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    Light emitting device
    3.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号：US08710721B1

    公开(公告)日：2014-04-29

    申请号：US13773648

    申请日：2013-02-22

    申请人： Yun-Li Li ,  Yi-Fan Li ,  Sheng-Yuan Sun

    发明人： Yun-Li Li ,  Yi-Fan Li ,  Sheng-Yuan Sun

    IPC分类号： F21V29/00 ,  F21V29/02

    CPC分类号： F21V29/83 ,  F21K9/232 ,  F21K9/64 ,  F21V29/506

    摘要： A light emitting device includes a light-emitting diode (LED) light source module, a heat-dissipating unit and a phosphor-converted cover. The heat-dissipating unit is disposed below the LED light source module. The phosphor-converted cover covers the LED light source module. The phosphor-converted cover has an accommodating space, at least one air channel and a first air hole. The LED light source module is located in the accommodating space, and the first air hole is located above the LED light source module and connected to the air channel. An outside fluid passes through the accommodating space via the air channel to discharge heat generated by the LED light source module to outside via the first air hole. An aperture of the first air hole is between 0.01 millimeters and 1 millimeter.

    摘要翻译： 发光装置包括发光二极管（LED）光源模块，散热单元和磷光体转换盖。 散热单元设置在LED光源模块的下方。 磷光体转换盖覆盖LED光源模块。 磷光体转换盖具有容纳空间，至少一个空气通道和第一空气孔。 LED光源模块位于容纳空间中，第一空气孔位于LED光源模块上方并连接到空气通道。 外部流体经由空气通道通过容纳空间，以经由第一空气孔将由LED光源模块产生的热量排出到外部。 第一空气孔的孔径在0.01毫米和1毫米之间。

    LIGHT EMITTING DEVICE
    4.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20140252400A1

    公开(公告)日：2014-09-11

    申请号：US13971845

    申请日：2013-08-21

    申请人： Cheng-Yen Chen ,  Sheng-Yuan Sun ,  Chih-Ming Chen ,  Yi-Hao Huang ,  Kuan-Wen Chen

    发明人： Cheng-Yen Chen ,  Sheng-Yuan Sun ,  Chih-Ming Chen ,  Yi-Hao Huang ,  Kuan-Wen Chen

    IPC分类号： H01L33/48

    CPC分类号： F21V19/0055 ,  F21V9/30 ,  F21V29/89 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/056 ,  H05K2201/10106

    摘要： A light emitting device including a carrier, a substrate, at least one electrode pair, at least one light emitting diode (LED) and at least one positioning element is provided. The substrate is disposed on the carrier and has a body portion and at least one bending portion. The bending portion connects to the body portion. The bending portion is not coplanar with the body portion. The electrode pair is located on the body portion of the substrate. The LED is disposed on the body portion of the substrate and electrically connected to the electrode pair. The positioning element is disposed on the bending portion of the substrate for fixing the substrate on the carrier.

    摘要翻译： 提供了包括载体，基板，至少一个电极对，至少一个发光二极管（LED）和至少一个定位元件的发光器件。 基板设置在载体上并具有主体部分和至少一个弯曲部分。 弯曲部分连接到主体部分。 弯曲部分不与主体部分共面。 电极对位于基板的主体部分上。 LED设置在基板的主体部分上并与电极对电连接。 定位元件设置在基板的弯曲部分上，用于将基板固定在载体上。

    LIGHT SOURCE MODULE
    5.
    发明申请
    LIGHT SOURCE MODULE 有权
    光源模块

    公开(公告)号：US20140167077A1

    公开(公告)日：2014-06-19

    申请号：US13904027

    申请日：2013-05-29

    申请人： Cheng-Yen Chen ,  Yun-Li Li ,  Yi-Hao Huang ,  Sheng-Yuan Sun

    发明人： Cheng-Yen Chen ,  Yun-Li Li ,  Yi-Hao Huang ,  Sheng-Yuan Sun

    IPC分类号： H01L33/08

    CPC分类号： H01L25/0753 ,  H01L33/20 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light source module includes a substrate, at least two light emitting diode (LED) chips and at least one dummy chip. The LED chips are disposed on the substrate. The dummy chip is disposed on the substrate and located between the LED chips. The LED chips, the dummy chip and the substrate are electrically connected to one another. The dummy chip is used to redirect a lateral light emitted from the LED chips.

    摘要翻译： 光源模块包括衬底，至少两个发光二极管（LED）芯片和至少一个虚拟芯片。 LED芯片设置在基板上。 虚设芯片设置在基板上并位于LED芯片之间。 LED芯片，虚设芯片和基板彼此电连接。 虚拟芯片用于重定向从LED芯片发射的横向光。

    Substrate structure
    7.
    发明授权
    Substrate structure 有权
    基材结构

    公开(公告)号：US08895862B2

    公开(公告)日：2014-11-25

    申请号：US13572705

    申请日：2012-08-13

    申请人： Sheng-Yuan Sun ,  Po-Jen Su

    发明人： Sheng-Yuan Sun ,  Po-Jen Su

    IPC分类号： H05K1/00

    CPC分类号： H01L25/0753 ,  H01L23/3677 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches.

