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公开(公告)号:US06287983B1
公开(公告)日:2001-09-11
申请号:US09213143
申请日:1998-12-18
IPC分类号: H01L21302
摘要: A nitride wet etch in which liquid TEOS is flowed directly into the hot phosphoric acid bath before wafer etching begins. This preloads the bath chemistry with silicate ions, and thus helps assure very high selectivity to silicon oxides.
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公开(公告)号:US20080083609A1
公开(公告)日:2008-04-10
申请号:US11867342
申请日:2007-10-04
申请人: Shou-Qian Shao , Jack Jerome Schuss , John Thomas Summerson , William M. Holber , Thomas M. Parrill
发明人: Shou-Qian Shao , Jack Jerome Schuss , John Thomas Summerson , William M. Holber , Thomas M. Parrill
IPC分类号: H05H1/24
CPC分类号: H01J37/32862 , H01J37/32357
摘要: Methods and apparatus for operating plasmas are described. The vessel receives an oxygen containing plasma to clean and/or condition the vessel. Some embodiments of the invention feature methods and apparatus for improving ignition properties of the plasmas.
摘要翻译: 描述了操作等离子体的方法和装置。 容器接收含氧等离子体以清洁和/或调节容器。 本发明的一些实施方案的特征在于改进等离子体的点燃性能的方法和装置。
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公开(公告)号:US06228741B1
公开(公告)日:2001-05-08
申请号:US09228583
申请日:1999-01-11
申请人: Shawn T. Walsh , John E. Campbell , James B. Friedmann , Thomas M. Parrill , Der'E Jan , Joshua J. Robbins , Byron T. Ahlburn , Sue Ellen Crank
发明人: Shawn T. Walsh , John E. Campbell , James B. Friedmann , Thomas M. Parrill , Der'E Jan , Joshua J. Robbins , Byron T. Ahlburn , Sue Ellen Crank
IPC分类号: H01L2176
CPC分类号: H01L21/02063 , H01L21/02164 , H01L21/02211 , H01L21/02274 , H01L21/02304 , H01L21/31051 , H01L21/31116 , H01L21/31612 , H01L21/3185 , H01L21/76224 , H01L21/76232
摘要: A method is given for removing excess oxide from active areas after shallow trench isolation, without the use of chemical-mechanical polishing. A nitride mask protects active areas during the etch of isolation trenches. The trenches are filled with oxide, using high density plasma deposition, which simultaneously etches, providing a sloping contour around the isolation trenches. A further layer of nitride is used to provide a cap over the trench which seals to the underlying layer of nitride. The cap layer of nitride receives a patterned etch to remove the cap only over the active areas. This allows a selective etch to remove the excess oxide, which can be followed by a selective etch to remove the nitride layers.
摘要翻译: 给出了在浅沟槽隔离后从活性区域去除过量氧化物的方法,而不使用化学机械抛光。 氮化物掩模在蚀刻隔离沟槽期间保护有源区。 沟槽用氧化物填充,使用高密度等离子体沉积,其同时蚀刻,在隔离沟槽周围提供倾斜的轮廓。 另外的氮化物层用于在沟槽上提供一个帽,该盖密封到下面的氮化物层。 氮化物的盖层接受图案化的蚀刻,以仅在有效区域上移除盖。 这允许选择性蚀刻去除多余的氧化物,其后可以进行选择性蚀刻去除氮化物层。
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