(公告)号：US07201044B1

公开(公告)日：2007-04-10

申请号：US11237360

申请日：2005-09-27

申请人： Scott L. Bunyer ,  Steven J. Magee ,  Fred W. Hintz ,  Richard M. Andrews ,  Gary O'Brien ,  James ZT Liu ,  James D. Cook ,  Stephen R. Shiffer

发明人： Scott L. Bunyer ,  Steven J. Magee ,  Fred W. Hintz ,  Richard M. Andrews ,  Gary O'Brien ,  James ZT Liu ,  James D. Cook ,  Stephen R. Shiffer

IPC分类号： G01M15/00

CPC分类号： G01L3/1428

摘要： A torque sensor system and method. An automotive engine is located opposite a torque converter, such that a shaft extends from the engine and interacts with the torque converter. A target is located between the engine and torque converter. One or more torque sensors can be integrated with one or more position sensors for detecting a position associated with the shaft, wherein the torque sensor(s) and the position sensor(s) are integrated into a single torque sensor package to thereby provide enhanced sensing of the target in association with a rotation of shaft during an actuation of the engine.

摘要翻译： 扭矩传感器系统及方法。 汽车发动机位于变矩器的对面，使得轴从发动机延伸并与变矩器相互作用。 目标位于发动机和变矩器之间。 一个或多个扭矩传感器可以与一个或多个位置传感器集成，用于检测与轴相关联的位置，其中转矩传感器和位置传感器被集成到单个扭矩传感器封装中，从而提供增强的感测 在发动机的致动期间与轴的旋转相关联的目标。

公开(公告)号：US07307517B2

公开(公告)日：2007-12-11

申请号：US11199435

申请日：2005-08-05

申请人： James Z T Liu ,  James D. Cook ,  Fred W. Hintz ,  Steven J. Magee ,  Richard M. Andrews ,  Randy J. Hasken ,  Stephen R. Shiffer

发明人： James Z T Liu ,  James D. Cook ,  Fred W. Hintz ,  Steven J. Magee ,  Richard M. Andrews ,  Randy J. Hasken ,  Stephen R. Shiffer

IPC分类号： B60Q1/00

CPC分类号： G01L3/10

摘要： A torque sensing system generally includes a torque sensor comprising a torque sensing element configured upon a substrate in association with an antenna for sending and receiving wireless signals. A plurality of electronic controlling components for controlling the torque sensor, wherein the electronic controlling components are configured upon another substrate in association with an antenna for sending and receiving the wireless signals to and from the torque sensor, such that the torque sensor is located on a rotating member in order to generate signals indicative of a torque associated with the rotating member, and wherein the signals are wirelessly transmittable from the torque the via the antenna configured upon the substrate in association with the torque sensor.

摘要翻译： 转矩传感系统通常包括转矩传感器，该扭矩传感器包括与用于发送和接收无线信号的天线相关联的基板上配置的扭矩感测元件。 用于控制扭矩传感器的多个电子控制部件，其中电子控制部件与用于向扭矩传感器发送和接收无线信号的天线相关联地配置在另一基板上，使得扭矩传感器位于 旋转构件，以便产生指示与旋转构件相关联的扭矩的信号，并且其中，所述信号可以通过与所述转矩传感器相关联地配置在所述基板上的所述天线从所述转矩无线传输。

公开(公告)号：US07216048B2

公开(公告)日：2007-05-08

申请号：US11027289

申请日：2004-12-30

申请人： Tzu-Yu Wang ,  Cleopatra Cabuz ,  Eugen I Cabuz ,  Stephen R. Shiffer ,  David J. Zook

发明人： Tzu-Yu Wang ,  Cleopatra Cabuz ,  Eugen I Cabuz ,  Stephen R. Shiffer ,  David J. Zook

IPC分类号： G01L27/00

CPC分类号： G01L9/0072 ,  G01L27/002

摘要： A control system coupled to a pressure sensor calibrates the pressure sensor. The control system may measure a plurality of capacitance values at a plurality of corresponding applied voltages to compare the values with a first calibration mechanism generated by sample pressure sensors in a comparison. A final calibration mechanism may be generated by adjusting the first calibration mechanism in response to the comparison. The unknown differential pressure may be applied to a diaphragm of the pressure sensor. A capacitance value at the unknown differential pressure may then be measured. Using the final calibration mechanism, the differential pressure at the measured capacitance value may be retrieved.

