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    Lead-free solder alloys and solder joints thereof with improved drop impact resistance
    1.
    发明授权
    Lead-free solder alloys and solder joints thereof with improved drop impact resistance 有权
    无铅焊料合金及其焊点具有改善的耐滴落冲击性能

    公开(公告)号：US09260768B2

    公开(公告)日：2016-02-16

    申请号：US11567525

    申请日：2006-12-06

    申请人： Weiping Liu ,  Ning-Cheng Lee

    发明人： Weiping Liu ,  Ning-Cheng Lee

    IPC分类号： C22C13/00 ,  C22C13/02

    CPC分类号： C22C13/00 ,  C22C13/02

    摘要： Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably contain 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.

    摘要翻译： 公开了具有改进的耐滴落冲击性的无铅焊料合金及其焊点。 在一个特定的示例性实施方案中，无铅焊料合金优选含有0.0-4.0wt。 ％的Ag，0.01-1.5wt。 ％的Cu，以下添加剂中的至少一种：Mn为0.001〜1.0重量％ ％，Ce为0.001-0.8wt。 ％，Y为0.001〜1.0重量％。 ％，Ti为0.001-0.8重量％ ％，Bi为0.01〜1.0重量％。 ％，剩余的Sn。

    Heat dissipating paint with high thermal radiating capability
    3.
    发明授权
    Heat dissipating paint with high thermal radiating capability 有权
    具有高散热能力的散热油漆

    公开(公告)号：US09120930B2

    公开(公告)日：2015-09-01

    申请号：US13655276

    申请日：2012-10-18

    申请人： Sihai Chen ,  Ning-Cheng Lee

    发明人： Sihai Chen ,  Ning-Cheng Lee

    IPC分类号： C09D5/00 ,  C09D7/12

    CPC分类号： C09D5/00 ,  C09D7/61

    摘要： A high emissive paint comprises organic materials with different functional groups, one or more inorganic materials, and optionally other paint property adjusting agents. The infrared absorption range of the paint derives from organic functional groups, such as C—C, C—H, N—H, C—N, C—O and C—X groups, and the one or more inorganic materials. One or more inorganic materials may also be present as micro- or nano-sized particles.

    摘要翻译： 高发射性涂料包括具有不同官能团的有机材料，一种或多种无机材料，以及任选的其它涂料性质调节剂。 油漆的红外吸收范围来自有机官能团，如C-C，C-H，N-H，C-N，C-O和C-X基团，以及一种或多种无机材料。 一种或多种无机材料也可以作为微米或纳米尺寸的颗粒存在。

    Composite solder alloy preform
    4.
    发明授权
    Composite solder alloy preform 有权
    复合焊料合金预制件

    公开(公告)号：US08348139B2

    公开(公告)日：2013-01-08

    申请号：US12720532

    申请日：2010-03-09

    申请人： Weiping Liu ,  Ning-Cheng Lee

    发明人： Weiping Liu ,  Ning-Cheng Lee

    IPC分类号： B23K31/02

    CPC分类号： B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29083 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/15747 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  H01L2924/00

    摘要： Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.

    摘要翻译： 本发明的各种实施例提供了用于高温无铅焊接应用的叠层复合预制箔。 层叠复合预成型体箔由芯层的任一侧的高熔点，延性金属或合金芯层和低熔点焊料涂层构成。 在焊接期间，芯金属，液体焊料层和基底金属反应并消耗低熔点焊料相以形成高熔点金属间化合物相（IMC）。 所得到的焊点由在基板侧被IMC层夹持的延性芯层构成。 接头具有比初始焊料合金涂层的原始熔化温度高得多的熔融温度，允许随后安装封装的装置。

    Technique for increasing the compliance of tin-indium solders
    5.
    发明申请
    Technique for increasing the compliance of tin-indium solders 有权
    提高锡铟焊料顺应性的技术

    公开(公告)号：US20070048172A1

    公开(公告)日：2007-03-01

    申请号：US11360812

    申请日：2006-02-24

    申请人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

    发明人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

    IPC分类号： C22C13/00

    CPC分类号： C22C11/06 ,  B23K35/262 ,  C22C13/00

    摘要： A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.

