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    Printed circuit board having signal line isolation patterns for decreasing WWAN noise
    1.
    发明授权
    Printed circuit board having signal line isolation patterns for decreasing WWAN noise 有权
    具有信号线隔离模式的印刷电路板，用于减少WWAN噪声

    公开(公告)号：US07969255B2

    公开(公告)日：2011-06-28

    申请号：US12265167

    申请日：2008-11-05

    申请人： Sung Young Kim ,  Jin Woo Lee

    发明人： Sung Young Kim ,  Jin Woo Lee

    IPC分类号： H01P3/08

    CPC分类号： H05K1/0219 ,  H05K1/0245 ,  H05K3/4623 ,  H05K2201/09236 ,  H05K2201/09536 ,  H05K2201/09672

    摘要： A printed circuit board (PCB) capable of decreasing wireless wide area network (WWAN) noise generated due to internal signal interference occurring in the PCB is disclosed. The PCB printed circuit board includes a first layer, a second layer, and at least one insulating layer formed between the first and second layers. The PCB board further includes a first signal line group disposed on the first layer while including a plurality of first signal lines each supplying a first signal, isolation patterns disposed on the first layer such that the isolation patterns are arranged between adjacent ones of the first signal lines, respectively, to prevent the adjacent first signal lines from interfering with each other, and a second signal line group disposed on the second layer while including a plurality of second signal lines each supplying a second signal different from the first signal. The second signal line group corresponds to the isolation patterns.

    摘要翻译： 公开了能够减少由于PCB内部信号干扰而产生的无线广域网（WWAN）噪声的印刷电路板（PCB）。 PCB印刷电路板包括第一层，第二层和形成在第一层和第二层之间的至少一个绝缘层。 PCB板还包括设置在第一层上的第一信号线组，同时包括多个提供第一信号的第一信号线，设置在第一层上的隔离图案，使得隔离图案布置在相邻的第一信号之间 线路，以防止相邻的第一信号线彼此干扰;以及第二信号线组，其布置在第二层上，同时包括多个第二信号线，每个第二信号线提供与第一信号不同的第二信号。 第二信号线组对应于隔离模式。

    Printed circuit board and manufacturing method thereof
    2.
    发明授权
    Printed circuit board and manufacturing method thereof 有权
    印刷电路板及其制造方法

    公开(公告)号：US08058558B2

    公开(公告)日：2011-11-15

    申请号：US11984115

    申请日：2007-11-13

    申请人： Jee-Soo Mok ,  Dong-Jin Park ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Young Kim

    发明人： Jee-Soo Mok ,  Dong-Jin Park ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Young Kim

    IPC分类号： H05K1/00 ,  H05K7/06

    CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2203/0554 ,  Y10T29/49155

    摘要： A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

    摘要翻译： 公开了印刷电路板及其制造方法。 使用制造印刷电路板的方法，其包括在第一板上形成包括焊盘的电路图案; 在第一板的焊盘上形成焊膏; 并且在所述第一板的表面上堆叠绝缘体，使得所述焊膏凸块穿过形成所述焊膏以覆盖所述第一板的焊盘的所述绝缘体，所述焊盘的区域可以被减小以制造印刷电路板 高密度，并且由于焊盘和焊膏之间的接触面积的增加可以提高接触可靠性，以提高高密度印刷电路板的性能。

    PRINTED CIRCUIT BOARD FOR DECREASING WIRELESS WIDE AREA NETWORK NOISE
    3.
    发明申请
    PRINTED CIRCUIT BOARD FOR DECREASING WIRELESS WIDE AREA NETWORK NOISE 有权
    印刷电路板，用于减少无线宽带网络噪声

    公开(公告)号：US20090267702A1

    公开(公告)日：2009-10-29

    申请号：US12265167

    申请日：2008-11-05

    申请人： Sung Young Kim ,  Jin Woo Lee

    发明人： Sung Young Kim ,  Jin Woo Lee

    IPC分类号： H01P5/00

    CPC分类号： H05K1/0219 ,  H05K1/0245 ,  H05K3/4623 ,  H05K2201/09236 ,  H05K2201/09536 ,  H05K2201/09672

    摘要： A printed circuit board (PCB) capable of decreasing wireless wide area network (WWAN) noise generated due to internal signal interference occurring in the PCB is disclosed. The PCB printed circuit board includes a first layer, a second layer, and at least one insulating layer formed between the first and second layers. The PCB board further includes a first signal line group disposed on the first layer while including a plurality of first signal lines each supplying a first signal, isolation patterns disposed on the first layer such that the isolation patterns are arranged between adjacent ones of the first signal lines, respectively, to prevent the adjacent first signal lines from interfering with each other, and a second signal line group disposed on the second layer while including a plurality of second signal lines each supplying a second signal different from the first signal. The second signal line group corresponds to the isolation patterns.

