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公开(公告)号：US09502374B2
公开(公告)日：2016-11-22
申请号：US13658957
申请日：2012-10-24
Applicant: Keng Yew Song , Wai Wah Lee , Yi Bin Wang , Wen Hua Guo , Xin Wei Zhang
Inventor： Keng Yew Song , Wai Wah Lee , Yi Bin Wang , Wen Hua Guo , Xin Wei Zhang
CPC classification number: H01L24/78 , B23K20/007 , B23K35/0261 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/48477 , H01L2224/78301 , H01L2224/78611 , H01L2224/78621 , H01L2224/85045 , H01L2224/85051 , H01L2224/85205 , H01L2924/00014 , H01L2924/00
Abstract: A capillary is utilized to form the wedge wire bond comprised in a wire interconnection. A wire holding device is located above a wire clamp and the capillary to secure the wire while the wire clamp is open and not clamping onto the wire. The wire clamp and the capillary may be lifted relative to the wire in a direction away from the wedge wire bond and towards the wire holding device so as to pay out a length of wire from the capillary. At a predetermined height of the capillary, the wire clamp is closed to clamp onto the wire, and thereafter, the capillary and wire clamp may be moved further away from the wedge wire bond to cause the wire to break away from the wedge wire bond and to form the wire tail with a desired length extending from the capillary.
Abstract translation: 利用毛细管形成包括在电线互连中的楔形线接合。 电线夹持装置位于线夹和毛细管上方，以固定线，而线钳打开而不夹在线上。 线夹和毛细管可以相对于导线沿远离楔形线接合的方向并且朝着线保持装置提升，从而从毛细管支付一定长度的线。 在毛细管的预定高度处，线夹被封闭以夹紧在线上，此后，毛细管和线夹可以进一步远离楔形线接合，以使线从楔形线接合处脱离，并且 以形成从毛细管延伸的期望长度的线尾。
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公开(公告)号：US20140209663A1
公开(公告)日：2014-07-31
申请号：US14162336
申请日：2014-01-23
Applicant: Keng Yew SONG , Wai Wah LEE , Yi Bin WANG
Inventor： Keng Yew SONG , Wai Wah LEE , Yi Bin WANG
IPC: H01L23/00
CPC classification number: H01L24/78 , H01L24/48 , H01L24/85 , H01L2224/48247 , H01L2224/78268 , H01L2224/78301 , H01L2224/78801 , H01L2224/85045 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/12042 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
Abstract: Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion. Specifically, the processor is configured to derive at least one correlation between the measured deformation of the bonding portion and an operating parameter of the wire bonder; compare the at least one derived correlation against a predetermined correlation between the operating parameter of the wire bonder and a desired deformation of the bonding portion; and calibrate the operating parameter of the wire bonder based on the comparison between the at least one derived correlation and the predetermined correlation of the deformation of the bonding portion against the operating parameter of the wire bonder. A method of calibrating a wire bonder is also disclosed.
Abstract translation: 公开了一种引线键合机，包括：处理器; 耦合到所述处理器的接合头，所述处理器被配置为控制所述接合头的运动; 粘合工具安装到接合头，所述接合工具可由所述接合头驱动，以在半导体管芯和使用接合线安装所述半导体管芯的衬底之间形成电互连; 以及耦合到所述接合头的测量装置，所述测量装置可操作以在所述接合工具由所述接合头驱动时测量所述接合线的接合部的变形，以通过所述接合部将所述接合线连接到所述半导体管芯 。 具体地，处理器被配置为导出测量的接合部分的变形与引线接合器的操作参数之间的至少一个相关性; 将所述至少一个导出相关性与所述引线接合器的操作参数与所述接合部分的期望变形之间的预定相关性进行比较; 并且基于所述至少一个导出的相关性与所述接合部的变形与所述引线接合器的操作参数的预定相关性之间的比较来校准所述引线接合器的操作参数。 还公开了一种校准引线接合器的方法。
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Patent Agency Ranking
公开(公告)号：US20060011710A1
公开(公告)日：2006-01-19
申请号：US10891342
申请日：2004-07-13
Applicant: Wai Wah Lee , Chia Yen Cho
Inventor： Wai Wah Lee , Chia Yen Cho
IPC: B23K31/00
CPC classification number: H01L24/85 , B23K20/004 , H01L24/48 , H01L24/78 , H01L2224/05554 , H01L2224/05599 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/78301 , H01L2224/85099 , H01L2224/85181 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/20752 , H01L2224/45099 , H01L2924/00
Abstract: A method of forming a wire connection using a bonding tool is provided. A first bond is first formed from a bonding wire fed from the bonding tool at a first bonding point. The bonding wire is then extended from the first bond while moving the bonding tool from the first bonding point towards a second bonding point. Thereafter, the bonding wire is mechanically deformed by contacting the bonding tool against a support surface and the bonding tool is moved in a direction away from the first bond to pull the bonding wire before forming a second bond with the bonding tool.
