公开(公告)号：US20130342497A1

公开(公告)日：2013-12-26

申请号：US13596837

申请日：2012-08-28

申请人： Lianghua Mo ,  Weiping Liu

发明人： Lianghua Mo ,  Weiping Liu

IPC分类号： G06F3/044

CPC分类号： G06F3/044 ,  G06F3/0418

摘要： It is provided a self-capacitance touch screen detection method, device and system. The method includes: receiving a scanning waveform by a currently detected channel of a self-capacitance touch screen; inputting the voltage of the scanning waveform into an input terminal of a voltage following unit, and driving at least a preset channel that is adjacent to the currently detected channel of the self-capacitance touch screen via an output terminal of the voltage following unit; and calculating self-capacitance touch screen coordinate data for a touch in the currently detected channel. The method not only avoids the disturbance to the detection for a touch in the currently detected channel generated due to water vapor or a water droplet, but also obtains an increased relative change generated by the same touch, and thereby the detection sensibility of the self-capacitance touch screen is improved.

摘要翻译： 提供了一种自电容式触摸屏检测方法，装置和系统。 该方法包括：通过自电容触摸屏的当前检测通道接收扫描波形; 将所述扫描波形的电压输入到电压跟随单元的输入端，并经由所述电压跟随单元的输出端至少驱动与所述自电容触摸屏的当前检测到的通道相邻的预设通道; 以及计算当前检测到的通道中的触摸的自电容触摸屏坐标数据。 该方法不仅避免了由于水蒸气或水滴而产生的当前检测通道中的触摸检测的干扰，而且获得了由相同触摸产生的增加的相对变化， 电容触摸屏得到改善。

公开(公告)号：US20120328361A1

公开(公告)日：2012-12-27

申请号：US13542586

申请日：2012-07-05

申请人： WEIPING LIU ,  Ning-Cheng Lee

发明人： WEIPING LIU ,  Ning-Cheng Lee

IPC分类号： C22C13/00 ,  B23K35/24

CPC分类号： C22C13/00 ,  B23K35/0244 ,  B23K35/262 ,  C22C13/02 ,  Y10T403/479

摘要： A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt. % Mn; and a remainder of Sn.

摘要翻译： 公开了一种Sn-Ag-Cu基无铅焊料合金及其焊接接头，具有出色的跌落冲击可靠性。 焊料包含大于0wt。 ％且小于或等于约1.5wt。 ％Ag; 大于或等于约0.7wt。 ％且小于或等于约2.0wt。 ％Cu; 在大于或等于约0.001和小于或等于约0.2重量％之间。 ％Mn; 和Sn的剩余部分。

公开(公告)号：US20110220704A1

公开(公告)日：2011-09-15

申请号：US12720532

申请日：2010-03-09

申请人： Weiping Liu ,  Ning-Cheng Lee

发明人： Weiping Liu ,  Ning-Cheng Lee

IPC分类号： B23K1/20 ,  B32B15/01

CPC分类号： B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29083 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/15747 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  H01L2924/00

摘要： Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.

摘要翻译： 本发明的各种实施例提供了用于高温无铅焊接应用的叠层复合预制箔。 层叠复合预成型体箔由芯层的任一侧的高熔点，延性金属或合金芯层和低熔点焊料涂层构成。 在焊接期间，芯金属，液体焊料层和基底金属反应并消耗低熔点焊料相以形成高熔点金属间化合物相（IMC）。 所得到的焊点由在基板侧被IMC层夹持的延性芯层构成。 接头具有比初始焊料合金涂层的原始熔化温度高得多的熔融温度，允许随后安装封装的装置。

公开(公告)号：US08227527B2

公开(公告)日：2012-07-24

申请号：US10596750

申请日：2004-12-22

申请人： Van Suong Hoa ,  Weiping Liu ,  Martin Pugh ,  Minh-Tan Ton-That

发明人： Van Suong Hoa ,  Weiping Liu ,  Martin Pugh ,  Minh-Tan Ton-That

IPC分类号： C08L63/00 ,  C08K3/34 ,  B01F3/12 ,  B01F5/00

CPC分类号： C08J3/205 ,  C08J2363/00 ,  C08K3/346 ,  C08L63/00

摘要： A method comprising preparing a solution of clay particles solution, submitting the solution of clay particles first to a high pressure and high velocity flow for shearing the particles in the solution of clay particles, and to a sudden lower pressure, whereby the particles explode into the mist of the solution of clay particles, and mixing the finely dispersed clay solution, whereby epoxy is introduced in the solution of clay particles during on of the above steps of preparing the solution of clay particles or dispersing the solution of clay particles or to the resulting dispersed solution of clay particles, yielding an extremely fine and homogeneous distribution of the particles of nanodimensions in the epoxy, yielding a high-performance nanocomposite epoxy.

