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1.发明授权Advanced quad flat non-leaded package structure and manufacturing method thereof 有权先进的四边形扁平无铅封装结构及其制造方法公开(公告)号：US08237250B2
公开(公告)日：2012-08-07
申请号：US12425635
申请日：2009-04-17
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/4832 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4911 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The leads include first leads disposed around the die pad, second leads disposed around the first leads and at least an embedded lead portion between the first leads and the second leads. The wires are disposed between the chip, the first leads and the embedded lead portion. The advanced quad flat non-leaded package structures designed with the embedded lead portion can provide better electrical connection.
摘要翻译： 先进的四边形扁平无铅封装结构包括载体，芯片，多根导线和模塑料。 载体包括管芯焊盘和多个引线。 引线包括围绕芯片焊盘设置的第一引线，围绕第一引线设置的第二引线和至少在第一引线和第二引线之间的嵌入引线部分。 电线布置在芯片，第一引线和嵌入引线部分之间。 采用嵌入式引线部分设计的先进的四边形扁平非引线封装结构可以提供更好的电气连接。
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公开(公告)号：US08124447B2
公开(公告)日：2012-02-28
申请号：US12547787
申请日：2009-08-26
IPC分类号： H01L21/00
CPC分类号： H01L21/4832 , H01L21/565 , H01L23/3107 , H01L23/49582 , H01L24/28 , H01L24/48 , H01L24/92 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/484 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability.
摘要翻译： 先进的四边形扁平非铅封装的制造方法包括在用于限定接触端子的背面蚀刻工艺之前执行预切割工艺。 预切割过程确保了单个接触端子的隔离，并提高了封装的可靠性。
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3.发明申请ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权先进的四边平面非引线封装结构及其制造方法公开(公告)号：US20100258934A1
公开(公告)日：2010-10-14
申请号：US12550645
申请日：2009-08-31
CPC分类号： H01L21/4832 , H01L21/565 , H01L23/3107 , H01L23/49582 , H01L24/28 , H01L24/48 , H01L24/92 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/484 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： The advanced quad flat non-leaded package structure includes a carrier having a die pad and a plurality of leads, at least a chip, a plurality of wires, and a molding compound. The rough surface of the carrier enhances the adhesion between the carrier and the surrounding molding compound.
摘要翻译： 先进的四边形扁平非铅封装结构包括具有管芯焊盘和多个引线，至少芯片，多根电线和模塑料的载体。 载体的粗糙表面增强了载体和周围模塑料之间的粘合性。
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公开(公告)号：US20100258920A1
公开(公告)日：2010-10-14
申请号：US12547787
申请日：2009-08-26
IPC分类号： H01L23/495 , H01L21/60 , H01L21/56
CPC分类号： H01L21/4832 , H01L21/565 , H01L23/3107 , H01L23/49582 , H01L24/28 , H01L24/48 , H01L24/92 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/484 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： The manufacturing method of advanced quad flat non-leaded packages includes performing a pre-cutting process prior to the backside etching process for defining the contact terminals. The pre-cutting process ensures the isolation of individual contact terminals and improves the package reliability.
摘要翻译： 先进的四边形扁平非铅封装的制造方法包括在用于限定接触端子的背面蚀刻工艺之前执行预切割工艺。 预切割过程确保了单个接触端子的隔离，并提高了封装的可靠性。
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5.发明申请ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权先进的四边平面非引线封装结构及其制造方法公开(公告)号：US20100044843A1
公开(公告)日：2010-02-25
申请号：US12425635
申请日：2009-04-17
IPC分类号： H01L23/495 , H01L21/60 , H01L21/56
CPC分类号： H01L21/4832 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4911 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The leads include first leads disposed around the die pad, second leads disposed around the first leads and at least an embedded lead portion between the first leads and the second leads. The wires are disposed between the chip, the first leads and the embedded lead portion. The advanced quad flat non-leaded package structures designed with the embedded lead portion can provide better electrical connection.
