公开(公告)号：US5866952A

公开(公告)日：1999-02-02

申请号：US565269

申请日：1995-11-30

申请人： Robert John Wojnarowski ,  Thomas Bent Gorczyca ,  Stanton Earl Weaver, Jr.

发明人： Robert John Wojnarowski ,  Thomas Bent Gorczyca ,  Stanton Earl Weaver, Jr.

IPC分类号： H01L25/18 ,  H01L21/98 ,  H01L23/538 ,  H01L25/04 ,  H01L23/29

CPC分类号： H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/295 ,  H01L23/4334 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/75 ,  H01L24/76 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2224/75315 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511

摘要： A high density interconnected multi-chip module is provided with a stress-reducing compliant material disposed around the chips prior to molding a polymeric substrate around the chips. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A compliant material is deposited around the chips, and then a mold form is positioned around the chips. Polymeric substrate molding material is added within the mold form, and then the substrate molding material is hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and faces of the chips. A thermal plug may be affixed to the backside of a chip prior to the addition of substrate molding material.

摘要翻译： 高密度互连多芯片模块在模制聚合物基片周围的芯片之前设置有围绕芯片布置的减小应力的材料。 具有接触垫的芯片面朝下放置在由基底支撑的粘合剂层上。 围绕芯片沉积顺应性材料，然后将模具形式定位在芯片周围。 在模具形式中加入聚合物基材模塑材料，然后将基材模塑材料硬化。 具有与预定接触焊盘对准的通路并具有穿过通孔延伸的电导体的通孔的电介质层位于硬化的基板模制材料和芯片的表面上。 在添加基底模制材料之前，可以将热塞固定到芯片的背面。