摘要翻译： 一种方法，包括制备粘土颗粒溶液溶液，首先将粘土颗粒溶液提供到高压和高速流动，以将粘土颗粒溶液中的颗粒剪切并且突然降低压力，由此颗粒爆炸成 混合粘土颗粒溶液，并混合细分散的粘土溶液，由此在上述制备粘土颗粒溶液或分散粘土颗粒溶液或分散粘土颗粒溶液的步骤过程中将环氧树脂引入粘土颗粒溶液中 分散的粘土颗粒溶液，在环氧树脂中产生非常细小且均匀的纳米尺寸颗粒分布，产生高性能纳米复合环氧树脂。

公开(公告)号：US20070134125A1

公开(公告)日：2007-06-14

申请号：US11567525

申请日：2006-12-06

申请人： Weiping Liu ,  Ning-Cheng Lee

发明人： Weiping Liu ,  Ning-Cheng Lee

IPC分类号： C22C13/00

CPC分类号： C22C13/00 ,  C22C13/02

摘要： Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably comprise 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.

摘要翻译： 公开了具有改进的耐滴落冲击性的无铅焊料合金及其焊点。 在一个具体的示例性实施方案中，无铅焊料合金优选包含0.0-4.0wt。 ％的Ag，0.01-1.5wt。 ％的Cu，以下添加剂中的至少一种：Mn为0.001〜1.0重量％ ％，Ce为0.001-0.8wt。 ％，Y为0.001〜1.0重量％。 ％，Ti为0.001-0.8重量％ ％，Bi为0.01〜1.0重量％。 ％，剩余的Sn。

公开(公告)号：US09175368B2

公开(公告)日：2015-11-03

申请号：US13542586

申请日：2012-07-05

申请人： Weiping Liu ,  Ning-Cheng Lee

发明人： Weiping Liu ,  Ning-Cheng Lee

IPC分类号： B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  B23K35/02

CPC分类号： C22C13/00 ,  B23K35/0244 ,  B23K35/262 ,  C22C13/02 ,  Y10T403/479

摘要： A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.

摘要翻译： 公开了一种Sn-Ag-Cu基无铅焊料合金及其焊接接头，具有出色的跌落冲击可靠性。 焊料含有大于0wt。 ％且小于或等于约1.5wt。 ％Ag; 大于或等于约0.7wt。 ％且小于或等于约2.0wt。 ％Cu; 大于或等于约0.001至小于或等于约0.2wt。 ％Mn; 和Sn的剩余部分。

公开(公告)号：US09141134B2

公开(公告)日：2015-09-22

申请号：US13149868

申请日：2011-05-31

申请人： Paul S. Chambers ,  Victor Weiping Liu ,  Brian Tarricone ,  Rhett Anderson

发明人： Paul S. Chambers ,  Victor Weiping Liu ,  Brian Tarricone ,  Rhett Anderson

IPC分类号： G06F3/0488 ,  G06F1/16

CPC分类号： G06F3/0483 ,  G06F1/1616 ,  G06F1/1643 ,  G06F1/1647 ,  G06F3/0482 ,  G06F3/04842 ,  G06F3/0488 ,  G06F3/04883

摘要： The enhanced feature of this invention is the direction of a pen input on an electronic device to a separate canvas where it can be separately manipulated and processed for use. Temporal and spatial analysis can ensure that each canvas contain pen strokes that spatially belong together such as an individual word composed of multiple strokes for easy manipulation of the word on the screen. Another related enhanced feature of the invention for erasing portions of the inputted writing is the process of generating a new curve with different points than the original curve.

摘要翻译： 本发明的增强特征是将电子设备上的笔输入到单独画布的方向，其中可以单独地操纵和处理以供使用。 时间和空间分析可以确保每个画布包含空间属于一起的笔划，例如由多个笔画组成的单个单词，以便轻松操纵屏幕上的单词。 用于擦除输入写入部分的本发明的另一个相关的增强特征是产生具有与原始曲线不同的点的新曲线的过程。

公开(公告)号：US20140009438A1

公开(公告)日：2014-01-09

申请号：US13929267

申请日：2013-06-27

申请人： Weiping Liu ,  JK Zhang

发明人： Weiping Liu ,  JK Zhang

IPC分类号： G06F1/16 ,  G06F3/044

CPC分类号： G06F1/16 ,  G06F3/044 ,  G06F2203/04104

摘要： A single layer self-capacitance touch screen and its data processing method which can realize multi-touch identification, the said touch screen includes at least two self-capacitance electrode assemblies independent of each other, all of which are located in the same plane layer and fully cover the whole touch zone of the touch screen without overlapping each other; the said self-capacitance electrode assembly includes at least a pair of self-capacitance coupling electrode couples, which include two electrode plates seated in the same plane, and these two electrode plates all include their own straight-line electrode plate coupling side and straight-line electrode plate base, which have included angle of acute angle; in the self-capacitance electrode assembly, the centre lines of the self-capacitance coupling electrode couples are placed parallel to each other, and the centre lines of arbitrarily two self-capacitance coupling electrode couples are also placed parallel to each other. This invention fully utilizes simple technological structure feature of single layer self-capacitance touch screen and realizes multi-point touch control function at possible lowest manufacturing cost.

