摘要:
An interconnect structure including a bottom layer over a substrate, where the bottom layer includes at least one bottom layer line and at least one bottom layer via. The interconnect structure further includes a transition layer over the bottom layer, where the transition layer includes at least one transition layer line and at least one transition layer via. The interconnect structure further includes a top layer over the transition layer, where the top layer includes at least one top layer line and at least one top layer via. The at least one transition layer via has a cross sectional area at least 30% less than a cross sectional area of the at least one top layer via.
摘要:
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece and a plurality of first conductive lines disposed over the workpiece in a metallization layer. A plurality of second conductive lines is disposed over the workpiece in the metallization layer. The plurality of second conductive lines comprises a greater vertical height in a cross-sectional view of the workpiece than a vertical height of the plurality of first conductive lines.
摘要:
A microfluidic device has a body, multiple channels, multiple reservoirs and multiple capillary valves. The reservoirs are formed on the body. Each channel is formed on the body and connects to a corresponding reservoir. The channels include a main channel and at least one branch channel. The main channel is formed on the top of the body and extends in a direction from the center to a circumference of the body. Each capillary valve is mounted on a corresponding channel and at a distance substantially close to the center of the body so differences between the burst frequencies of the capillary valves are increased. The microfluidic device has an excellent flow control on sequentially releasing fluid through distinct burst frequencies of microcapillary valves.
摘要:
A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.
摘要:
A method of designing an integrated circuit includes providing an integrated circuit design including a power network. A voltage drop mitigation system is provided, which includes a power strap enhancer configured to automatically find a source node and a terminal node in the power network. A redundant strap for the power network using the voltage drop mitigation system is added, wherein the redundant strap interconnects the source node and the terminal node. After the step of adding the redundant strap, dummy patterns may be added.
摘要:
A method of forming an integrated circuit includes providing a first design of the integrated circuit; analyzing the first design to identify a first flip-flop having setup/hold violations and a second flip-flop not having setup/hold violations; and replacing the first flip-flop with a third flip-flop having a substantially same cell delay as the first flip-flop to form a second design of the integrated circuit. The first flip-flop and the third flip-flop have different setup and hold windows.
摘要:
In the present invention a method is described to produce a whole chip timing verification that includes the effects of voltage variation on delay. This is done by creating a netlist, defining cell input and output (I/O) delay paths, and calculating the difference timing caused by differences in power supply voltage. The incremental I/O path delay is calculated by adding delay changes caused by all power pins. Whole chip timings are generated without consideration to voltage drops and then modified using the incremental path delay. The modified whole chip timing data file is used with traditional timing verification tools to perform a whole chip cell level timing verification.
摘要:
A utility includes a design-for-manufacturing (DFM) checker configured to check layout patterns of an integrated circuit, and a layout change instruction generator configured to generate a layout change instruction based on a result generated by the DFM checker. The DFM checker and the layout change instruction generator are embodied on a non-transitory storage media. The layout change instruction specifies an identifier of a layout pattern among the layout patterns, and a respective layout change to be performed on the layout pattern.
摘要:
A received layout identifies a plurality of circuit components to be included in an integrated circuit (IC) layer for double patterning the layer using two photomasks, the layout including a plurality of first patterns to be included in the first photomask and at least one second pattern to be included in the second photomask. A selected one of the first patterns has first and second endpoints, to be replaced by a replacement pattern connecting the first endpoint to a third endpoint. At least one respective keep-out region is provided adjacent to each respective remaining first pattern except for the selected first pattern. Data are generated representing the replacement pattern, such that no part of the replacement pattern is formed in any of the keep-out regions. Data representing the remaining first patterns and the replacement pattern are output.
摘要:
Methods are disclosed of modifying an integrated circuit (IC) design that utilizes multiple patterning technology (MPT). The methods include configuring a first layout of an integrated circuit, having at least one layer with features to be formed utilizing fabrication by at least two masks. The at least one layer includes a plurality of active cells and a plurality of spare cells. A second layout is configured to re-route the spare cells and active cells, wherein the re-routing utilizes at least a portion of the plurality of spare cells. Fewer than all of the at least two masks are replaced to configure the second layout.