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15 条记录 (耗时 0.012 秒)

    Card holding structure and portable terminal apparatus having the same
    3.
    发明授权
    Card holding structure and portable terminal apparatus having the same 失效
    卡片保持结构和便携式终端设备具有相同的功能

    公开(公告)号：US06947767B2

    公开(公告)日：2005-09-20

    申请号：US09980535

    申请日：2001-02-23

    申请人： Hideo Haga ,  Koji Kuchiishi ,  Toshihiro Higuchi ,  Yasunobu Ikeda

    发明人： Hideo Haga ,  Koji Kuchiishi ,  Toshihiro Higuchi ,  Yasunobu Ikeda

    IPC分类号： H01R13/639 ,  G06K7/00 ,  H04M1/02 ,  H04Q7/32 ,  H04M1/00

    CPC分类号： G06K7/0021 ,  G06K13/085 ,  H04B1/3816 ,  H04M1/0202 ,  H04M2250/14

    摘要： A card is slid and fitted to a card connector fixed in a card-fitting recessed portion provided inside a reverse surface-side housing of a portable terminal apparatus. A front portion of the card is held by card holding portions provided in a front portion, as viewed in a card sliding direction, of the card connector, and a rear portion of the card is held by an inner wall surface of a cover-cum-battery of the reverse surface-side housing. A housing-side stopper is provided on a bottom surface of the card-fitting recessed portion. The housing-side stopper is formed by a rectangular resilient piece having one end fixed to a bottom surface of the card-fitting recessed portion.

    摘要翻译： 将卡滑动并安装在固定在设置在便携式终端装置的背面侧壳体内的卡嵌入凹部中的卡连接器上。 卡的前部由卡连接器的卡片滑动方向的前部设置的卡保持部保持，卡的后部被盖的内壁面保持 反面侧壳体的电池。 在卡配合凹部的底面设置有壳体侧止动件。 壳体侧止动器由一端固定在卡嵌凹部的底面上的矩形弹性片形成。

    Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device
    4.
    发明申请
    Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device 有权
    固态成像装置及其制造方法以及并入固态成像装置的相机

    公开(公告)号：US20060158547A1

    公开(公告)日：2006-07-20

    申请号：US11333339

    申请日：2006-01-18

    申请人： Tomoko Komatsu ,  Toshihiro Higuchi

    发明人： Tomoko Komatsu ,  Toshihiro Higuchi

    IPC分类号： H04N5/225

    CPC分类号： H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685

    摘要： A solid state imaging device of the present invention comprises: a semiconductor substrate; a plurality of light receiving elements arranged in a matrix configuration on the semiconductor substrate; a plurality of color filter segments provided above the light receiving elements; and a light collector provided above the color filter segments for collecting light on the light receiving elements. The color filter segments are mutually separated by interstices. The interstices contain a gas.

    摘要翻译： 本发明的固态成像装置包括：半导体衬底; 多个在所述半导体衬底上以矩阵构造布置的光接收元件; 设置在所述光接收元件上方的多个滤色器片段; 以及设置在滤色器片段上方的用于在光接收元件上收集光的集光器。 滤色片段通过间隙相互分离。 空隙含有气体。

    Solid-state imaging device
    6.
    发明授权
    Solid-state imaging device 有权
    固态成像装置

    公开(公告)号：US08093672B2

    公开(公告)日：2012-01-10

    申请号：US11523698

    申请日：2006-09-20

    申请人： Tomoki Masuda ,  Toshihiro Higuchi ,  Yasuo Takeuchi ,  Tomoko Komatsu

    发明人： Tomoki Masuda ,  Toshihiro Higuchi ,  Yasuo Takeuchi ,  Tomoko Komatsu

    IPC分类号： H01L31/0232

    CPC分类号： H01L27/14627 ,  H01L27/14632 ,  H01L27/14687

    摘要： Provided is a manufacturing method of a solid-state imaging device, which is able to realize a solid-state imaging device whose reflection prevention coating is even and that does not have image noise in case of adopting a spincoating method in applying a material of the reflection prevention coating onto microlenses of the solid-state imaging device. In the solid-state imaging device 1 according to the present invention, a barrier wall pattern 7 is formed, as a step alleviating structure, in dicing areas 5X formed between adjacent imaging areas 9. The barrier wall pattern 7 has a rectangular sectional form. With use of the barrier wall pattern 7 in the spincoating method, reflection prevention coating 8 is coated onto the microlenses 6 more evenly than in conventional cases.

