公开(公告)号：US08502151B2

公开(公告)日：2013-08-06

申请号：US12697276

申请日：2010-01-31

申请人： Yufeng Yao ,  Junhua He ,  Wee Sin Tan

发明人： Yufeng Yao ,  Junhua He ,  Wee Sin Tan

IPC分类号： G01J5/20 ,  G01J5/02 ,  H01L27/146 ,  H01L31/0232 ,  H01L31/0203 ,  H01L21/00

CPC分类号： H01L31/0203 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/173 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3025 ,  H01L2924/00

摘要： Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

摘要翻译： 公开了具有引线框并且没有上覆金属屏蔽的光学接近传感器的各种实施例。 在一个实施例中，光发射器和光检测器安装在引线框架上，该引线框架包括具有上表面和下表面的多个分立的导电元件，至少一些元件不彼此电连接。 集成电路芯片附着在引线框架的下侧。 在光检测器和光发射器和引线框架的部分上模制光学透射的红外通过化合物。 接下来，在透光性红外线通过化合物上模制光学上不透光的红外线切割化合物，以提供没有金属屏蔽但具有非常低的串扰特性的光学接近传感器。

公开(公告)号：US20110186736A1

公开(公告)日：2011-08-04

申请号：US12697276

申请日：2010-01-31

申请人： Yufeng Yao ,  Junhua He ,  Wee Sin Tan

发明人： Yufeng Yao ,  Junhua He ,  Wee Sin Tan

IPC分类号： H01L31/167 ,  H01L31/0203 ,  H01L31/12

CPC分类号： H01L31/0203 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/173 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3025 ,  H01L2924/00

摘要： Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

摘要翻译： 公开了具有引线框并且没有上覆金属屏蔽的光学接近传感器的各种实施例。 在一个实施例中，光发射器和光检测器安装在引线框架上，该引线框架包括具有上表面和下表面的多个分立的导电元件，至少一些元件不彼此电连接。 集成电路芯片附着在引线框架的下侧。 在光检测器和光发射器和引线框架的部分上模制光学透射的红外通过化合物。 接下来，在透光性红外线通过化合物上模制光学上不透光的红外线切割化合物，以提供没有金属屏蔽但具有非常低的串扰特性的光学接近传感器。

公开(公告)号：US20110297832A1

公开(公告)日：2011-12-08

申请号：US12796475

申请日：2010-06-08

申请人： Yufeng Yao ,  Sze Ping Ong ,  Wee Sin Tan

发明人： Yufeng Yao ,  Sze Ping Ong ,  Wee Sin Tan

IPC分类号： H01L31/16 ,  B29C65/00 ,  H05K3/00 ,  B23K31/02

CPC分类号： H01L25/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2017/9455 ,  H05K1/0216 ,  H05K1/183 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/10151 ,  H01L2924/00

摘要： A proximity sensor includes a printed circuit board (PCB); a first cup and a second cup embedded in the PCB; an electromagnetic radiation transmitter operably mounted in the first cup; and an electromagnetic radiation receiver operably mounted in the second cup.

摘要翻译： 接近传感器包括印刷电路板（PCB）; 嵌入PCB中的第一杯和第二杯; 可操作地安装在第一杯中的电磁辐射发射器; 以及可操作地安装在第二杯中的电磁辐射接收器。

公开(公告)号：US20110057108A1

公开(公告)日：2011-03-10

申请号：US12557438

申请日：2009-09-10

申请人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

发明人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

IPC分类号： H01L27/14 ,  H01L31/167

CPC分类号： H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/3025 ,  H03K17/941 ,  H03K2017/9455 ,  H01L2924/00014 ,  H01L2924/00

摘要： Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components.

摘要翻译： 公开了具有球栅阵列和窗口或有孔基板的紧凑型光学接近传感器的各种实施例。 在一个实施例中，光学接近传感器包括印刷电路板（“PCB”）基板，其包括孔和设置在其上的电触点的下表面，安装在基板的上表面上的红外光发射器和红外光检测器， 至少部分位于孔内的集成电路，设置在集成电路和衬底的部分之间的模制化合物，安装在集成电路的上表面上的环境光检测器，设置在其上的第一和第二模制红外光通过部件， 分别覆盖红外光发射器和红外光检测器，以及设置在第一和第二红外光通过部件的部分之间的模制的红外光切割部件。

公开(公告)号：US20110057104A1

公开(公告)日：2011-03-10

申请号：US12631804

申请日：2009-12-04

申请人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

发明人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

IPC分类号： H01J40/14 ,  G01J5/00 ,  H05K3/36

CPC分类号： G01J1/32 ,  G01J1/44 ,  H01L2224/48465 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00

摘要： Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, alight emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded to over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

摘要翻译： 公开了一种小型化光学接近传感器的各种实施例。 在一个实施例中，环境光传感器和光检测器安装在第一和第二间隔件上，第一和第二间隔件依次安装到附接到基板的集成电路芯片的顶表面。 在环境光传感器，光检测器，集成电路，发射器和衬底的周边部分上模制透光的红外线通过化合物。 接下来，将光学上不透光的红外线切割化合物模制到透光性红外线通过化合物上方，以提供不具有金属屏蔽但呈现非常低串扰特性的小型化光学接近传感器。

公开(公告)号：US08350216B2

公开(公告)日：2013-01-08

申请号：US12631804

申请日：2009-12-04

申请人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

发明人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

IPC分类号： G01J5/02

CPC分类号： G01J1/32 ,  G01J1/44 ,  H01L2224/48465 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00

