LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    发光二极管结构及其制造方法

    公开(公告)号:US20140264389A1

    公开(公告)日:2014-09-18

    申请号:US13975387

    申请日:2013-08-26

    CPC classification number: H01L33/02 H01L33/0079 H01L51/5004

    Abstract: A light emitting diode (LED) structure including a substrate, a polymer layer, and an epitaxy layer is provided. The polymer layer is disposed on the substrate, wherein the polymer layer has a chemical formula of: wherein M represents sodium, zinc, magnesium, or potassium. The epitaxy layer is disposed on the polymer layer. The epitaxy layer is bonded to the substrate via the polymer layer.

    Abstract translation: 提供了包括基板,聚合物层和外延层的发光二极管(LED)结构。 聚合物层设置在基底上,其中聚合物层具有以下化学式:其中M表示钠,锌,镁或钾。 外延层设置在聚合物层上。 外延层通过聚合物层结合到基底上。

    Light emitting diode structure and manufacturing method thereof
    4.
    发明授权
    Light emitting diode structure and manufacturing method thereof 有权
    发光二极管结构及其制造方法

    公开(公告)号:US08901551B2

    公开(公告)日:2014-12-02

    申请号:US13975387

    申请日:2013-08-26

    CPC classification number: H01L33/02 H01L33/0079 H01L51/5004

    Abstract: A light emitting diode (LED) structure including a substrate, a polymer layer, and an epitaxy layer is provided. The polymer layer is disposed on the substrate, wherein the polymer layer has a chemical formula of: wherein M represents sodium, zinc, magnesium, or potassium. The epitaxy layer is disposed on the polymer layer. The epitaxy layer is bonded to the substrate via the polymer layer.

    Abstract translation: 提供了包括基板,聚合物层和外延层的发光二极管(LED)结构。 聚合物层设置在基底上,其中聚合物层具有以下化学式:其中M表示钠,锌,镁或钾。 外延层设置在聚合物层上。 外延层通过聚合物层结合到基底上。

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