公开(公告)号：US07122587B2

公开(公告)日：2006-10-17

申请号：US10638337

申请日：2003-08-12

Applicant: Tarou Shimoda ,  Shoichi Osada ,  Hiroyuki Takenaka ,  Shingo Ando ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

Inventor： Tarou Shimoda ,  Shoichi Osada ,  Hiroyuki Takenaka ,  Shingo Ando ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC: C08K3/10 ,  C08K5/06 ,  H01L23/29

CPC classification number: H01L23/293 ,  C08K5/5399 ,  C08L63/00 ,  C08L85/02 ,  H01L2924/0002 ,  C08L2666/22 ,  H01L2924/00

Abstract: A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting point of 110–130° C., wherein a, b and n are numbers satisfying 0

Abstract translation: 作为必要成分的（A）环氧树脂，（B）固化剂，（C）无机填料和（D）平均成分式（1）的磷腈化合物，作为必要成分的阻燃性环氧树脂组合物， 其熔点为110-130℃，其中a，b和n为满足0

公开(公告)号：US06723452B2

公开(公告)日：2004-04-20

申请号：US10196222

申请日：2002-07-17

Applicant: Yasuo Kimura ,  Kazutoshi Tomiyoshi ,  Tarou Shimoda ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

Inventor： Yasuo Kimura ,  Kazutoshi Tomiyoshi ,  Tarou Shimoda ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

IPC: H01L2912

CPC classification number: H01L23/293 ,  C08G59/20 ,  C08G59/245 ,  C08G59/3218 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L2666/22 ,  H01L2924/00

Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

Abstract translation: 环氧树脂组合物，其包含（A）环氧当量至少为185的具有两个苯环可以直接键合的结构的环氧树脂，具有sp 2类型原子轨道的碳原子占至少50％ 所有碳原子，（B）β-萘酚型酚醛树脂固化剂，（C）固化促进剂，和（D）无机填料固化成使用无铅焊料和改善火焰时具有令人满意的耐焊料裂纹性的产品 尽管不存在卤化环氧树脂和锑化合物，因此适用于半导体封装。