摘要翻译： 耦合到压力传感器的控制系统校准压力传感器。 控制系统可以在多个对应的施加电压下测量多个电容值，以便在比较中将该值与由样品压力传感器产生的第一校准机构进行比较。 可以通过响应于比较来调整第一校准机构来产生最终校准机构。 未知的压差可以应用于压力传感器的隔膜。 然后可以测量未知压差下的电容值。 使用最终校准机构，可以检索测量的电容值的压差。

公开(公告)号：US07061076B2

公开(公告)日：2006-06-13

申请号：US10918679

申请日：2004-08-12

申请人： Stephen R. Shiffer

发明人： Stephen R. Shiffer

IPC分类号： H01L23/58

CPC分类号： H05K1/184 ,  H05K1/182 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09981 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611

摘要： An apparatus and method for providing three-dimensional carrier mounting of one or more electronic components. In accordance with one embodiment, the device mounting apparatus of the present invention includes an elastically resilient plastic substrate having component mounting surfaces in at least two dimensions. At least one press-fit component insertion cavity is disposed within the component mounting surfaces to provide compressive retention of the electronic component when press-fit into the cavity. Preferably, the cavity has a depth such that when the component is press-fit, it does not extend above the surface plane of the cavity. The insertion cavity is further characterized as including at least one conductive trace disposed on an inner surface of said insertion cavity and positioned on the insertion cavity surface such that the conductive trace contacts at least one lead of the electronic device retained within the insertion cavity.

摘要翻译： 一种用于提供一个或多个电子部件的三维载体安装的装置和方法。 根据一个实施例，本发明的装置安装装置包括具有至少两个维度的部件安装表面的弹性弹性塑料基板。 至少一个按压配合部件插入腔设置在部件安装表面内，以在压配合到腔中时提供电子部件的压缩保持。 优选地，空腔具有这样的深度，使得当组件被压配合时，其不延伸到空腔的表面平面之上。 插入腔的特征还在于包括设置在所述插入腔的内表面上并定位在插入腔表面上的至少一个导电迹线，使得导电迹线接触保持在插入腔内的电子器件的至少一个引线。

公开(公告)号：US20110214504A1

公开(公告)日：2011-09-08

申请号：US13107622

申请日：2011-05-13

申请人： Alistair D. Bradley ,  Stephen R. Shiffer

发明人： Alistair D. Bradley ,  Stephen R. Shiffer

IPC分类号： G01L9/00

CPC分类号： G01L19/0023 ,  A61M1/3639 ,  A61M1/3641 ,  A61M39/08 ,  A61M2205/0244 ,  A61M2205/3331 ,  G01L15/00 ,  G01L19/14

摘要： A disposable pressure sensor system includes a disposable sensor assembly having at least one sensing element, carried on a housing or frame, and at least one electrical connector and/or mechanical connector for connecting the sensing element(s) to an external apparatus or device. The mechanical and/or electrical connectors are integrated in the housing or frame so that both the connector(s) and sensing element(s) are packaged in a single part. The assembly can be integrated in or attachable to a fluid carrying module, such as a dialysis cartridge, such that the sensing element(s) can sense the fluid in the module.