    摘要翻译： 提供了用于承载多个发热元件的基板结构。 基板结构包括板，图案化金属层和多个散热通道。 电路板有一个上表面。 图案化金属层设置在板上，包括第一电极，第二电极，多个第一焊盘和多个第二焊盘。 第一焊盘和第二焊盘交替地平行布置在上表面上。 第一（第二）焊盘的部分电连接到第一（第二）电极。 第一焊盘的其他部分和第二焊盘的其它部分彼此电连接。 每个第一焊盘和相邻的第二焊盘限定一个器件接合区域。 发热元件分别设置在装置接合区域中。 两个相邻的器件接合区域之间有多个沟槽。 散热通道设置在沟槽中。

    LIGHT EMITTING MODULE
    8.
    发明申请
    LIGHT EMITTING MODULE 有权
    发光模块

    公开(公告)号：US20130285083A1

    公开(公告)日：2013-10-31

    申请号：US13798126

    申请日：2013-03-13

    申请人： Sheng-Yuan Sun ,  Po-Jen Su

    发明人： Sheng-Yuan Sun ,  Po-Jen Su

    IPC分类号： H01L27/15

    CPC分类号： F21K9/64 ,  F21V9/30 ,  F21V13/02 ,  F21V19/0025 ,  F21Y2101/00 ,  F21Y2113/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/20 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region.

    摘要翻译： 提供了包括基板，多个第一发光二极管（LED）芯片和多个第二LED芯片的发光模块。 衬底具有十字形中心区域和围绕十字形中心区域的周边区域。 第一LED芯片设置在基板上并且至少位于十字形中心区域中。 第二LED芯片设置在基板上并且至少位于周边区域中。 每个第二LED芯片的尺寸小于每个第一LED芯片的尺寸。 位于周边区域的第一LED芯片的数量小于十字形中心区域中的数量。 位于十字形中心区域的第二LED芯片的数量小于周边区域中的第二LED芯片的数量。

    SUBSTRATE STRUCTURE
    9.
    发明申请
    SUBSTRATE STRUCTURE 有权
    基板结构

    公开(公告)号：US20130277093A1

    公开(公告)日：2013-10-24

    申请号：US13572705

    申请日：2012-08-13

    申请人： Sheng-Yuan Sun ,  Po-Jen Su

    发明人： Sheng-Yuan Sun ,  Po-Jen Su

    IPC分类号： H05K1/02

    CPC分类号： H01L25/0753 ,  H01L23/3677 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches.

    摘要翻译： 提供了用于承载多个发热元件的基板结构。 基板结构包括板，图案化金属层和多个散热通道。 电路板有一个上表面。 图案化金属层设置在板上，包括第一电极，第二电极，多个第一焊盘和多个第二焊盘。 第一焊盘和第二焊盘交替地平行布置在上表面上。 第一（第二）焊盘的部分电连接到第一（第二）电极。 第一焊盘的其他部分和第二焊盘的其它部分彼此电连接。 每个第一焊盘和相邻的第二焊盘限定一个器件接合区域。 发热元件分别设置在装置接合区域中。 两个相邻的器件接合区域之间有多个沟槽。 散热通道设置在沟槽中。

    Light emitting module
    10.
    发明授权
    Light emitting module 有权
    发光模块

    公开(公告)号：US09035335B2

    公开(公告)日：2015-05-19

    申请号：US13798126

    申请日：2013-03-13

    申请人： Sheng-Yuan Sun ,  Po-Jen Su

    发明人： Sheng-Yuan Sun ,  Po-Jen Su

    IPC分类号： H01L27/15 ,  H01L25/075 ,  H01L33/20 ,  H01L33/50

    CPC分类号： F21K9/64 ,  F21V9/30 ,  F21V13/02 ,  F21V19/0025 ,  F21Y2101/00 ,  F21Y2113/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/20 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region.

    摘要翻译： 提供了包括基板，多个第一发光二极管（LED）芯片和多个第二LED芯片的发光模块。 衬底具有十字形中心区域和围绕十字形中心区域的周边区域。 第一LED芯片设置在基板上并且至少位于十字形中心区域中。 第二LED芯片设置在基板上并且至少位于周边区域中。 每个第二LED芯片的尺寸小于每个第一LED芯片的尺寸。 位于周边区域的第一LED芯片的数量小于十字形中心区域中的数量。 位于十字形中心区域的第二LED芯片的数量小于周边区域中的第二LED芯片的数量。