公开(公告)号：US20130193464A1

公开(公告)日：2013-08-01

申请号：US13732628

申请日：2013-01-02

申请人： Seok Hun BAE ,  Seok Beom CHOI ,  Pil Geun KANG ,  Deok Ki HWANG ,  Young Ju HAN ,  Hee Seok CHOI ,  Young Rok PARK ,  Tae Don LEE ,  Hyun Sung OH ,  Jee Hue JOO ,  Dong Woo KANG ,  Sung Sig KIM

发明人： Seok Hun BAE ,  Seok Beom CHOI ,  Pil Geun KANG ,  Deok Ki HWANG ,  Young Ju HAN ,  Hee Seok CHOI ,  Young Rok PARK ,  Tae Don LEE ,  Hyun Sung OH ,  Jee Hue JOO ,  Dong Woo KANG ,  Sung Sig KIM

IPC分类号： H01L33/40

CPC分类号： H01L33/405 ,  H01L33/20 ,  H01L33/382 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2924/01322 ,  H01L2924/1301 ,  H01L2924/00

摘要： Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes.

摘要翻译： 公开了发光器件，发光器件封装和发光模块。 发光器件包括发光结构，其包括第一导电半导体层，第二导电半导体层和在第一和第二导电半导体层之间的有源层; 在发光结构下的支撑构件; 在所述第二导电半导体层和所述支撑构件之间的反射电极层; 以及在支撑构件中彼此间隔开的第一至第三连接电极。 第二连接电极设置在第一和第三连接电极之间，第一和第三连接电极彼此电连接，并且支撑构件设置在第一至第三连接电极的周边部分。