摘要翻译： 一次性压力传感器系统包括具有承载在壳体或框架上的至少一个感测元件和用于将感测元件连接到外部设备或装置的至少一个电连接器和/或机械连接器的一次性传感器组件。 机械和/或电连接器集成在壳体或框架中，使得连接器和感测元件都被包装在单个部件中。 组件可以集成在流体承载模块（例如透析盒）中或可附接到流体承载模块，使得感测元件可以感测模块中的流体。

公开(公告)号：US07408243B2

公开(公告)日：2008-08-05

申请号：US11302765

申请日：2005-12-14

申请人： Stephen R. Shiffer

发明人： Stephen R. Shiffer

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49562 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599

摘要： A sensor package apparatus and method are disclosed in which a sensor die is provided and based on a substrate. An integrated circuit is generally associated with the sensor die. A leadframe is also provided, which is connected by at least one weld to the integrated circuit and the substrate. The integrated circuit, the leadframe, and the sensor die are configured in a flip-chip arrangement to protect the sensor die and form a sensor package apparatus that provides compact and robust electrical and physical connections thereof. The integrated circuit can be formed from, for example, silicon carbide. A metallization layer can also be formed on the integrated circuit, wherein the integrated circuit is configured upon the substrate of the sensor die. The metallization layer thus adheres to the integrated circuit via the weld(s).

摘要翻译： 公开了一种传感器封装装置和方法，其中提供了传感器管芯并且基于衬底。 集成电路通常与传感器管芯相关联。 还提供引线框架，其通过至少一个焊接件连接到集成电路和基板。 集成电路，引线框架和传感器裸片被配置为倒装芯片布置，以保护传感器管芯并形成传感器封装设备，其提供紧凑且坚固的电气和物理连接。 集成电路可以由例如碳化硅形成。 也可以在集成电路上形成金属化层，其中集成电路配置在传感器管芯的基板上。 金属化层因此通过焊接附着到集成电路。

公开(公告)号：US07395724B2

公开(公告)日：2008-07-08

申请号：US11210198

申请日：2005-08-22

申请人： Scott L. Bunyer ,  Fred W. Hintz ,  Steven J. Magee ,  Randall J. Hasken ,  James Z T Liu ,  Gary R. O'Brien ,  James D. Cook ,  Richard M. Andrews ,  Stephen R. Shiffer

发明人： Scott L. Bunyer ,  Fred W. Hintz ,  Steven J. Magee ,  Randall J. Hasken ,  James Z T Liu ,  Gary R. O'Brien ,  James D. Cook ,  Richard M. Andrews ,  Stephen R. Shiffer

IPC分类号： G01L3/02

CPC分类号： G01L3/10

摘要： A torque sensor packaging system and method includes a torque member that includes one or more holes formed therein for receiving one or more respective fasteners associated with a sensing element. The sensing element can be connected to the torque member to the sensing element in order to transfer torque associated with the torque member to the sensing element for torque sensing operations thereof.

摘要翻译： 扭矩传感器封装系统和方法包括扭矩构件，其包括形成在其中的一个或多个孔，用于接收与感测元件相关联的一个或多个相应紧固件。 感测元件可以连接到扭矩构件到感测元件，以便将与扭矩构件相关联的扭矩传递到用于其扭矩传感操作的感测元件。

公开(公告)号：US07112873B2

公开(公告)日：2006-09-26

申请号：US10934813

申请日：2004-09-03

申请人： Stephen R. Shiffer

发明人： Stephen R. Shiffer

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/552 ,  H01L23/49861 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A plastic substrate can be provided and thereafter a plurality of metal-to-metal connections can be ultrasonically bonded to the plastic substrate. One or more dies and a plurality of conductive components thereof can then be respectively connected to the metal-to-metal connections in order to provide a plastic leadframe package structure that includes electronic circuitry thereon. The plurality of conductive components can be configured as discrete components, while the die itself can be configured as a Flip Chip On Plastic Leadframe component. By utilizing plastic as the basis for a substrate and, ultrasonic bonding of the metal-to-metal connections, a complex substrate formed from plastic can provide a structure, particularly a plastic leadframe structure, that allows for the use of parts and components that are much less expensive than presently utilized parts and components.