摘要翻译： 先进的四边形扁平无铅封装结构包括载体，芯片，多根导线和模塑料。 载体包括管芯焊盘和多个引线。 引线包括围绕芯片焊盘设置的第一引线，围绕第一引线设置的第二引线和至少在第一引线和第二引线之间的嵌入引线部分。 电线布置在芯片，第一引线和嵌入引线部分之间。 采用嵌入式引线部分设计的先进的四边形扁平非引线封装结构可以提供更好的电气连接。
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公开(公告)号：US08106492B2
公开(公告)日：2012-01-31
申请号：US12550645
申请日：2009-08-31
IPC分类号： H01L23/495 , H01L23/48
CPC分类号： H01L21/4832 , H01L21/565 , H01L23/3107 , H01L23/49582 , H01L24/28 , H01L24/48 , H01L24/92 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/484 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： The advanced quad flat non-leaded package structure includes a carrier having a die pad and a plurality of leads, at least a chip, a plurality of wires, and a molding compound. The rough surface of the carrier enhances the adhesion between the carrier and the surrounding molding compound.
摘要翻译： 先进的四边形扁平非铅封装结构包括具有管芯焊盘和多个引线，至少芯片，多根电线和模塑料的载体。 载体的粗糙表面增强了载体和周围模塑料之间的粘合性。
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7.发明申请ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开先进的四边平面非引线封装结构及其制造方法公开(公告)号：US20100044850A1
公开(公告)日：2010-02-25
申请号：US12405043
申请日：2009-03-16
CPC分类号： H01L21/4832 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4911 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： An advanced quad flat non-leaded package structure includes a carrier, a chip and a molding compound. The carrier includes a die pad and a plurality of leads. The die pad has a central portion, a peripheral portion disposed around the central portion and a plurality of connecting portions connecting the central portion and the peripheral portion. The central portion, the peripheral portion, and the connecting portions define at least two hollow regions. The leads are disposed around the die pad. The chip is located within the central portion of the die pad and electrically connected to the leads via a plurality of wires. The molding compound encapsulates the chip, the wires, inner leads and a portion of the carrier.
摘要翻译： 先进的四边形扁平非铅封装结构包括载体，芯片和模塑料。 载体包括管芯焊盘和多个引线。 芯片焊盘具有中心部分，围绕中心部分设置的周边部分和连接中心部分和周边部分的多个连接部分。 中心部分，周边部分和连接部分限定至少两个中空区域。 引线设置在管芯焊盘周围。 芯片位于芯片焊盘的中心部分内，并通过多条电线与引线电连接。 模塑料封装芯片，导线，内引线和载体的一部分。
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8.发明申请ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开先进的四边平面非引线封装结构及其制造方法公开(公告)号：US20120119342A1
公开(公告)日：2012-05-17
申请号：US12944695
申请日：2010-11-11
申请人： Pao-Huei Chang Chien , Ping-Cheng Hu , Po-Shing Chiang , Wei-Lun Cheng , Hsueh-Te Wang , Hsiao-Chuan Chang , Tsung-Yueh Tsai , Yi-Shao Lai , Ping-Feng Yang
发明人： Pao-Huei Chang Chien , Ping-Cheng Hu , Po-Shing Chiang , Wei-Lun Cheng , Hsueh-Te Wang , Hsiao-Chuan Chang , Tsung-Yueh Tsai , Yi-Shao Lai , Ping-Feng Yang
IPC分类号： H01L23/495 , H01L21/58 , H01L21/56
CPC分类号： H01L21/4832 , H01L21/561 , H01L23/3107 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4911 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads are designed to possess incurved sidewalls for enhancing the adhesion between the inner leads and the surrounding molding compound.
摘要翻译： 先进的四边形扁平无铅封装结构包括载体，芯片，多根导线和模塑料。 载体包括管芯焊盘和多个引线。 引线的内引线被设计成具有弯曲的侧壁，用于增强内引线和周围模塑料之间的粘附。
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9.发明申请ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开先进的四通平面包装结构及其制造方法公开(公告)号：US20100258921A1
公开(公告)日：2010-10-14
申请号：US12550655
申请日：2009-08-31
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L21/4832 , H01L21/565 , H01L23/3107 , H01L23/49582 , H01L24/28 , H01L24/48 , H01L24/92 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/48257 , H01L2224/484 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads electively have a plurality of locking grooves for enhancing the adhesion between the inner leads and the surrounding molding compound.
摘要翻译： 先进的四边形扁平无铅封装结构包括载体，芯片，多根导线和模塑料。 载体包括管芯焊盘和多个引线。 引线的内引线选择性地具有多个锁定槽，用于增强内引线和周围模塑料之间的粘附。
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