公开(公告)号：US5268066A

公开(公告)日：1993-12-07

申请号：US999513

申请日：1992-12-30

申请人： Marvin Tabasky ,  Victor Cataldo ,  Thomas W. Fitzgerald ,  Jagannath Chirravuri ,  Craig A. Armiento ,  Paul O. Haugsjaa

发明人： Marvin Tabasky ,  Victor Cataldo ,  Thomas W. Fitzgerald ,  Jagannath Chirravuri ,  Craig A. Armiento ,  Paul O. Haugsjaa

IPC分类号： G02B6/42 ,  H01S5/02 ,  H01S5/40 ,  H01L21/306 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC分类号： H01S5/4025 ,  G02B6/423 ,  G02B6/4249 ,  H01S5/02 ,  G02B6/4238

摘要： A waferboard assembly incorporates mechanical registration features into a substrate platform to facilitate the passive alignment of lasers integrated on a chip to fibers in integral contact with the substrate. The waferboard includes two front pedestal structures and one side pedestal structure, and two vertical post structures within a mounting region defined by the pedestal structures. The laser chip is mounted on the vertical post structures, and placed in concurrent abutting contact with the pedestal structures. The waferboard is fabricated by etching the substrate to form the front and side pedestal structures, and etching the substrate to define the grooves. In order to form the post structures, a polyimide material is deposited on the substrate using an appropriate mask.

摘要翻译： 晶片组件将机械配准特征结合到衬底平台中，以便于集成在芯片上的激光器与衬底完全接触的纤维的被动对准。 晶片板包括两个前基座结构和一个侧基座结构，以及在由基座结构限定的安装区域内的两个垂直柱结构。 激光芯片安装在垂直柱结构上，并与底座结构同时邻接接触。 通过蚀刻基板以形成前侧和底侧基座结构并蚀刻基板以限定凹槽来制造晶片板。 为了形成柱结构，使用适当的掩模在基板上沉积聚酰亚胺材料。

公开(公告)号：US5182782A

公开(公告)日：1993-01-26

申请号：US817570

申请日：1992-01-07

申请人： Marvin Tabasky ,  Victor Cataldo ,  Thomas W. Fitzgerald ,  Jagannath Chirravuri ,  Craig A. Armiento ,  Paul O. Haugsjaa

发明人： Marvin Tabasky ,  Victor Cataldo ,  Thomas W. Fitzgerald ,  Jagannath Chirravuri ,  Craig A. Armiento ,  Paul O. Haugsjaa

IPC分类号： G02B6/42 ,  H01S5/02 ,  H01S5/40

CPC分类号： H01S5/02 ,  G02B6/423 ,  G02B6/4249 ,  H01S5/4025 ,  G02B6/4238

摘要： A waferboard assembly incorporates mechanical registration features into a substrate platform to facilitate the passive alignment of lasers integrated on a chip to fibers in integral contact with the substrate. The waferboard includes two front pedestal structures and one side pedestal structure, and two vertical post structures within a mounting region defined by the pedestal structures. The laser chip is mounted on the vertical post structures, and placed in concurrent abutting contact with the pedestal structures. The waferboard is fabricated by etching the substrate to form the front and side pedestal structures, and etching the substrate to define the grooves. In order to form the post structures, a polyimide material is deposited on the substrate using an appropriate mask.

摘要翻译： 晶片组件将机械配准特征结合到衬底平台中，以便于集成在芯片上的激光器与衬底完全接触的纤维的被动对准。 晶片板包括两个前基座结构和一个侧基座结构，以及在由基座结构限定的安装区域内的两个垂直柱结构。 激光芯片安装在垂直柱结构上，并与底座结构同时邻接接触。 通过蚀刻基板以形成前侧和底侧基座结构并蚀刻基板以限定凹槽来制造晶片板。 为了形成柱结构，使用适当的掩模在基板上沉积聚酰亚胺材料。

公开(公告)号：US5436996A

公开(公告)日：1995-07-25

申请号：US314572

申请日：1994-09-28

申请人： Marvin Tabasky ,  Victor Cataldo ,  Thomas W. Fitzgerald ,  Jagannath Chirravuri ,  Craig A. Armiento ,  Paul O. Haugasjaa

发明人： Marvin Tabasky ,  Victor Cataldo ,  Thomas W. Fitzgerald ,  Jagannath Chirravuri ,  Craig A. Armiento ,  Paul O. Haugasjaa

IPC分类号： G02B6/42 ,  H01S5/02 ,  H01S5/40 ,  G02B6/00 ,  B44C1/22

CPC分类号： H01S5/4025 ,  G02B6/423 ,  G02B6/4249 ,  H01S5/02 ,  G02B6/4238

摘要： A waferboard assembly incorporates mechanical registration features into a substrate platform to facilitate the passive alignment of lasers integrated on a chip to fibers in integral contact with the substrate. The waferboard includes two front pedestal structures and one side pedestal structure, and two vertical post structures within a mounting region defined by the pedestal struutures. The laser chip is mounted on the vertical post structures, and placed in concurrent abutting contact with the pedestal structures. The waferboard is fabricated by etching the substrate to form the front and side pedestal structures, and etching the substrate to define the grooves. In order to form the post structures, a polyimide material is deposited on the substrate using an appropriate mask.

摘要翻译： 晶片组件将机械配准特征结合到衬底平台中，以便于集成在芯片上的激光器与衬底完全接触的纤维的被动对准。 晶片板包括两个前基座结构和一个侧基座结构，以及由基座结构限定的安装区域内的两个垂直柱结构。 激光芯片安装在垂直柱结构上，并与底座结构同时邻接接触。 通过蚀刻基板以形成前侧和底侧基座结构并蚀刻基板以限定凹槽来制造晶片板。 为了形成柱结构，使用适当的掩模在基板上沉积聚酰亚胺材料。

公开(公告)号：US5021363A

公开(公告)日：1991-06-04

申请号：US404237

申请日：1989-09-07

申请人： Harry F. Lockwood ,  Margaret B. Stern ,  Marvin Tabasky ,  Victor Cataldo

发明人： Harry F. Lockwood ,  Margaret B. Stern ,  Marvin Tabasky ,  Victor Cataldo

IPC分类号： H01L29/812 ,  H01L21/28 ,  H01L21/285 ,  H01L21/338 ,  H01L29/417 ,  H01L29/47 ,  H01L29/872

CPC分类号： H01L29/66871 ,  H01L21/28575 ,  H01L21/28581 ,  H01L29/66878

摘要： Method of forming conductive members on a substrate of GaAs. Silicon is placed on the substrate surface in the desired pattern of the conductive members. The substrate is exposed to a gaseous atmosphere containing WF.sub.6. WF.sub.6 is reduced by the silicon causing tungsten to selectively deposit on the silicon but not on the exposed GaAs. The substrate is given a rapid thermal annealing treatment which causes the silicon-tungsten elements to form conductive members having a silicon rich layer at the bottom, an intermediate tungsten silicide layer, and a tungsten rich layer at the top. The conductive members form ohmic contacts with underlying heavily doped GaAs and rectifying Schottky barrier contacts with underlying lightly doped GaAs.