Abstract:
Communications connectors having a plurality of signal carrying paths include a printed circuit board and a plurality of contacts. The printed circuit board has a plurality of contact pads, a plurality of output terminals, and a plurality of conductive paths that electrically connect at least some of the plurality of contact pads to respective ones of the plurality of output terminals. The contacts each have a plug contact region. In these connectors, a first of the plurality of signal carrying paths extends from the plug contact region of a first of the plurality of contacts to a first of the plurality of output terminals through a first of the contact pads and a first of the conductive paths.
Abstract:
Communications connectors that include parasitic conductive loops are provided, such as a wire connection system that includes a first pair of wire connection terminals mounted in a mounting substrate, a second pair of wire connection terminals mounted in a mounting substrate and a parasitic conductive loop mounted adjacent at least the first pair of wire connection terminals.
Abstract:
A telecommunications connector includes first and second pairs of electrical conductors. The first and second pairs of conductors are arranged in one region of the connector such that one conductor of the first pair is selectively positioned to be closer to both of the conductors of the second pair than is the other conductor of the first pair, and such that the one conductor of the first pair couples a common mode signal of a first polarity onto the conductors of the second pair. In another region of the connector the other conductor of the first pair is selectively positioned to be closer to both of the conductors of the second pair to asymmetrically couple a common mode signal of a second polarity onto the conductors of the second pair.
Abstract:
Structures and methods that provide for via transitions between opposite sides of a high resistivity silicon micro-machined membrane substrate. The via transitions provide ground-signal-ground interconnection between coplanar waveguides disposed on opposite sides of substrate. Adjacent via transitions are anisotropically etched from opposite surfaces of the substrate to form the via transitions. The ground-signal-ground configuration provides RF impedance matching at the via transition.
Abstract:
A bracket for use with metal construction framing which is a generally planar construct having a first outer flange and a second outer flange, configured to form a recess between such flanges suitable to engage at least one face of a metal construction stud and to interlock with the stud via at least two non-longitudinal tabs.
Abstract:
Communications connectors having a plurality of signal carrying paths include a printed circuit board and a plurality of contacts. The printed circuit board has a plurality of contact pads, a plurality of output terminals, and a plurality of conductive paths that electrically connect at least some of the plurality of contact pads to respective ones of the plurality of output terminals. The contacts each have a plug contact region. In these connectors, a first of the plurality of signal carrying paths extends from the plug contact region of a first of the plurality of contacts to a first of the plurality of output terminals through a first of the contact pads and a first of the conductive paths.