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公开(公告)号:US11079318B2
公开(公告)日:2021-08-03
申请号:US16081953
申请日:2017-03-09
Inventor: Yael Nemirovsky , Amikam Nemirovsky
Abstract: There is provided a gas sensing device for sensing a certain gas that is associated with a certain spectral band, the gas sensing device may include a passive gas sensor that is configured to generate passive gas sensor detection signals that are responsive to the certain spectral band; a passive dummy sensor that is configured to generate passive dummy sensor detection signals that are indifferent to the certain spectral hand; and at least one circuit that is configured to detect a presence or absence of the certain gas within a certain volume that is located within the fields of view of the passive gas sensor and the passive dummy sensor based on a comparison between the passive gas sensor detection signals and the passive dummy sensor detection signals.
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2.
公开(公告)号:US20190011415A1
公开(公告)日:2019-01-10
申请号:US15748723
申请日:2016-08-01
Inventor: Yael Nemirovsky , Amikam NEMIROVSKY , Shmuel Melman
CPC classification number: G01N33/0031 , G01N25/30 , G01N33/0027
Abstract: A gas sensing device that includes a (a) gas reactive element that has a gas dependent temperature parameter; and (b) a semiconductor temperature sensing element that is spaced apart from the gas reactive element and is configured to sense radiation emitted from the gas reactive element and generate detection signals that are responsive to a temperature of the gas reactive element; wherein the gas reactive element and the semiconductor temperature sensing element are of microscopic scale.
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公开(公告)号:US11585773B2
公开(公告)日:2023-02-21
申请号:US16580120
申请日:2019-09-24
Inventor: Yael Nemirovsky
Abstract: A gas sensing device, comprising a bulk and an array of gas sensing elements that are thermally isolated from the bulk, wherein each gas sensing element of a plurality of gas sensing elements of the array comprises (i) a gas reactive element that has a gas dependent temperature parameter; (ii) a semiconductor temperature sensing element that is thermally coupled to the gas reactive element and is configured to generate detection signals that are responsive to a temperature of the gas reactive element; and (iii) multiple heating elements that are configured to heat the gas reactive element to at least one predefined temperature.
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公开(公告)号:US20200212840A1
公开(公告)日:2020-07-02
申请号:US16500129
申请日:2018-03-29
Inventor: Carmel ROTSCHILD
Abstract: Methods and systems convert combustion products to electricity, by efficiently coupling between photovoltaic cells with photons. The photons are emitted from a burning process of a photoluminescence material, the burning process including the chemical reaction of combustion.
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公开(公告)号:US20190207053A1
公开(公告)日:2019-07-04
申请号:US16231947
申请日:2018-12-25
Inventor: Yael NEMIROVSKY , Amikam NEMIROVSKY
IPC: H01L31/18 , H01L31/09 , H01L31/0232 , H01L31/0203 , H01L21/3065 , G01J5/02
Abstract: A method for manufacturing a thermal sensor, the method may include forming, using ion etching, one or more first holes that pass through (a) an initial layer, (a) a first oxide layer, (c) a first semiconductor substrate; filling the one or more first holes with oxide to form supporting elements; fabricating one or more thermal semiconductor sensing elements; forming one or more second holes in the one or more upper layers and the first oxide layer; applying an isotropic etching process to remove the first semiconductor substrate and expose the supporting elements to provide a suspended first oxide layer.
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公开(公告)号:US10811556B2
公开(公告)日:2020-10-20
申请号:US16231947
申请日:2018-12-25
Inventor: Yael Nemirovsky , Amikam Nemirovsky
IPC: H01L31/09 , H01L31/18 , H01L31/0232 , H01L31/0203 , G01J5/02 , H01L21/3065 , G01J5/04 , G01J5/08 , G01J5/20 , G01J5/00
Abstract: A method for manufacturing a thermal sensor, the method may include forming, using ion etching, one or more first holes that pass through (a) an initial layer, (a) a first oxide layer, (c) a first semiconductor substrate; filling the one or more first holes with oxide to form supporting elements; fabricating one or more thermal semiconductor sensing elements; forming one or more second holes in the one or more upper layers and the first oxide layer; applying an isotropic etching process to remove the first semiconductor substrate and expose the supporting elements to provide a suspended first oxide layer.
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公开(公告)号:US20200088664A1
公开(公告)日:2020-03-19
申请号:US16580120
申请日:2019-09-24
Inventor: Yael Nemirovsky
Abstract: A gas sensing device, comprising a bulk and an array of gas sensing elements that are thermally isolated from the bulk, wherein each gas sensing element of a plurality of gas sensing elements of the array comprises (i) a gas reactive element that has a gas dependent temperature parameter; (ii) a semiconductor temperature sensing element that is thermally coupled to the gas reactive element and is configured to generate detection signals that are responsive to a temperature of the gas reactive element; and (iii) multiple heating elements that are configured to heat the gas reactive element to at least one predefined temperature.
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8.
公开(公告)号:US20190091169A1
公开(公告)日:2019-03-28
申请号:US16003559
申请日:2018-06-08
Inventor: Yoav D. LIVNEY , Yehuda G. ASSARAF , Alina SHAPIRA
Abstract: Casein particles, such as micelles or clusters thereof having encapsulated therein hydrophobic and/or water insoluble therapeutically active agents such as hydrophobic chemotherapeutic agents, which are otherwise administered parenterally, are disclosed. Pharmaceutical compositions containing the casein particles and uses thereof in the treatment of cancer and other conditions treatable by the encapsulated therapeutically active agent are also disclosed. Further disclosed are processes of preparing the casein particles. The disclosed casein particles are useful for orally delivering the therapeutically active encapsulated therein and can further be used for controllably releasing the agents in the gastrointestinal tract.
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公开(公告)号:US20170205366A1
公开(公告)日:2017-07-20
申请号:US15312655
申请日:2015-05-19
Inventor: YAEL NEMIROVSKY
CPC classification number: G01N25/20 , G01K7/01 , G01K7/015 , G01N25/30 , G01N27/16 , G01N33/0031 , H01L21/764
Abstract: A method and a gas sensing device are provided. The gas sensing device may include a bulk and an array of gas sensing elements that are thermally isolated from the bulk, wherein each gas sensing element of a plurality of gas sensing elements of the array comprises (i) a gas reactive element that has a gas dependent temperature parameter; and (ii) a semiconductor temperature sensing element that is thermally coupled to the gas reactive element and is configured to generate detection signals that are responsive to a temperature of the gas reactive element.
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