公开(公告)号：US07262507B2

公开(公告)日：2007-08-28

申请号：US11020132

申请日：2004-12-27

申请人： Shigekazu Hino ,  Takashi Magoi ,  Syunichi Iwanaga

发明人： Shigekazu Hino ,  Takashi Magoi ,  Syunichi Iwanaga

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/01078 ,  H01L2924/18161 ,  H01L2924/00012

摘要： Semiconductor-mounted device comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and sealing resin sealing, with a same height, a region disposed at and around first semiconductor chip and opposite, across wired board, to at least an area of projecting electrodes of second semiconductor chip; and a producing method thereof. Semiconductor-mounted device also comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and resin sheet covering, at substantially a same height as first semiconductor chip, a region disposed around first semiconductor chip and opposite, across wired board, to at least an area of projecting electrodes of second semiconductor chip, back surface of first semiconductor chip being exposed; and a producing method thereof.

摘要翻译： 半导体安装器件包括布线板，安装在布线板第一面上的第一半导体芯片，安装在布线板第二面上的第二半导体芯片和具有相同高度的密封树脂密封，设置在第一半导体芯片周围和周围的区域， 穿过有线电路板至少到第二半导体芯片的突出电极的区域; 及其制造方法。 半导体安装器件还包括布线板，安装在布线板第一面上的第一半导体芯片，安装在布线板第二面上的第二半导体芯片和与第一半导体芯片基本相同的高度的树脂片材覆盖层， 半导体芯片，并且穿过布线板相对于第二半导体芯片的至少一个突出电极的区域，第一半导体芯片的背面被暴露; 及其制造方法。

公开(公告)号：US20080197437A1

公开(公告)日：2008-08-21

申请号：US12068927

申请日：2008-02-13

申请人： Tomonobu Sugimoto ,  Takashi Magoi

发明人： Tomonobu Sugimoto ,  Takashi Magoi

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L31/0203 ,  G06K9/00026 ,  G06K9/00973 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a solid-state imaging apparatus having excellent reading accuracy. The solid-state imaging apparatus of the present invention includes a solid-state imaging element (light receiving element portion) (1a) of a solid-state imaging element chip (1) mounted on a film (11), and a resin (2b) having fluidity between the solid-state imaging element chip (1) and the film (11), in which the periphery of the resin having the fluidity is sealed with solid-state resins (2a, 14, etc.) that are said to be sealing members. The resin (2b) having the fluidity eliminates an adverse influence on reading due to waviness on the film surface, and realizes the solid-state imaging apparatus having the excellent reading accuracy.

摘要翻译： 提供了具有优异的读取精度的固态成像装置。 本发明的固态成像装置包括安装在膜（11）上的固体摄像元件芯片（1）的固态成像元件（受光元件部分）（1a）和树脂（ b）在固态成像元件芯片（1）和膜（11）之间具有流动性，其中具有流动性的树脂的周边用固态树脂（2a，14等）密封，其中 据说是密封件。 具有流动性的树脂（2b）消除了由于膜表面波纹引起的读数的不利影响，并且实现了具有优异读取精度的固态成像装置。

公开(公告)号：US20050146026A1

公开(公告)日：2005-07-07

申请号：US11020132

申请日：2004-12-27

申请人： Shigekazu Hino ,  Takashi Magoi ,  Syunichi Iwanaga

发明人： Shigekazu Hino ,  Takashi Magoi ,  Syunichi Iwanaga

IPC分类号： H01L21/50 ,  H01L21/60 ,  H01L23/02 ,  H01L23/12 ,  H01L23/28 ,  H01L25/04 ,  H01L25/065 ,  H01L25/18

CPC分类号： H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/01078 ,  H01L2924/18161 ,  H01L2924/00012

摘要： Semiconductor-mounted device comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and sealing resin sealing, with a same height, a region disposed at and around first semiconductor chip and opposite, across wired board, to at least an area of projecting electrodes of second semiconductor chip; and a producing method thereof. Semiconductor-mounted device also comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and resin sheet covering, at substantially a same height as first semiconductor chip, a region disposed around first semiconductor chip and opposite, across wired board, to at least an area of projecting electrodes of second semiconductor chip, back surface of first semiconductor chip being exposed; and a producing method thereof.

摘要翻译： 半导体安装器件包括布线板，安装在布线板第一面上的第一半导体芯片，安装在布线板第二面上的第二半导体芯片和具有相同高度的密封树脂密封，设置在第一半导体芯片周围和周围的区域， 穿过有线电路板至少到第二半导体芯片的突出电极的区域; 及其制造方法。 半导体装置还包括布线板，安装在布线板第一面上的第一半导体芯片，安装在布线板第二面上的第二半导体芯片和与第一半导体芯片基本相同的高度的树脂片材覆盖物， 半导体芯片，并且穿过布线板相对于第二半导体芯片的至少一个突出电极的区域，第一半导体芯片的背面露出; 及其制造方法。

公开(公告)号：US06396203B1

公开(公告)日：2002-05-28

申请号：US09116595

申请日：1998-07-16

申请人： Nobumitsu Aibara ,  Akira Shishido ,  Takashi Magoi ,  Tadayuki Nishimura

发明人： Nobumitsu Aibara ,  Akira Shishido ,  Takashi Magoi ,  Tadayuki Nishimura

IPC分类号： H01J2980

CPC分类号： H01J29/073 ,  H01J2229/0716 ,  H01J2229/0722

摘要： A color shadow mask assembly includes a shadow mask spaced apart from an inner surface of a face panel by a predetermined gap and having a curved surface, and a rectangular frame for supporting and fixing the shadow mask. The shadow mask and the frame are integrally formed by welding to fix a side wall of the frame to a skirt of the face panel. The skirt alternately overlaps inner and outer surfaces of the side wall of the frame at opposite surfaces between the skirt of the shadow mask and the side wall of the frame.

摘要翻译： 彩色阴影掩模组件包括荫罩，其与面板的内表面间隔开预定间隙并具有弯曲表面，以及用于支撑和固定荫罩的矩形框架。 荫罩和框架通过焊接一体地形成，以将框架的侧壁固定到面板的裙部。 裙部在荫罩的裙部和框架的侧壁之间的相对表面处交替地重叠框架的侧壁的内表面和外表面。