摘要:
Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要:
A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a light-emitting diode chip disposed thereon. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the light-emitting diode chip. In one embodiment, the lens module comprises a glass substrate having a first cavity formed at a first surface thereof, a fluorescent layer formed over a portion of a first surface exposed by the first cavity, facing the light-emitting diode chip, and a molded lens formed over a second surface of the glass carrier opposing to the first surface.
摘要:
A process for the removal of lead content in anode slime by subjecting the latter to primary and secondary leach in a medium of an ammonium acetate solution at a temperature not exceeding 80.degree. C. Whereby lead dissolution is maximized and other metals are minimized. Separate the leach solution from the undissolved slime residue, crystallize lead from the separated leach solution and recover the crystallized lead acetate.
摘要:
A solar cell module is provided, including a fixture with a solar cell wafer therein and a light-transmitting component formed in the fixture. The solar cell wafer comprises a semiconductor substrate with a plurality of photovoltaic elements formed thereon, wherein the photovoltaic elements are arranged in an array and a plurality of microlenses superimposed over the semiconductor substrate. A pitch between a center of the microlens and a center of the photovoltaic element thereunder increases from a center portion of the array of the photovoltaic elements toward an edge portion of the array of the photovoltaic elements. The light-transmitting component is opposite to the microlenses and partially changes a direction of incident light collected from an ambient from not being perpendicular to a top surface of the microlenses.
摘要:
An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.
摘要:
An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.
摘要:
A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a light-emitting diode chip disposed thereon. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the light-emitting diode chip. In one embodiment, the lens module comprises a glass substrate having a first cavity formed at a first surface thereof, a fluorescent layer formed over a portion of a first surface exposed by the first cavity, facing the light-emitting diode chip, and a molded lens formed over a second surface of the glass carrier opposing to the first surface.
摘要:
An image sensor for light field devices includes a plurality of sub-microlenses, a space layer, and a plurality of main microlenses. The space layer is disposed on the sub-microlenses, and the main microlenses are disposed on the space layer. The diameter of each of the main microlenses exceeds that of each of the sub-microlenses.
摘要:
Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要:
A hydrometallurgical process for recovering precious metals, such as gold, silver, selenium, and tellurium etc. from anode slime has been developed and tested successfully. The process comprises three major unit operations: leaching, liquid-liquid extraction, and reduction. The decopperized anode slime is first leached with nitric acid at an elevated temperature to obtain a leach solution containing at least about 95% by weight of the silver content, 96% by weight of the selenium content and 76% by weight of the tellurium content of the decopperized anode slime. Silver in the nitric acid leach solution is recovered in the form of silver chloride. Subsequent to the recovery of silver chloride, the selenium, tellurium, copper and other impurities-containing solution is denitrated and chlorinated by a liquid-liquid extraction technique. This selenium, tellurium, copper and other impurities-containing chloride solution is treated to separate tellurium from selenium, copper and other impurities by a liquid-liquid extraction technique. Selenium and tellurium are then recovered individually by passing sulfur dioxide through the selenium-containing and tellurium-containing solutions. The nitric acid leach residue is treated with aqua regia to leach gold and other impurities at an elevated temperature for a period of about 1 to 4 hours. The gold-containing solution is sent to separate gold from other impurities by a liquid-liquid extraction technique. Gold with a purity of greater than 99.9% is recovered by introducing a reducing agent to the gold-loaded organic extractant at an elevated temperature for a period of about 2 to 4 hours. This newly developed process is pollution-free, energy-saving, and economic to compare with conventional pyrometallurgical processes.