摘要： Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, a light emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

摘要翻译： 公开了一种小型化光学接近传感器的各种实施例。 在一个实施例中，环境光传感器和光检测器安装在第一和第二间隔件上，第一和第二间隔件依次安装到附接到基板的集成电路芯片的顶表面。 在环境光传感器，光检测器，集成电路，光发射器和衬底的周边部分上模制光学透射的红外线通过化合物。 接下来，将光学上不透光的红外线切割化合物模制在光学透射的红外线通过化合物上，以提供不具有金属屏蔽但呈现非常低的串扰特性的小型化的光学接近传感器。

公开(公告)号：US08742350B2

公开(公告)日：2014-06-03

申请号：US12796475

申请日：2010-06-08

申请人： Yufeng Yao ,  Sze Ping Ong ,  Wee Sin Tan

发明人： Yufeng Yao ,  Sze Ping Ong ,  Wee Sin Tan

IPC分类号： G01J5/00

CPC分类号： H01L25/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2017/9455 ,  H05K1/0216 ,  H05K1/183 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/10151 ,  H01L2924/00

摘要： A proximity sensor includes a printed circuit board (PCB); a first cup and a second cup embedded in the PCB; an electromagnetic radiation transmitter operably mounted in the first cup; and an electromagnetic radiation receiver operably mounted in the second cup.

摘要翻译： 接近传感器包括印刷电路板（PCB）; 嵌入PCB中的第一杯和第二杯; 可操作地安装在第一杯中的电磁辐射发射器; 以及可操作地安装在第二杯中的电磁辐射接收器。

公开(公告)号：US08716665B2

公开(公告)日：2014-05-06

申请号：US12557438

申请日：2009-09-10

申请人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

发明人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

IPC分类号： G01J5/00 ,  G01J5/02 ,  G01J5/04

CPC分类号： H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/3025 ,  H03K17/941 ,  H03K2017/9455 ,  H01L2924/00014 ,  H01L2924/00

摘要： Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components.

摘要翻译： 公开了具有球栅阵列和窗口或有孔基板的紧凑型光学接近传感器的各种实施例。 在一个实施例中，光学接近传感器包括印刷电路板（“PCB”）基板，其包括孔和设置在其上的电触点的下表面，安装在基板的上表面上的红外光发射器和红外光检测器， 至少部分位于孔内的集成电路，设置在集成电路和衬底的部分之间的模制化合物，安装在集成电路的上表面上的环境光检测器，设置在其上的第一和第二模制红外光通过部件， 分别覆盖红外光发射器和红外光检测器，以及设置在第一和第二红外光通过部件的部分之间的模制的红外光切割部件。

公开(公告)号：US08575537B2

公开(公告)日：2013-11-05

申请号：US12964227

申请日：2010-12-09

申请人： Yufeng Yao ,  Sze Ping Ong ,  Rani Ramamoorthy Saravanan ,  Wee Sin Tan

发明人： Yufeng Yao ,  Sze Ping Ong ,  Rani Ramamoorthy Saravanan ,  Wee Sin Tan

IPC分类号： G06M7/00

CPC分类号： H03K17/941 ,  H03K2217/94108 ,  H03K2217/94111 ,  H03K2217/94112 ,  H03K2217/94116

摘要： A proximity sensor device is provided in compact unit that has the ability to sense or monitor in different directions, such as sensing or monitoring in both the vertical and horizontal directions. Methods are also provided. In an illustrative embodiment, the proximity sensor device includes a first transmitting/receiving pair and a second transmitting/receiving pair on a printed circuit board along with an IC to control the transmitters and receivers, as well as, in some embodiments, to provide signal filtering, amplification or other desired features.

摘要翻译： 接近传感器装置以紧凑的单元提供，其具有在不同方向上感测或监测的能力，例如在垂直和水平方向上的感测或监测。 还提供了方法。 在说明性实施例中，接近传感器装置包括印刷电路板上的第一发送/接收对和第二发送/接收对以及IC以控制发射机和接收机，以及在一些实施例中提供信号 滤波，放大或其他所需特征。

公开(公告)号：US20120145932A1

公开(公告)日：2012-06-14

申请号：US12964227

申请日：2010-12-09

申请人： Yufeng Yao ,  Sze Ping Ong ,  Rani Ramamoorthy Saravanan ,  Wee Sin Tan

发明人： Yufeng Yao ,  Sze Ping Ong ,  Rani Ramamoorthy Saravanan ,  Wee Sin Tan

IPC分类号： H01J40/14

CPC分类号： H03K17/941 ,  H03K2217/94108 ,  H03K2217/94111 ,  H03K2217/94112 ,  H03K2217/94116

摘要： A proximity sensor device is provided in compact unit that has the ability to sense or monitor in different directions, such as sensing or monitoring in both the vertical and horizontal directions. Methods are also provided. In an illustrative embodiment, the proximity sensor device includes a first transmitting/receiving pair and a second transmitting/receiving pair on a printed circuit board along with an IC to control the transmitters and receivers, as well as, in some embodiments, to provide signal filtering, amplification or other desired features.

摘要翻译： 接近传感器装置以紧凑的单元提供，其具有在不同方向上感测或监测的能力，例如在垂直和水平方向上的感测或监测。 还提供了方法。 在说明性实施例中，接近传感器装置包括印刷电路板上的第一发送/接收对和第二发送/接收对以及IC以控制发射机和接收机，以及在一些实施例中提供信号 滤波，放大或其他所需特征。