摘要翻译： 一种可实现多点触摸识别的单层自电容触摸屏及其数据处理方法，所述触摸屏包括彼此独立的至少两个自电容电极组件，它们都位于相同的平面层中，并且 完全覆盖触摸屏的整个触摸区域，而不会重叠; 所述自电容电极组件包括至少一对自电容耦合电极耦合，其包括两个位于同一平面中的电极板，并且这两个电极板都包括它们自己的直线电极板耦合侧和直线电极板耦合侧， 线电极板底座，具有夹角角; 在自电容电极组件中，自电容耦合电极耦合的中心线彼此平行放置，并且任意两个自电容耦合电极对的中心线也彼此平行放置。 本发明充分利用单层自电容触摸屏的简单工艺结构特点，以最低的制造成本实现多点触摸控制功能。

公开(公告)号：US20050048361A1

公开(公告)日：2005-03-03

申请号：US10932362

申请日：2004-08-31

申请人： Chaunfu Wang ,  WeiPing Liu ,  Hong Xiao ,  Yuchen He

发明人： Chaunfu Wang ,  WeiPing Liu ,  Hong Xiao ,  Yuchen He

IPC分类号： H01M2/02 ,  H01M2/04 ,  H01M2/08 ,  H01M2/18 ,  H01M2/26 ,  H01M4/02 ,  H01M4/13 ,  H01M4/131 ,  H01M4/58 ,  H01M4/66 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/058 ,  H01M10/0583

CPC分类号： H01M4/70 ,  H01M2/26 ,  H01M2/34 ,  H01M4/02 ,  H01M4/13 ,  H01M4/131 ,  H01M4/661 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0583 ,  H01M2004/021

摘要： A type of stacked lithium ion secondary battery is disclosed. Therein, the positive electrode is formed by smearing an active material on the surface of an aluminum foil body, where said active material includes lithium with attachable and detachable lithium ions and compound oxide(s) of transition metals; and a strip extending from said aluminum foil body is used as the conductor of the positive electrode. The negative electrode is formed by smearing an active material on the surface of a copper foil body, where said active material includes carbon material capable of attaching and detaching lithium ions; and a strip extending from said copper foil body is used as the conductor of the negative electrode. The positive and negative electrodes in plate form are arranged and stacked on the two sides of the separator forming said electrode core. The stacked lithium ion secondary battery can effectively use the internal space of the battery shell, increasing the capacity density and decreasing the battery's internal resistance; thereby improving the large current discharge characteristic of the lithium ion secondary battery.

摘要翻译： 公开了一种堆叠的锂离子二次电池。 其中，正极通过在铝箔体的表面上涂抹活性物质而形成，其中所述活性材料包括具有可附接和可分离的锂离子的锂和过渡金属的复合氧化物; 并且使用从所述铝箔体延伸的条作为正极的导体。 负极通过在铜箔体的表面上涂抹活性物质而形成，其中所述活性材料包括能够附着和分离锂离子的碳材料; 并且使用从所述铜箔体延伸的条作为负极的导体。 板状的正极和负极被布置和堆叠在形成所述电极芯的隔膜的两侧。 堆叠式锂离子二次电池可有效利用电池外壳的内部空间，提高电池容量密度，降低电池内阻; 从而提高锂离子二次电池的大电流放电特性。

公开(公告)号：US09260768B2

公开(公告)日：2016-02-16

申请号：US11567525

申请日：2006-12-06

申请人： Weiping Liu ,  Ning-Cheng Lee

发明人： Weiping Liu ,  Ning-Cheng Lee

IPC分类号： C22C13/00 ,  C22C13/02

CPC分类号： C22C13/00 ,  C22C13/02

摘要： Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably contain 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.

摘要翻译： 公开了具有改进的耐滴落冲击性的无铅焊料合金及其焊点。 在一个特定的示例性实施方案中，无铅焊料合金优选含有0.0-4.0wt。 ％的Ag，0.01-1.5wt。 ％的Cu，以下添加剂中的至少一种：Mn为0.001〜1.0重量％ ％，Ce为0.001-0.8wt。 ％，Y为0.001〜1.0重量％。 ％，Ti为0.001-0.8重量％ ％，Bi为0.01〜1.0重量％。 ％，剩余的Sn。