公开(公告)号：US06400014B1

公开(公告)日：2002-06-04

申请号：US09760438

申请日：2001-01-13

申请人： Chien-ping Huang ,  Cheng-Yuan Lai ,  Tzu-Yi Tien ,  Chih-Ming Huang

发明人： Chien-ping Huang ,  Cheng-Yuan Lai ,  Tzu-Yi Tien ,  Chih-Ming Huang

IPC分类号： H01L2334

CPC分类号： H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention relates to a semiconductor package with a heat sink. There is at least one chip adhered to the substrate and the heat sink is constituted by a planar plate and a support for supporting the planar plate to a height for positioning the planar plate above the chip. The planar plate has a top surface exposed outside a resin body used for encapsulating the chip and the heat sink, and a bottom surface opposed to the top surface. The planar plate further has a thick portion formed on the bottom surface relative to the position of the chip, wherein there is a gap formed between the end surface of the thick portion and the chip to prevent the heat sink from directly contacting with the chip, and an end surface of the thick portion has a plurality of flow channels formed along the flowing direction of the molding gate to avoid the formation of void in the gap so as to increase the yield rate of products.

摘要翻译： 本发明涉及具有散热器的半导体封装。 至少有一个芯片粘附到基板上，并且散热器由平板和用于将平板支撑到用于将平板定位在芯片上方的高度的支撑件构成。 平面板具有暴露在用于封装芯片和散热器的树脂体外部的顶表面和与顶表面相对的底表面。 平面板还具有相对于芯片的位置在底面上形成的厚部，其中在厚部的端面与芯片之间形成间隙，以防止散热片与芯片直接接触， 并且厚壁部的端面具有沿着成型浇口的流动方向形成的多个流动通道，以避免在间隙中形成空隙，从而提高产品的产量。

公开(公告)号：US06716676B2

公开(公告)日：2004-04-06

申请号：US10251171

申请日：2002-09-19

申请人： Eing-Chieh Chen ,  Cheng-Yuan Lai ,  Tzu-Yi Tien

发明人： Eing-Chieh Chen ,  Cheng-Yuan Lai ,  Tzu-Yi Tien

IPC分类号： H01L2144

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4826 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A new semiconductor packaging technology is proposed for the fabrication of a thermally-enhanced stacked-die BGA (Ball Grid Array) semiconductor package. By the proposed semiconductor packaging technology, a substrate is used as a chip carrier for the mounting of two semiconductor chips in conjunction with a heat spreader thereon, wherein the first semiconductor chip is mounted over the substrate through flip-chip (FC) technology; the heat spreader is mounted over the first semiconductor chip and supported on the substrate; and the second semiconductor chip is mounted on the heat spreader and electrically coupled to the substrate through wire-bonding (WB) technology. To facilitate the wire-bonding process, the heat spreader is formed with a plurality of wire-routing openings to allow the bonding wires to be routed therethrough. Since chip-produced heat during operation can be dissipated through the heat spreader, it allows an enhanced heat-dissipation efficiency. In addition, the heat spreader can serve as a grounding plane to the package chips, so that the packaged chips would have better electrical performance during operation.

摘要翻译： 提出了一种新的半导体封装技术，用于制造热增强堆叠管芯BGA（球栅阵列）半导体封装。 通过提出的半导体封装技术，将衬底用作用于与其上的散热器一起安装两个半导体芯片的芯片载体，其中通过倒装芯片（FC）技术将第一半导体芯片安装在衬底上; 散热器安装在第一半导体芯片上并支撑在基板上; 并且第二半导体芯片安装在散热器上并且通过引线接合（WB）技术电耦合到基板。 为了便于引线接合工艺，散热器形成有多个导线布线孔，以允许接合线穿过其中。 由于在操作期间芯片产生的热量可以通过散热器消散，所以它可以提高散热效率。 此外，散热器可以用作封装芯片的接地平面，使得封装的芯片在操作期间具有更好的电气性能。

公开(公告)号：US06472741B1

公开(公告)日：2002-10-29

申请号：US09905499

申请日：2001-07-14

申请人： Eing-Chieh Chen ,  Cheng-Yuan Lai ,  Tzu-Yi Tien

发明人： Eing-Chieh Chen ,  Cheng-Yuan Lai ,  Tzu-Yi Tien

IPC分类号： H01L2334

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4826 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A new semiconductor packaging technology is proposed for the fabrication of a thermally-enhanced stacked-die BGA (Ball Grid Array) semiconductor package. By the proposed semiconductor packaging technology, a substrate is used as a chip carrier for the mounting of two semiconductor chips in conjunction with a heat spreader thereon, wherein the first semiconductor chip is mounted over the substrate through flip-chip (FC) technology; the heat spreader is mounted over the first semiconductor chip and supported on he substrate; and the second semiconductor chip is mounted on the heat spreader and electrically coupled to the substrate through wire-bonding (WB) technology. To facilitate the wire-bonding process, the heat spreader is formed with a plurality of wire-routing openings to allow the bonding wires to be routed therethrough. Since chip-produced beat during operation can be dissipated through the heat spreader, it allows an enhanced heat-dissipation efficiency. In addition, the heat spreader can serve as a grounding plane to the package chips, so that the packaged chips would have better electrical performance during operation.

摘要翻译： 提出了一种新的半导体封装技术，用于制造热增强堆叠管芯BGA（球栅阵列）半导体封装。 通过提出的半导体封装技术，将衬底用作用于与其上的散热器一起安装两个半导体芯片的芯片载体，其中通过倒装芯片（FC）技术将第一半导体芯片安装在衬底上; 散热器安装在第一半导体芯片上并支撑在其基板上; 并且第二半导体芯片安装在散热器上并且通过引线接合（WB）技术电耦合到基板。 为了便于引线接合工艺，散热器形成有多个导线布线孔，以允许接合线穿过其中。 由于在运行期间芯片产生的节拍可以通过散热器消散，因此可以提高散热效率。 此外，散热器可以用作封装芯片的接地平面，使得封装的芯片在操作期间具有更好的电气性能。