公开(公告)号：US06599561B2

公开(公告)日：2003-07-29

申请号：US10010675

申请日：2001-11-30

Applicant: Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

Inventor： Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

IPC: B05D512

CPC classification number: D03D15/0011 ,  D03D1/0082 ,  D03D15/00 ,  D03D15/0066 ,  D03D15/02 ,  D10B2101/06 ,  D10B2101/20 ,  D10B2321/042 ,  D10B2331/021 ,  D10B2331/04 ,  D10B2401/16 ,  H05K1/0366 ,  H05K3/045 ,  H05K3/4038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49162 ,  Y10T29/49215 ,  Y10T428/24917

Abstract: An inexpensive and high throughput process for manufacturing a printed circuit board (PCB) substrate includes first weaving a plurality of electrically non-conductive strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric with an upper surface and a lower surface. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planed. The planing step segments the electrically conductive strand(s) and forms a PCB substrate that includes a planarized cured fabric with upper and lower planed surfaces and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface. Since each of the electrically conductive strand segments extends from the upper planed surface to the lower planed surface, the segments function as electrically conductive vias of the PCB substrate. Also, a PCB substrate that includes a planarized woven fabric with a cured resin material impregnated therein. The planarized woven fabric includes planed upper and lower surfaces and a plurality of integrally formed electrically conductive strand segments (e.g., copper wire segments) extending from the upper planed surface to the lower planed surface. Since the electrically conductive strand segments were formed integrally with the remainder of the planarized woven fabric, PCB substrates are of high mechanical stability.

Abstract translation: 用于制造印刷电路板（PCB）基板的廉价且高通量的方法包括首先编织多根非导电线（例如，玻璃纤维纱线）和至少一根导电线（例如铜线），以形成 具有上表面和下表面的无纺织物。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 固化织物的上表面和下表面随后被平面化。 所述刨削步骤分段所述导电线并形成PCB衬底，所述PCB衬底包括具有上和下平面表面的平坦化固化织物以及从所述上平面表面延伸到所述下平面表面的多个导电线段。 由于每个导电线段从上平面表面延伸到下平面表面，所以这些段用作PCB基板的导电通孔。 此外，PCB基板包括其中浸渍有固化的树脂材料的平面化织物。 平面织造织物包括平面的上表面和下表面以及从上平面表面延伸到下平面表面的多个整体形成的导电线段（例如，铜线段）。 由于导电线段与平面化织物的其余部分一体形成，所以PCB基板具有高机械稳定性。