摘要翻译： 可以提供塑料基板，此后可以将多个金属对金属连接件超声波接合到塑料基板上。 然后可以将一个或多个管芯及其多个导电部件分别连接到金属 - 金属连接，以便提供包括其上的电子电路的塑料引线框封装结构。 多个导电部件可以被配置为分立部件，而管芯本身可被配置为塑料引线框架上的倒装芯片部件。 通过利用塑料作为基底的基础以及金属 - 金属连接的超声波接合，由塑料形成的复合基底可以提供结构，特别是塑料引线框架结构，其允许使用部件和部件 比目前使用的部件和组件便宜得多。

公开(公告)号：US07219021B2

公开(公告)日：2007-05-15

申请号：US11317706

申请日：2005-12-24

申请人： James Z T Liu ,  Gautham Ramamurthy ,  Alistair D. Bradley ,  James D. Cook ,  Stephen R. Shiffer

发明人： James Z T Liu ,  Gautham Ramamurthy ,  Alistair D. Bradley ,  James D. Cook ,  Stephen R. Shiffer

IPC分类号： G01F17/00

CPC分类号： A61M1/3639 ,  A61M1/14 ,  A61M2205/3569 ,  A61M2205/3592

摘要： A sensor system for dialysis applications includes a plurality of pressure sensors, wherein each pressure sensor can be provided as an LC type sensor, and/or an RLC type sensor. Each sensor among the plurality of pressure sensors can be inductively coupled with a respective antenna among a plurality of antennas for the wireless transmission of pressure data. A dialysis machine is generally connected to the plurality of antennas, wherein the plurality of pressure sensors monitors pressure during operation of the dialysis machine to generate pressure data that is wirelessly transmitted to at least one antenna among the plurality of antennas.

摘要翻译： 用于透析应用的传感器系统包括多个压力传感器，其中每个压力传感器可以被提供为LC型传感器和/或RLC型传感器。 多个压力传感器中的每个传感器可以与多个天线中的相应天线感应耦合，用于压力数据的无线传输。 透析机通常连接到多个天线，其中多个压力传感器在透析机的操作期间监测压力，以产生无线传输到多个天线中的至少一个天线的压力数据。

公开(公告)号：US07193300B2

公开(公告)日：2007-03-20

申请号：US10939658

申请日：2004-09-13

申请人： Stephen R. Shiffer

发明人： Stephen R. Shiffer

IPC分类号： H01L23/495 ,  H01L23/04 ,  H05K7/00 ,  H05K1/14 ,  H01B17/20

CPC分类号： H05K3/301 ,  H01L23/49861 ,  H01L2924/0002 ,  H01R12/52 ,  H01R12/585 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/308 ,  H05K2201/10325 ,  H05K2201/10598 ,  H01L2924/00

摘要： Packaging assembly method and systems include the use of a plastic substrate and one or more compliant fasteners, which can be connected to the plastic substrate, such that the compliant fastener provides an electrical connection to one or more electrical components. A plastic leadframe can therefore be formed, which is based upon the plastic substrate and the compliant fastener for attachment to other electrical components. The plastic substrate itself can function as a plastic trace or plastic substrate trace, and can be formed from plastic material such as thermoplastic or a thermoset material. The compliant fastener itself can be pushed into the plastic substrate at a connection point thereof for attachment of the compliant fastener to the plastic substrate. The connection point can be formed in the plastic substrate as one or more round holes, slots, rectangular holes or complex shapes. An interface is therefore for med between the plastic trace and the compliant fastener.

摘要翻译： 包装组装方法和系统包括使用塑料基材和一个或多个柔性紧固件，其可以连接到塑料基材上，使得柔性紧固件提供与一个或多个电气部件的电连接。 因此，可以形成塑料引线框架，该引线框架基于塑料基板和用于附接到其他电气部件的柔性紧固件。 塑料基板本身可以用作塑料痕迹或塑料基板迹线，并且可以由诸如热塑性材料或热固性材料的塑料材料形成。 顺应性紧固件本身可以在其连接点处被推入塑料基板中，以将柔性紧固件附接到塑料基板。 连接点可以在塑料基板中形成为一个或多个圆孔，狭槽，矩形孔或复杂形状。 因此，界面在塑料痕迹和柔顺紧固件之间。