    摘要翻译： 公开了能够减少由于PCB内部信号干扰而产生的无线广域网（WWAN）噪声的印刷电路板（PCB）。 PCB印刷电路板包括第一层，第二层和形成在第一层和第二层之间的至少一个绝缘层。 PCB板还包括设置在第一层上的第一信号线组，同时包括多个提供第一信号的第一信号线，设置在第一层上的隔离图案，使得隔离图案布置在相邻的第一信号之间 线路，以防止相邻的第一信号线彼此干扰;以及第二信号线组，其布置在第二层上，同时包括多个第二信号线，每个第二信号线提供与第一信号不同的第二信号。 第二信号线组对应于隔离模式。

    Method for controlling voltage of DC link for electric vehicle
    4.
    发明授权
    Method for controlling voltage of DC link for electric vehicle 有权
    电动汽车直流母线电压控制方法

    公开(公告)号：US07528566B2

    公开(公告)日：2009-05-05

    申请号：US11300161

    申请日：2005-12-13

    申请人： Hong Seok Song ,  Doo Yong Oh ,  Kwang Hee Nam ,  Sung Young Kim

    发明人： Hong Seok Song ,  Doo Yong Oh ,  Kwang Hee Nam ,  Sung Young Kim

    IPC分类号： H02P6/08

    CPC分类号： H02P23/07

    摘要： Disclosed is a method for controlling a voltage of a DC link for an electric vehicle, which can reduce a capacitance of the DC link interposed between an inverter and a DC/DC converter.The method for controlling the voltage of the DC link in a power system of a vehicle including a battery, a DC/DC converter, the DC link, an inverter, a motor, and a control part controlling the DC/DC converter and the inverter includes the steps of installing a compensator in a control loop of the control part such that a DC link current of the DC/DC converter follows a DC link current of the inverter, calculating a predetermined compensation term based on information of the motor inputted into the compensator, and applying the compensation term to a voltage node in the control loop of the control part in the compensator.

    摘要翻译： 公开了一种用于控制用于电动车辆的DC链路的电压的方法，其可以减少插入在逆变器和DC / DC转换器之间的DC链路的电容。 用于控制包括电池，DC / DC转换器，DC链路，逆变器，电动机以及控制DC / DC转换器和逆变器的控制部分的车辆的电力系统中的DC链路的电压的方法 包括在控制部的控制回路中安装补偿器的步骤，使得DC / DC转换器的DC链路电流遵循逆变器的直流链路电流，基于输入到所述控制部的电动机的信息计算预定的补偿项 补偿器，并将补偿项施加到补偿器中控制部分的控制回路中的电压节点。

    Printed circuit board and manufacturing method thereof
    5.
    发明申请
    Printed circuit board and manufacturing method thereof 有权
    印刷电路板及其制造方法

    公开(公告)号：US20080115961A1

    公开(公告)日：2008-05-22

    申请号：US11984115

    申请日：2007-11-13

    申请人： Jee-Soo Mok ,  Dong-Jin Park ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Young Kim

    发明人： Jee-Soo Mok ,  Dong-Jin Park ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Young Kim

    IPC分类号： H05K1/00 ,  H05K3/10 ,  H05K7/06

    CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2203/0554 ,  Y10T29/49155

    摘要： A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

    摘要翻译： 公开了印刷电路板及其制造方法。 使用制造印刷电路板的方法，其包括在第一板上形成包括焊盘的电路图案; 在第一板的焊盘上形成焊膏; 并且在所述第一板的表面上堆叠绝缘体，使得所述焊膏凸块穿过形成所述焊膏以覆盖所述第一板的焊盘的所述绝缘体，所述焊盘的区域可以被减小以制造印刷电路板 高密度，并且由于焊盘和焊膏之间的接触面积的增加可以提高接触可靠性，以提高高密度印刷电路板的性能。