摘要:
An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs. Pressing an upper thermode onto the upper work surface of the connector/PCB assembly causes the work surface to rotate into alignment with the thermodes, and further causes the upper plate to descend until the bottom work surface of the connector/PCB assembly contacts the lower thermode prior to initiation of a reflow soldering cycle.
摘要:
A pressure regulator system for a pneumatically- or hydraulically-actuated weld head. The weld head includes a switching valve comprising several ports: an inflow port attached to a source of pressurized gas, preferably air; an exhaust port; a first line port; and a second line port. Two-way valves are provided on the first line port and the second line port. A valve sensor connected to a switch for determining weld force in the weld head is connected to means for simultaneously closing the first line port valve and the second line valve port when a desired weld force is attained between one or more electrodes and a workpiece, thereby maintaining a constant, maximum pressure in the cylinder and consequently maintaining the desired weld force between the electrode(s) and the workpiece during the welding operation.
摘要:
A pressure regulator system for a pneumatically- or hydraulically-actuated weld head. The weld head includes a switching valve comprising several ports: an inflow port attached to a source of pressurized gas, preferably air; an exhaust port; a first line port; and a second line port. Two-way valves are provided on the first line port and the second line port. A valve sensor connected to a switch for determining weld force in the weld head is connected to means for simultaneously closing the first line port valve and the second line valve port when a desired weld force is attained between one or more electrodes and a workpiece, thereby maintaining a constant, maximum pressure in the cylinder and consequently maintaining the desired weld force between the electrode(s) and the workpiece during the welding operation.
摘要:
An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs. Pressing an upper thermode onto the upper work surface of the connector/PCB assembly causes the work surface to rotate into alignment with the thermodes, and further causes the upper plate to descend until the bottom work surface of the connector/PCB assembly contacts the lower thermode prior to initiation of a reflow soldering cycle.