    摘要翻译： 公开了一种提高锡铟焊料顺从性的技术。 在一个具体的示例性实施方案中，该技术可以实现为无铅焊料合金，其包含约58.0重量％至约99.998重量％的锡，约0.001重量％至约40.0重量％的铟和约0.001重量％至约2.0重量％ 重量％至少一种稀土元素。

    Anti-tombstoning lead free alloys for surface mount reflow soldering
    6.
    发明申请
    Anti-tombstoning lead free alloys for surface mount reflow soldering 审中-公开
    反墓碑无铅合金，用于表面贴装回流焊接

    公开(公告)号：US20050100474A1

    公开(公告)日：2005-05-12

    申请号：US10935118

    申请日：2004-09-08

    申请人： Benlih Huang ,  Ning-Cheng Lee

    发明人： Benlih Huang ,  Ning-Cheng Lee

    IPC分类号： B23K35/26 ,  C22C13/00 ,  H01L20060101 ,  H05K3/34

    CPC分类号： C22C13/00 ,  B23K35/262 ,  H05K3/3463 ,  H05K2201/10636 ,  Y02P70/611

    摘要： A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn—Ag—Cu solder alloys for minimizing the tombstoning effect of the present disclosure display high mass fraction during melting and prolonged melting as shown by a widened DSC peaks, that allows for a balanced surface tension on both ends of the chip component to develop. In accordance with further aspects of this exemplary embodiment, the alloys display a mass fraction of solid during melting greater than 20% and a DSC peak width greater than 8° C. using a 5° C./min scan rate. In accordance with further aspects of this exemplary embodiment, the alloy comprises on a weight basis Ag 1-4.5%, Cu 0.3-1% balanced with Sn.

    摘要翻译： 公开了一种包含锡，银和铜的无铅焊料合金组合物，以及用于最小化墓碑频率的回流焊接方法。 在一个具体的示例性实施例中，用于最小化本公开的墓碑效应的无铅Sn-Ag-Cu焊料合金在熔化和延长熔化期间显示高质量分数，如扩大的DSC峰所示，其允许平衡的表面张力 在芯片组件的两端进行开发。 根据该示例性实施方案的其它方面，合金在熔化时显示大于20％的固体的质量分数，并且使用5℃/ min扫描速率显示大于8℃的DSC峰宽。 根据本示例性实施方案的其它方面，合金的重量基础为Ag 1-4.5％，Cu为0.3-1％，与Sn平衡。

    Materials having increased mobility after heating
    7.
    发明授权
    Materials having increased mobility after heating 有权

    公开(公告)号：US10010981B2

    公开(公告)日：2018-07-03

    申请号：US12240396

    申请日：2008-09-29

    申请人： Ning-Cheng Lee ,  Runsheng Mao

    发明人： Ning-Cheng Lee ,  Runsheng Mao

    IPC分类号： B23K35/22 ,  B23K35/24

    CPC分类号： B23K35/22 ,  B23K35/24

    摘要： Materials having increased mobility after heating are disclosed. In one particular exemplary embodiment, the materials may be realized as a material which has reduced apparent molecular weight and/or viscosity and thus increased mobility after a heating process, and which consequently allows material residue to be more easily removed during subsequent cleaning processes. Such a material may be useful in any industrial process which requires heating the material followed by removing material residue.

    MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERIOR DROP SHOCK RELIABILITY
    8.
    发明申请
    MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERIOR DROP SHOCK RELIABILITY 有权
    MN DOPED SN-BASE焊接合金及其焊接接头，具有超级倾斜冲击可靠性

    公开(公告)号：US20120328361A1

    公开(公告)日：2012-12-27

    申请号：US13542586

    申请日：2012-07-05

    申请人： WEIPING LIU ,  Ning-Cheng Lee

    发明人： WEIPING LIU ,  Ning-Cheng Lee

    IPC分类号： C22C13/00 ,  B23K35/24

    CPC分类号： C22C13/00 ,  B23K35/0244 ,  B23K35/262 ,  C22C13/02 ,  Y10T403/479

    摘要： A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt. % Mn; and a remainder of Sn.

    摘要翻译： 公开了一种Sn-Ag-Cu基无铅焊料合金及其焊接接头，具有出色的跌落冲击可靠性。 焊料包含大于0wt。 ％且小于或等于约1.5wt。 ％Ag; 大于或等于约0.7wt。 ％且小于或等于约2.0wt。 ％Cu; 在大于或等于约0.001和小于或等于约0.2重量％之间。 ％Mn; 和Sn的剩余部分。