公开(公告)号：US20100270688A1

公开(公告)日：2010-10-28

申请号：US12430608

申请日：2009-04-27

申请人： Ting-Feng SU ,  Chien-Ming Chen

发明人： Ting-Feng SU ,  Chien-Ming Chen

IPC分类号： H01L23/538

CPC分类号： H01L25/0657 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/50 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4899 ,  H01L2224/73265 ,  H01L2224/83856 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip stacked package primarily comprises a chip carrier, a first chip disposed on the chip carrier, a plurality of die-attaching bars, a second chip stacked on the first chip by the adhesion of the die-attaching bars, and a plurality of bonding wires electrically connecting the first chip to the chip carrier. The die-attaching bars are formed on the first chip in a specific pattern and have an adhesive surface away from the first chip for adhering the second chip. The bonding wires have a loop height lower than the adhesive surface in a manner that specific sections of the bonding wires are embedded in the corresponding die-attaching bar from the adhesive surface. Accordingly, the die-attaching bars can modify and fasten the bonding wires in advance to avoid collapse and deformation of the bonding wires during stacking of the second chip and encapsulating processes.

摘要翻译： 多芯片堆叠封装主要包括芯片载体，设置在芯片载体上的第一芯片，多个芯片连接杆，通过模具附接杆的粘附堆叠在第一芯片上的第二芯片，以及多个芯片 的电线将第一芯片电连接到芯片载体上。 模具安装杆以特定图案形成在第一芯片上，并且具有远离第一芯片的粘合表面，用于粘附第二芯片。 接合线具有低于粘合剂表面的环高度，使得接合线的特定部分从粘合剂表面嵌入相应的模具附接杆中。 因此，模具安装杆可以预先修改并固定接合线，以避免在第二芯片堆叠和封装过程期间接合线的塌陷和变形。

公开(公告)号：US20100162789A1

公开(公告)日：2010-07-01

申请号：US12344279

申请日：2008-12-25

申请人： TING-FENG SU

发明人： TING-FENG SU

IPC分类号： G01N3/00

CPC分类号： G01N3/303

摘要： An apparatus for drop testing is disclosed. The apparatus has a drop angle setting jig that horizontally moves on a support frame and positions a test object at a predetermined angle by clamping with a fixture. The jig provides a second datum plane and is connected to a moveable holding frame, with the holding frame providing a first datum plane. After the fixture clamps the testing object, the jig can be pulled back without touching the testing object, and the testing object stays still. Therefore, the testing object can be precisely positioned. Furthermore, with the sliding track and the stopping block, the jig is able to quickly return back to the reference position.

摘要翻译： 公开了用于跌落测试的装置。 该装置具有在支撑框架上水平移动并且通过夹具固定测试对象以预定角度定位的下落角度设置夹具。 夹具提供第二基准平面并且连接到可移动的保持框架，保持框架提供第一基准平面。 夹具夹紧测试对象后，可以将夹具拉回，而不会碰到测试对象，测试对象停留。 因此，可以精确定位测试对象。 此外，通过滑轨和止动块，夹具能够快速返回到参考位置。

公开(公告)号：US07913539B2

公开(公告)日：2011-03-29

申请号：US12344279

申请日：2008-12-25

申请人： Ting-Feng Su

发明人： Ting-Feng Su

IPC分类号： G01N3/00

CPC分类号： G01N3/303

摘要： An apparatus for drop testing is disclosed. The apparatus has a drop angle setting jig that horizontally moves on a support frame and positions a test object at a predetermined angle by clamping with a fixture. The jig provides a second datum plane and is connected to a moveable holding frame, with the holding frame providing a first datum plane. After the fixture clamps the testing object, the jig can be pulled back without touching the testing object, and the testing object stays still. Therefore, the testing object can be precisely positioned. Furthermore, with the sliding track and the stopping block, the jig is able to quickly return back to the reference position.