    摘要翻译： 提供一种固态成像装置的制造方法，其能够实现防反射涂层均匀的固态成像装置，并且在应用旋涂方法的情况下不具有图像噪声 反射防止涂层在固态成像装置的微透镜上。 在根据本发明的固态成像装置1中，在形成在相邻成像区域9之间的切割区域5X中形成阻挡壁图案7作为阶梯缓和结构。阻挡壁图案7具有矩形截面形状。 通过使用旋涂法中的阻挡壁图案7，与常规情况相比，防反射涂层8更均匀地涂覆在微透镜6上。

    Portable electronic apparatus and BGA package protective device
    8.
    发明授权
    Portable electronic apparatus and BGA package protective device 失效
    便携式电子仪器和BGA封装保护装置

    公开(公告)号：US07436676B2

    公开(公告)日：2008-10-14

    申请号：US10489498

    申请日：2002-06-07

    申请人： Toshihiro Higuchi ,  Shotaro Nagaike ,  Taku Yamada ,  Yoji Inomata

    发明人： Toshihiro Higuchi ,  Shotaro Nagaike ,  Taku Yamada ,  Yoji Inomata

    IPC分类号： H05K5/00

    CPC分类号： H05K9/0037 ,  H01H2239/01 ,  H04B1/3833 ,  H04M1/23 ,  H04M1/72544

    摘要： A portable electronic device in which microswitches (12) controlled by operation buttons (11) are mounted on one side of a printed circuit board (13), and circuit elements accommodated in BGA packages (14), (15) and (16) are soldered on the other side of the printed circuit board. In the portable electronic device, a shield wall (22) for surrounding the BGA packages (14), (15) and (16) is mounted on the printed circuit board (13), a first protrusion portion (18b) for holding down the shield wall (22) on the printed circuit board (13) is protruded from a case (18) of the portable electronic device (10), and second protrusion portion (18c) for holding down surfaces of the BGA packages (14); (15) and (16) on the printed circuit board (13) is protruded from the case (18) of the portable electronic device (10). With such a construction, the BGA packages are prevented from being peeled off from the printed circuit board (13). Further, even when the push buttons are frequently depressed in playing a game, the soldering parts of the BGA packages mounted on the back side of the operation button can be maintained in good conditions.

    摘要翻译： 一种便携式电子设备，其中由操作按钮（11）控制的微动开关（12）安装在印刷电路板（13）的一侧上，并且容纳在BGA封装（14），（15）和（16）中的电路元件是 焊接在印刷电路板的另一面。 在便携式电子设备中，用于围绕BGA封装（14），（15）和（16）的屏蔽壁（22）安装在印刷电路板（13）上，第一突起部分（18b）用于保持 印刷电路板（13）上的屏蔽壁（22）从便携式电子设备（10）的壳体（18）突出，并且用于保持BGA封装（14）的表面的第二突出部分（18c） ; 印刷电路板（13）上的（15）和（16）从便携式电子设备（10）的壳体（18）突出。 通过这样的结构，可以防止BGA封装从印刷电路板（13）剥离。 此外，即使在游戏中经常按下按钮时，安装在操作按钮背面的BGA封装的焊接部件也能够保持良好的状态。

    Solid-state imaging device and manufacturing method thereof
    9.
    发明申请
    Solid-state imaging device and manufacturing method thereof 有权
    固态成像装置及其制造方法

    公开(公告)号：US20070096243A1

    公开(公告)日：2007-05-03

    申请号：US11523698

    申请日：2006-09-20

    申请人： Tomoki Masuda ,  Toshihiro Higuchi ,  Yasuo Takeuchi ,  Tomoko Komatsu

    发明人： Tomoki Masuda ,  Toshihiro Higuchi ,  Yasuo Takeuchi ,  Tomoko Komatsu

    IPC分类号： H01L31/06

    CPC分类号： H01L27/14627 ,  H01L27/14632 ,  H01L27/14687

    摘要： Provided is a manufacturing method of a solid-state imaging device, which is able to realize a solid-state imaging device whose reflection prevention coating is even and that does not have image noise in case of adopting a spincoating method in applying a material of the reflection prevention coating onto microlenses of the solid-state imaging device. In the solid-state imaging device 1 according to the present invention, a barrier wall pattern 7 is formed, as a step alleviating structure, in dicing areas 5X formed between adjacent imaging areas 9. The barrier wall pattern 7 has a rectangular sectional form. With use of the barrier wall pattern 7 in the spincoating method, reflection prevention coating 8 is coated onto the microlenses 6 more evenly than in conventional cases.

    摘要翻译： 提供一种固态成像装置的制造方法，其能够实现防反射涂层均匀的固态成像装置，并且在应用旋涂方法的情况下不具有图像噪声 反射防止涂层在固态成像装置的微透镜上。 在根据本发明的固态成像装置1中，在相邻成像区域9之间形成的切割区域5中形成有阻挡壁图案7作为阶梯缓和结构。 阻挡壁图案7具有矩形截面形状。 通过使用旋涂法中的阻挡壁图案7，与常规情况相比，防反射涂层8更均匀地涂覆在微透镜6上。