公开(公告)号：US20140183334A1

公开(公告)日：2014-07-03

申请号：US13733691

申请日：2013-01-03

申请人： Wei-Ko WANG ,  Chin-Ching CHANG ,  Chia-Hui WU ,  Chien-Hsiung HUANG ,  Cheng-Xuan LIN ,  Chieh-Yuan CHENG ,  Chang Wei CHEN

发明人： Wei-Ko WANG ,  Chin-Ching CHANG ,  Chia-Hui WU ,  Chien-Hsiung HUANG ,  Cheng-Xuan LIN ,  Chieh-Yuan CHENG ,  Chang Wei CHEN

IPC分类号： H01L27/146

CPC分类号： H01L27/14627 ,  H01L27/14605 ,  H01L27/14685

摘要： An image sensor for light field devices includes a plurality of sub-microlenses, a space layer, and a plurality of main microlenses. The space layer is disposed on the sub-microlenses, and the main microlenses are disposed on the space layer. The diameter of each of the main microlenses exceeds that of each of the sub-microlenses.

摘要翻译： 用于光场器件的图像传感器包括多个亚微透镜，空间层和多个主微透镜。 空间层设置在子微透镜上，并且主微透镜设置在空间层上。 每个主要微透镜的直径都超过每个亚微透镜的直径。

公开(公告)号：US20140138519A1

公开(公告)日：2014-05-22

申请号：US13682389

申请日：2012-11-20

申请人： Wei-Ko WANG ,  Chin-Ching CHANG ,  Chia-Hui WU ,  Chien-Hsiung HUANG ,  Cheng-Xuan LIN ,  Chang Wei CHEN

发明人： Wei-Ko WANG ,  Chin-Ching CHANG ,  Chia-Hui WU ,  Chien-Hsiung HUANG ,  Cheng-Xuan LIN ,  Chang Wei CHEN

IPC分类号： G01J3/51 ,  G01C3/08

CPC分类号： G01S7/4816 ,  G01S17/023 ,  G01S17/89 ,  H01L27/14621 ,  H01L27/14629 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14649

摘要： An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.

摘要翻译： 提供了一种图像感测装置。 图像感测装置包括：包括双带通过滤光器和红外滤光器的滤光器阵列; 放置在双波段通过滤波器之下的RGB像素阵列; 以及与RGB像素阵列相邻并置于双波段通过滤波器和红外滤波器之下的TOF像素阵列，其中双波段通过滤波器和红外线通过滤波器的组合仅允许红外区域中的入射光 传递给ToF像素阵列。

公开(公告)号：US20130118676A1

公开(公告)日：2013-05-16

申请号：US13551041

申请日：2012-07-17

申请人： Yuan-Chen LIANG ,  Chia-Hui WU ,  Hung-Ta LEE ,  Yi-Chun LIN ,  Li-Chuan CHIEN ,  Kuo-Hsiang HSU

发明人： Yuan-Chen LIANG ,  Chia-Hui WU ,  Hung-Ta LEE ,  Yi-Chun LIN ,  Li-Chuan CHIEN ,  Kuo-Hsiang HSU

IPC分类号： B32B38/10 ,  B32B38/06

CPC分类号： H03K17/955 ,  H03K2017/9602 ,  H03K2217/960755 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T156/10 ,  Y10T156/1039 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/108

摘要： The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.

摘要翻译： 用于制造适于附接到移动设备的接近感测模块的方法的步骤包括：（a）图案化上导电膜以形成图案化的导电膜，其包括适于电气的上连接焊盘 连接到移动设备的电路板上的相应触点，以​​及电连接到上连接焊盘的感应电路图案; （b）将粘合片粘附到图案化的导电膜上; 和（c）在粘合片中形成通孔，使得上连接垫从通孔露出。

公开(公告)号：US20060251873A1

公开(公告)日：2006-11-09

申请号：US11379744

申请日：2006-04-21

申请人： Chia-Hui WU ,  Pai-Sheng Cheng ,  Hung-Yi Wang

发明人： Chia-Hui WU ,  Pai-Sheng Cheng ,  Hung-Yi Wang

IPC分类号： B32B3/00 ,  B32B7/00

CPC分类号： H05K3/108 ,  H05K1/0393 ,  H05K3/061 ,  H05K3/24 ,  H05K3/388 ,  H05K2203/0542 ,  H05K2203/1476 ,  Y10T428/24917

摘要： A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer.

摘要翻译： 提供一种制造薄膜印刷电路板的方法。 提供由聚酰亚胺基板，合金层和第一铜层构成的薄膜基板。 执行第一光刻和蚀刻工艺以对铜层和合金层进行图案化，并且在聚酰亚胺基板上形成多个导线结构。 在聚酰亚胺基板和导线结构上形成第二铜层。 执行第二光刻和蚀刻工艺以对第二铜层进行图案化。