Abstract:
A walking beam type heat treatment apparatus including a heating furnace having a heating body to heat a substrate by radiation, a pair of first beams that are rod-like and provided in the heating furnace and a second beam disposed between the pair of the first beams, one of the pair of the first beams and the second beam relatively moving alternately in longitudinal and vertical directions repeatedly to the other of the pair of the first beams and the second beam, to cause to deliver and receive the substrate between the pair of the first beams and the second beam, and accordingly, to convey the substrate through the heating furnace, includes a side edge support protrusion that protrudes from each of the pair of the first beams such that the side edge support protrusion can horizontally support the substrate in abutting contact with a side edge of the substrate; and a front edge support protrusion and a rear edge support protrusion that protrude from the second beam such that the front edge support protrusion and the rear edge support protrusion can horizontally support the substrate in abutting contact with a front edge and a rear edge of the substrate.
Abstract:
The present invention provides compounds having in their molecule a structure contributing to high hydrophilicity, and having high photopolymerizability, as well as polymers of such compounds, and a method for producing the compound. The compounds are diol (meth)acrylate having a urethane bond represented by the formula (1), and cyclic ketal (meth)acrylate having a urethane bond represented by the formula (2): (R1: H, —CH3; R2: —(CH2)n-; R3: —(CH2)m-; n: 1-4; m: 1-8; (AO): C2-C4 oxyalkylene group; x: 0-1000; R4, R5: H, —CH3, —C2H5).
Abstract:
A lead frame having a die pad of such a shape that prevents scattering of solder to lead when a chip is mounted on the lead frame, and a semiconductor device using such a lead frame are provided. The lead frame includes a die pad having a region surrounded by a first side, a second side opposing to the first side, a third side different from the first and second sides, and a fourth side opposing to the third side, and a lead formed of a conductor and electrically connected to a semiconductor element. The die pad includes a notch extending along the first and the second sides and positioned opposing to a main surface of the semiconductor element, and a through hole extending along the third and fourth sides and positioned opposing to the main surface of the semiconductor element. The semiconductor device employs the die pad.
Abstract:
An ignition element for use in igniting a high-frequency plasma torch is ungrounded and displaceable. When a tip end of the ignition element is positioned in a location in a gas to be formed into a plasma, which flows under normal pressure, and a high-frequency energy is applied to the above location in the gas flow, the gas is ignited into a high-temperature plasma in a small period of time shorter than 1 second. After the gas has been ignited, the ignition element is immediately retracted out of the location. The ignition element may be in the form of an ignition rod of metal or an ignition tube of quartz or the like. Where the ignition rod is used, it instantaneously contacts the high-temperature plasma upon ignition so that the high-temperature plasma is of high purity consisting only of the component of the gas. The ignition tube may be used for producing a high-temperature plasma of higher purity on and after ignition. The ignition tube is employed while a pressure therein is reduced. A glow discharge is generated in the ignition tube of the reduced pressure by applying the high-frequency energy, and the gas flowing outside of the tube is ignited by the glow discharge into a plasma.
Abstract:
A fixed attenuator for microwave band comprising of a dielectric substrate, with a resistance film and a conductor film attached on said substrate so as to form an attenuation circuit. The substrate further comprises of at least one hole provided through the dielectric substrate. The attenuator is mounted on a metallic board or a printed circuit board by a screw inserted in said hole. Thus, the cooling effect of the resistance film has been improved while keeping the low manufacturing cost and stable structure, by fixing the dielectric substrate on a metallic board by screws inserted in the mentioned holes.
Abstract:
A walking beam type heat treatment apparatus including a heating furnace having a heating body to heat a substrate by radiation, a pair of first beams that are rod-like and provided in the heating furnace and a second beam disposed between the pair of the first beams, one of the pair of the first beams and the second beam relatively moving alternately in longitudinal and vertical directions repeatedly to the other of the pair of the first beams and the second beam, to cause to deliver and receive the substrate between the pair of the first beams and the second beam, and accordingly, to convey the substrate through the heating furnace, includes a side edge support protrusion that protrudes from each of the pair of the first beams such that the side edge support protrusion can horizontally support the substrate in abutting contact with a side edge of the substrate; and a front edge support protrusion and a rear edge support protrusion that protrude from the second beam such that the front edge support protrusion and the rear edge support protrusion can horizontally support the substrate in abutting contact with a front edge and a rear edge of the substrate.
Abstract:
The present invention provides compounds having in their molecule a structure contributing to high hydrophilicity, and having high photopolymerizability, as well as polymers of such compounds, and a method for producing the compound. The compounds are diol (meth)acrylate having a urethane bond represented by the formula (1), and cyclic ketal (meth)acrylate having a urethane bond represented by the formula (2): (R1: H, —CH3; R2: —(CH2)n—; R3: —(CH2)m—; n: 1-4; m: 1-8; (AO): C2-C4 oxyalkylene group; x: 0-1000; R4, R5: H, —CH3, —C2H5).
Abstract:
The present invention provides compounds having in their molecule a structure contributing to high hydrophilicity, and having high photopolymerizability, as well as polymers of such compounds, and a method for producing the compound. The compounds are diol (meth)acrylate having a urethane bond represented by the formula (1), and cyclic ketal (meth)acrylate having a urethane bond represented by the formula (2): (R1: H, —CH3; R2: —(CH2)n-; R3: —(CH2)m-; n: 1-4; m: 1-8; (AO): C2-C4 oxyalkylene group; x: 0-1000; R4, R5: H, —CH3, —C2H5).
Abstract:
An enlarging unit comprises a concave Fresnel lens warped convexly toward an image forming unit side, the image forming unit is held between a light transmissible support plate warped convexly toward the image forming unit side and the enlarging unit warped convexly toward the image forming unit side, and peripheries of the support plate and the enlarging unit are fixed or semi-fixed. Thereby, deformation caused when the incident side and emission side micro-lens arrays are molded and deformation due to environmental temperature and humidity change are corrected, and both components are always maintained in close contact.
Abstract:
A quaternary ammonium salt of the formula: ##SPC1## ##EQU1## wherein A is a lower alkylene, a lower alkenylene or a lower alkadienylene; R.sub.1 and R.sub.2 are each lower alkyl which may be linked together directly or by an oxygen atom to form a saturated heterocyclic group; R.sub.3 is a lower alkyl, a halo (lower) alkyl, a lower alkynyl, phenyl (lower) alkyl which may have one or more halogen atoms as substituents on the phenyl ring, a lower alkenyl, a hydroxy (lower) alkyl, a carboxy (lower) alkyl or a lower alkenyloxycarbonyl (lower) alkyl; R.sub.4, R.sub.5 and R.sub.6 are each lower alkyl having 1 to 3 carbon atoms; X is an acid residue; and wherein the cyclohexyl ring may have one double bond, with the proviso that when the cyclohexyl ring has one double bond in the 1,2 position, A may not be ##EQU2## when X.sup.- is iodide, R.sub.4, R.sub.5 and R.sub.6 are all methyl; R.sub.1, R.sub.2 and R.sub.3 are all methyl or all ethyl, or R.sub.1 is methyl, R.sub.2 is ethyl and R.sub.3 is phenylisopropyl or isoamyl with the further proviso that when the double bond in the cyclohexyl ring is in the 2,3 position, A may not be ##EQU3## when X.sup.- is iodide, and R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are all methyl.