摘要:
The present invention provides a method for fabricating a MOS transistor (100) with suppression of edge transistor effect. In one embodiment of an NMOS, an elongate implant limb (110, HOa, 114) extends from each of two sidewalls (14a, 14b) of a p-type well (14) to partially wrap around each respective longitudinal end of the gate (20) and to overlay a portion thereof. In another embodiment, the elongate implant limb (110, 110a) extends into the drain/source drift region (32, 42). The NMOS transistor (100) thus fabricated allows the NMOS transistor to operate at relatively high voltages with reduced drain leakage current but with no additional masks or process time in the process integration.
摘要:
A power MOSFET includes a semiconductor substrate with an upper surface, a cavity of a first depth in the substrate whose sidewall extends to the upper surface, a dielectric liner in the cavity, a gate conductor within the dielectric liner extending to or above the upper surface, body region(s) within the substrate of a second depth, separated from the gate conductor in a lower cavity region by first portion(s) of the dielectric liner of a first thickness, and source region(s) within the body region(s) extending to a third depth that is less than the second depth. The source region(s) are separated from the gate conductor by a second portion of the dielectric liner of a second thickness at least in part greater than the first thickness. The dielectric liner has a protrusion extending laterally into the gate conductor away from the body region(s) at or less than the third depth.
摘要:
A power MOSFET includes a semiconductor substrate with an upper surface, a cavity of a first depth in the substrate whose sidewall extends to the upper surface, a dielectric liner in the cavity, a gate conductor within the dielectric liner extending to or above the upper surface, body region(s) within the substrate of a second depth, separated from the gate conductor in a lower cavity region by first portion(s) of the dielectric liner of a first thickness, and source region(s) within the body region(s) extending to a third depth that is less than the second depth. The source region(s) are separated from the gate conductor by a second portion of the dielectric liner of a second thickness at least in part greater than the first thickness. The dielectric liner has a protrusion extending laterally into the gate conductor away from the body region(s) at or less than the third depth.
摘要:
This invention belongs to the luminous flux measurement field, and especially relates to the equipment and method for LED's total luminous flux measurement with a narrow beam standard light source. The system for LED's total luminous flux measurement with a narrow beam standard light source in this invention comprises an integrating sphere, the light source, a narrow aperture fiber, a spectrometer and a driver for the light source. The light source is lighted by the driver. The narrow beam standard light source (both luminous flux standard and spectrum standard) is placed on the interior surface of integrating sphere, there is not any baffle in the sphere, and a narrow aperture fiber transfers the light to a multi-channel spectrometer which measures the spectrum distribution of LED and calculates its total luminous flux. The equipment in this invention is easy to use, has small error and low cost, and can achieve accurate results for LED's total luminous flux.
摘要:
A power MOSFET includes a semiconductor substrate with an upper surface, a cavity of a first depth in the substrate whose sidewall extends to the upper surface, a dielectric liner in the cavity, a gate conductor within the dielectric liner extending to or above the upper surface, body region(s) within the substrate of a second depth, separated from the gate conductor in a lower cavity region by first portion(s) of the dielectric liner of a first thickness, and source region(s) within the body region(s) extending to a third depth that is less than the second depth. The source region(s) are separated from the gate conductor by a second portion of the dielectric liner of a second thickness at least in part greater than the first thickness. The dielectric liner has a protrusion extending laterally into the gate conductor away from the body region(s) at or less than the third depth.
摘要:
This invention belongs to the luminous flux measurement field, and especially relates to the equipment and method for LED's total luminous flux measurement with a narrow beam standard light source. The system for LED's total luminous flux measurement with a narrow beam standard light source in this invention comprises an integrating sphere, the light source, a narrow aperture fiber, a spectrometer and a driver for the light source. The light source is lighted by the driver. The narrow beam standard light source (both luminous flux standard and spectrum standard) is placed on the interior surface of integrating sphere, there is not any baffle in the sphere, and a narrow aperture fiber transfers the light to a multi-channel spectrometer which measures the spectrum distribution of LED and calculates its total luminous flux. The equipment in this invention is easy to use, has small error and low cost, and can achieve accurate results for LED's total luminous flux.
摘要:
A power MOSFET includes a semiconductor substrate with an upper surface, a cavity of a first depth in the substrate whose sidewall extends to the upper surface, a dielectric liner in the cavity, a gate conductor within the dielectric liner extending to or above the upper surface, body region(s) within the substrate of a second depth, separated from the gate conductor in a lower cavity region by first portion(s) of the dielectric liner of a first thickness, and source region(s) within the body region(s) extending to a third depth that is less than the second depth. The source region(s) are separated from the gate conductor by a second portion of the dielectric liner of a second thickness at least in part greater than the first thickness. The dielectric liner has a protrusion extending laterally into the gate conductor away from the body region(s) at or less than the third depth.
摘要:
A power MOSFET has a main-FET (MFET) and an embedded current sensing-FET (SFET). MFET gate runners are coupled to SFET gate runners by isolation gate runners (IGRs) in a buffer space between the MFET and the SFET. In one embodiment, n IGRs (i=1 to n) couple n+1 gates of a first portion of the MFET (304) to n gates of the SFET. The IGRs have zigzagged central portions where each SFET gate runner is coupled via the IGRs to two MFET gate runners. The zigzagged central portions provide barriers that block parasitic leakage paths, between sources of the SFET and sources of the MFET, for all IGRs except the outboard sides of the first and last IGRs. These may be blocked by increasing the body doping in regions surrounding the remaining leakage paths. The IGRs have substantially no source regions.
摘要:
A trench gate transistor is formed from a semiconductor substrate with its upper surface covered in an oxide dielectric layer. The trench gate transistor has a drain region, a body region, source region and a trench lined with a gate insulator that electrically insulates a conductive gate electrode formed in the trench from the body region. The body region has a sloping upper surface that extends away from the trench towards the drain region. The sloping upper surface is formed by exposing the oxide dielectric layer to an oxidized atmosphere, through an opening in a mask, so as to form a dielectric region. The dielectric region includes the oxide dielectric layer and a sacrificial area of the semiconductor substrate.
摘要:
A power MOSFET has a main-FET (MFET) and an embedded current sensing-FET (SFET). MFET gate runners are coupled to SFET gate runners by isolation gate runners (IGRs) in a buffer space between the MFET and the SFET. In one embodiment, n IGRs (i=1 to n) couple n+1 gates of a first portion of the MFET (304) to n gates of the SFET. The IGRs have zigzagged central portions where each SFET gate runner is coupled via the IGRs to two MFET gate runners. The zigzagged central portions provide barriers that block parasitic leakage paths, between sources of the SFET and sources of the MFET, for all IGRs except the outboard sides of the first and last IGRs. These may be blocked by increasing the body doping in regions surrounding the remaining leakage paths. The IGRs have substantially no source regions.