Abstract translation: 提供了使用接合工具形成电线连接的方法。 第一接合首先由在第一接合点从接合工具馈送的接合线形成。 然后，接合线从第一接合部延伸，同时将接合工具从第一接合点朝向第二接合点移动。 此后，通过使接合工具抵靠支撑表面接合接合线而使机械变形，并且在与接合工具形成第二接合之前，接合工具沿远离第一接合的方向移动以拉动接合线。
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公开(公告)号：US09314869B2
公开(公告)日：2016-04-19
申请号：US13350363
申请日：2012-01-13
Applicant: Wai Wah Lee , Jun Feng Li , Wei Boon Wong , Soo Kin Kenny Tan
Inventor： Wai Wah Lee , Jun Feng Li , Wei Boon Wong , Soo Kin Kenny Tan
CPC classification number: B23K20/007 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/48091 , H01L2224/78268 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01327 , H01L2924/12036 , H01L2224/45099 , H01L2224/484 , H01L2924/00
Abstract: A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.
Abstract translation: 公开了一种从接合故障恢复接合装置以恢复用于半导体芯片制造的正常操作状态的方法。 接合装置包括：i）用于将导线接合在半导体芯片和基板之间的接合工具; 和ii）位置传感器。 具体地说，该方法包括以下步骤：a）位置传感器确定接合工具在接合工具接触表面时的位置，以将线接合到衬底; b）接合装置基于接合工具的位置检测由半导体从基板脱离而引起的接合故障; 以及c）所述接合装置将所述半导体芯片与所述导线分开。
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公开(公告)号：US20130098877A1
公开(公告)日：2013-04-25
申请号：US13658957
申请日：2012-10-24
Applicant: Keng Yew SONG , Wai Wah LEE , Yi Bin WANG , Wen Hua GUO , Xin Wei ZHANG
Inventor： Keng Yew SONG , Wai Wah LEE , Yi Bin WANG , Wen Hua GUO , Xin Wei ZHANG
CPC classification number: H01L24/78 , B23K20/007 , B23K35/0261 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/48477 , H01L2224/78301 , H01L2224/78611 , H01L2224/78621 , H01L2224/85045 , H01L2224/85051 , H01L2224/85205 , H01L2924/00014 , H01L2924/00
Abstract: A capillary is utilized to form the wedge wire bond comprised in a wire interconnection. A wire holding device is located above a wire clamp and the capillary to secure the wire while the wire clamp is open and not clamping onto the wire. The wire clamp and the capillary may be lifted relative to the wire in a direction away from the wedge wire bond and towards the wire holding device so as to pay out a length of wire from the capillary. At a predetermined height of the capillary, the wire clamp is closed to clamp onto the wire, and thereafter, the capillary and wire clamp may be moved further away from the wedge wire bond to cause the wire to break away from the wedge wire bond and to form the wire tail with a desired length extending from the capillary.
Abstract translation: 利用毛细管形成包括在电线互连中的楔形线接合。 电线夹持装置位于电线夹和毛细管上方，以固定电线，同时电线夹打开而不夹在电线上。 线夹和毛细管可以相对于导线沿远离楔形线接合的方向并且朝着线保持装置提升，从而从毛细管支付一定长度的线。 在毛细管的预定高度处，线夹被封闭以夹紧在线上，此后，毛细管和线夹可以进一步远离楔形线接合，以使线从楔形线接合处脱离，并且 以形成从毛细管延伸的期望长度的线尾。
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公开(公告)号：US09620477B2
公开(公告)日：2017-04-11
申请号：US14162336
申请日：2014-01-23
Applicant: Keng Yew Song , Wai Wah Lee , Yi Bin Wang
Inventor： Keng Yew Song , Wai Wah Lee , Yi Bin Wang
CPC classification number: H01L24/78 , H01L24/48 , H01L24/85 , H01L2224/48247 , H01L2224/78268 , H01L2224/78301 , H01L2224/78801 , H01L2224/85045 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/12042 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
Abstract: Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion. Specifically, the processor is configured to derive at least one correlation between the measured deformation of the bonding portion and an operating parameter of the wire bonder; compare the at least one derived correlation against a predetermined correlation between the operating parameter of the wire bonder and a desired deformation of the bonding portion; and calibrate the operating parameter of the wire bonder based on the comparison between the at least one derived correlation and the predetermined correlation of the deformation of the bonding portion against the operating parameter of the wire bonder. A method of calibrating a wire bonder is also disclosed.
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公开(公告)号：US20130180957A1
公开(公告)日：2013-07-18
申请号：US13350363
申请日：2012-01-13
Applicant: Wai Wah LEE , Jun Feng LI , Wei Boon WONG , Soo Kin Kenny TAN
Inventor： Wai Wah LEE , Jun Feng LI , Wei Boon WONG , Soo Kin Kenny TAN
CPC classification number: B23K20/007 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/48091 , H01L2224/78268 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01327 , H01L2924/12036 , H01L2224/45099 , H01L2224/484 , H01L2924/00
Abstract: A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.
Abstract translation: 公开了一种从接合故障恢复接合装置以恢复用于半导体芯片制造的正常操作状态的方法。 接合装置包括：i）用于将导线接合在半导体芯片和基板之间的接合工具; 和ii）位置传感器。 具体地说，该方法包括以下步骤：a）位置传感器确定接合工具在接合工具接触表面时的位置，以将线接合到衬底; b）接合装置基于接合工具的位置检测由半导体从基板脱离而引起的接合故障; 以及c）所述接合装置将所述半导体芯片与所述导线分开。
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