公开(公告)号：US20080197437A1

公开(公告)日：2008-08-21

申请号：US12068927

申请日：2008-02-13

申请人： Tomonobu Sugimoto ,  Takashi Magoi

发明人： Tomonobu Sugimoto ,  Takashi Magoi

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L31/0203 ,  G06K9/00026 ,  G06K9/00973 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a solid-state imaging apparatus having excellent reading accuracy. The solid-state imaging apparatus of the present invention includes a solid-state imaging element (light receiving element portion) (1a) of a solid-state imaging element chip (1) mounted on a film (11), and a resin (2b) having fluidity between the solid-state imaging element chip (1) and the film (11), in which the periphery of the resin having the fluidity is sealed with solid-state resins (2a, 14, etc.) that are said to be sealing members. The resin (2b) having the fluidity eliminates an adverse influence on reading due to waviness on the film surface, and realizes the solid-state imaging apparatus having the excellent reading accuracy.

摘要翻译： 提供了具有优异的读取精度的固态成像装置。 本发明的固态成像装置包括安装在膜（11）上的固体摄像元件芯片（1）的固态成像元件（受光元件部分）（1a）和树脂（ b）在固态成像元件芯片（1）和膜（11）之间具有流动性，其中具有流动性的树脂的周边用固态树脂（2a，14等）密封，其中 据说是密封件。 具有流动性的树脂（2b）消除了由于膜表面波纹引起的读数的不利影响，并且实现了具有优异读取精度的固态成像装置。

公开(公告)号：US06794762B2

公开(公告)日：2004-09-21

申请号：US10368461

申请日：2003-02-20

申请人： Gorou Ikegami ,  Tomonobu Sugimoto

发明人： Gorou Ikegami ,  Tomonobu Sugimoto

IPC分类号： H01L2328

CPC分类号： H05K3/3442 ,  H01L21/561 ,  H01L23/051 ,  H01L23/4006 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/8547 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K2201/0367 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic component, in which an electronic element 9 fixed onto a first electrically conductive film 7 is electrically connected to second electrically conductive films 8 arranged in substantially the same plane as that of the first electrically conductive film 7 and the electronic element 9 including peripheries of the first and second electrically conductive films 7 and 8 is covered by an encapsulation resin portion 11, has electrically conductive protrusions 13 formed on an exposed surface of the first and second electrically conductive films exposed from the encapsulation resin portion 11.

摘要翻译： 电子部件，其中固定在第一导电膜7上的电子元件9电连接到布置在与第一导电膜7和电子元件9基本相同的平面上的第二导电膜8，电子元件9包括外围 第一和第二导电膜7和8被封装树脂部分11覆盖，在从封装树脂部分11露出的第一和第二导电膜的暴露表面上形成有导电突起13。