Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer
    2.
    发明授权
    Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer 失效
    用于以平面方式连接两个晶片的装置和方法,用于研磨和切割产品晶片

    公开(公告)号:US06972069B2

    公开(公告)日:2005-12-06

    申请号:US10403877

    申请日:2003-03-31

    摘要: A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.

    摘要翻译: 以平面方式连接两个晶片以用于研磨和切割产品晶片的装置具有真空室,用于接收载体晶片的卡盘,用于加热卡盘的加热装置和具有真空室盖的真空室盖, 保持装置,其上可以布置悬浮在载体晶片上方的产品晶片。 在真空室抽真空之后,将产品晶片的活性表面滴落到载体晶片上的双面粘合膜上,并在空气进入期间通过上升的压力被压入到位。 结果是将晶片连接在一起。