摘要翻译： 公开了用于跌落测试的装置。 该装置具有在支撑框架上水平移动并且通过夹具固定测试对象以预定角度定位的下落角度设置夹具。 夹具提供第二基准平面并且连接到可移动的保持框架，保持框架提供第一基准平面。 夹具夹紧测试对象后，可以将夹具拉回，而不会碰到测试对象，测试对象停留。 因此，可以精确定位测试对象。 此外，通过滑轨和止动块，夹具能够快速返回到参考位置。

公开(公告)号：US08063492B2

公开(公告)日：2011-11-22

申请号：US12430608

申请日：2009-04-27

申请人： Ting-Feng Su ,  Chien-Ming Chen

发明人： Ting-Feng Su ,  Chien-Ming Chen

IPC分类号： H01L29/40

CPC分类号： H01L25/0657 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/50 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4899 ,  H01L2224/73265 ,  H01L2224/83856 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip stacked package primarily comprises a chip carrier, a first chip disposed on the chip carrier, a plurality of die-attaching bars, a second chip stacked on the first chip by the adhesion of the die-attaching bars, and a plurality of bonding wires electrically connecting the first chip to the chip carrier. The die-attaching bars are formed on the first chip in a specific pattern and have an adhesive surface away from the first chip for adhering the second chip. The bonding wires have a loop height lower than the adhesive surface in a manner that specific sections of the bonding wires are embedded in the corresponding die-attaching bar from the adhesive surface. Accordingly, the die-attaching bars can modify and fasten the bonding wires in advance to avoid collapse and deformation of the bonding wires during stacking of the second chip and encapsulating processes.

摘要翻译： 多芯片堆叠封装主要包括芯片载体，设置在芯片载体上的第一芯片，多个芯片连接杆，通过模具附接杆的粘附堆叠在第一芯片上的第二芯片，以及多个芯片 的电线将第一芯片电连接到芯片载体上。 模具安装杆以特定图案形成在第一芯片上，并且具有远离第一芯片的粘合表面，用于粘附第二芯片。 接合线具有低于粘合剂表面的环高度，使得接合线的特定部分从粘合剂表面嵌入相应的模具附接杆中。 因此，模具安装杆可以预先修改并固定接合线，以避免在第二芯片堆叠和封装过程期间接合线的塌陷和变形。

公开(公告)号：US20130075881A1

公开(公告)日：2013-03-28

申请号：US13241849

申请日：2011-09-23

申请人： Wan-Yu HUANG ,  Ting-Feng Su

发明人： Wan-Yu HUANG ,  Ting-Feng Su

IPC分类号： H01L23/495

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49575 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a memory card package with a small substrate by using a metal die pad having an opening to substitute the chip-carrying function of a conventional substrate so that substrate dimension can be reduced. A substrate is attached under the metal die pad. A first chip is disposed on the substrate located inside the opening. A second chip is disposed on the metal die pad without covering the opening. A card-like encapsulant encapsulates the metal die pad, the top surface of the substrate, the first chip, and the second chip. The dimension of the substrate is smaller than the dimension of the encapsulant. The substrate has a lumpy sidewall encapsulated by the encapsulant so that the bottom surface of the substrate is coplanar with a bottom side of the encapsulant to increase the adhesion between the substrate and the encapsulant.

摘要翻译： 公开了一种具有小基板的存储卡封装，通过使用具有开口的金属裸片焊盘来代替传统基板的芯片承载功能，从而可以减小基板尺寸。 将基板安装在金属模垫下方。 第一芯片设置在位于开口内部的基板上。 第二芯片设置在金属裸片上，而不覆盖开口。 卡状密封剂封装金属管芯焊盘，衬底的顶表面，第一芯片和第二芯片。 衬底的尺寸小于密封剂的尺寸。 衬底具有由密封剂封装的块状侧壁，使得衬底的底表面与密封剂的底侧共面，以增加衬底和密封剂之间的粘附性。