MEMS stiction testing apparatus and method
    1.
    发明授权
    MEMS stiction testing apparatus and method 有权
    MEMS静电测试仪器及方法

    公开(公告)号:US08215151B2

    公开(公告)日:2012-07-10

    申请号:US12490573

    申请日:2009-06-24

    IPC分类号: G01P21/00

    CPC分类号: B81C99/0045

    摘要: A MEMS stiction testing method applies a first electrical signal to a MEMS device having two opposing surfaces to cause the two opposing surfaces to make physical contact. The two opposing surfaces produce a second electrical signal when in physical contact. The method then substantially mitigates the first electrical signal after detecting that the second electrical signal has reached a prescribed maximum value.

    摘要翻译: MEMS静态测试方法将第一电信号应用于具有两个相对表面的MEMS器件,以使两个相对表面进行物理接触。 当物理接触时,两个相对表面产生第二电信号。 然后,该方法在检测到第二电信号已经达到规定的最大值之后基本上减轻第一电信号。

    MEMS Stiction Testing Apparatus and Method
    2.
    发明申请
    MEMS Stiction Testing Apparatus and Method 有权
    MEMS静力测试仪器及方法

    公开(公告)号:US20090320557A1

    公开(公告)日:2009-12-31

    申请号:US12490573

    申请日:2009-06-24

    IPC分类号: G01N19/02

    CPC分类号: B81C99/0045

    摘要: A MEMS stiction testing method applies a first electrical signal to a MEMS device having two opposing surfaces to cause the two opposing surfaces to make physical contact. The two opposing surfaces produce a second electrical signal when in physical contact. The method then substantially mitigates the first electrical signal after detecting that the second electrical signal has reached a prescribed maximum value.

    摘要翻译: MEMS静态测试方法将第一电信号应用于具有两个相对表面的MEMS器件,以使两个相对表面进行物理接触。 当物理接触时,两个相对表面产生第二电信号。 然后,该方法在检测到第二电信号已经达到规定的最大值之后基本上减轻第一电信号。

    MEMS device and interposer and method for integrating MEMS device and interposer
    3.
    发明申请
    MEMS device and interposer and method for integrating MEMS device and interposer 有权
    用于集成MEMS器件和插入器的MEMS器件和插入器和方法

    公开(公告)号:US20050037534A1

    公开(公告)日:2005-02-17

    申请号:US10889868

    申请日:2004-07-13

    申请人: William Sawyer

    发明人: William Sawyer

    IPC分类号: H01L21/00

    CPC分类号: B81B7/0048 B81B2203/0307

    摘要: A method for producing Microelectromechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer includes providing an SOI wafer, performing a mesa etch to at least partially define the MEMS device, bonding the SOI wafer to an interposer by direct boding, removing the handle layer of the SOI wafer, removing the oxide layer of the SOI wafer, and further etching the device layer of the SOI wafer to define the MEMS device. A structure manufactured according to the above described processes includes an interposer comprising an SOI wafer and a MEMS device mounted on the interposer. The MEMS device comprises posts extending from a silicon plate. The MEMS device is directly mounted to the interposer by bonding the posts of the MEMS device to the device layer of the interposer.

    摘要翻译: 使用绝缘体上硅(SOI)晶片制造微机电系统(MEMS)和相关器件的方法包括提供SOI晶片,执行台面蚀刻以至少部分限定MEMS器件,通过直接将SOI晶片连接到插入器 去除SOI晶片的手柄层,去除SOI晶片的氧化物层,并进一步蚀刻SOI晶片的器件层以限定MEMS器件。 根据上述工艺制造的结构包括内插器,其包括安装在插入件上的SOI晶片和MEMS器件。 MEMS器件包括从硅板延伸的柱。 MEMS器件通过将MEMS器件的柱结合到插入器的器件层而直接安装到插入器。

    Method for microfabricating structures using silicon-on-insulator material
    6.
    发明申请
    Method for microfabricating structures using silicon-on-insulator material 有权
    使用绝缘体上硅材料微结构的方法

    公开(公告)号:US20060014358A1

    公开(公告)日:2006-01-19

    申请号:US11231103

    申请日:2005-09-20

    IPC分类号: H01L21/76

    摘要: The invention provides a general fabrication method for producing MicroElectroMechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer. The method includes providing an SOI wafer that has (i) a handle layer, (ii) a dielectric layer, and (iii) a device layer, wherein a mesa etch has been made on the device layer of the SOI wafer, providing a substrate, wherein a pattern has been etched onto the substrate, bonding the SOI wafer and the substrate together, removing the handle layer of the SOI wafer, removing the dielectric layer of the SOI wafer, then performing a structural etch on the device layer of the SOI wafer to define the device.

    摘要翻译: 本发明提供了使用绝缘体上硅(SOI)晶片生产微电子机械系统(MEMS)和相关器件的一般制造方法。 该方法包括提供SOI晶片,其具有(i)手柄层,(ii)电介质层和(iii)器件层,其中在SOI晶片的器件层上进行台面蚀刻,提供衬底 其中图案已被蚀刻到衬底上,将SOI晶片和衬底接合在一起,去除SOI晶片的手柄层,去除SOI晶片的电介质层,然后对SOI的器件层进行结构蚀刻 晶圆来定义设备。

    Apparatus for beverage formation with automated water delivery to heating tank
    7.
    发明授权
    Apparatus for beverage formation with automated water delivery to heating tank 有权
    用于饮料形成的装置,其具有自动送水到加热罐

    公开(公告)号:US08495949B2

    公开(公告)日:2013-07-30

    申请号:US12704831

    申请日:2010-02-12

    IPC分类号: A23F5/26

    摘要: A apparatus for forming a beverage using a beverage formation device. Opening of a brew chamber may automatically enable the provision of beverage precursor liquid from a reservoir to a heating tank that is used (heated or not) to form a beverage. For example, opening of the brew chamber may cause a valve to be opened or otherwise permit flow of beverage precursor liquid from the reservoir to the heating tank. The valve may open simultaneously and automatically with a brew chamber lid, and may close when the brew chamber lid is closed.

    摘要翻译: 一种使用饮料形成装置形成饮料的装置。 冲泡室的打开可以自动地将饮料前体液体从贮存器提供到加热罐(加热或不加热)以形成饮料。 例如,冲泡室的打开可能导致阀打开或者允许将饮料前体液体从储存器流动到加热箱。 阀门可以同时自动打开一个冲泡室盖,当冲泡室盖关闭时可能关闭。

    METHOD AND APPARATUS FOR BEVERAGE FORMATION WITH AUTOMATED WATER DELIVERY TO HEATING TANK
    8.
    发明申请
    METHOD AND APPARATUS FOR BEVERAGE FORMATION WITH AUTOMATED WATER DELIVERY TO HEATING TANK 有权
    用于自动输送到加热罐的饮料形成方法和装置

    公开(公告)号:US20110200726A1

    公开(公告)日:2011-08-18

    申请号:US12704831

    申请日:2010-02-12

    IPC分类号: A47J31/44 A47J31/00 A23F5/26

    摘要: A method and apparatus for forming a beverage using a beverage formation device. Opening of a brew chamber may automatically enable the provision of beverage precursor liquid from a reservoir to a heating tank that is used (heated or not) to form a beverage. For example, opening of the brew chamber may cause a valve to be opened or otherwise permit flow of beverage precursor liquid from the reservoir to the heating tank. The valve may open simultaneously and automatically with a brew chamber lid, and may close when the brew chamber lid is closed.

    摘要翻译: 一种使用饮料形成装置形成饮料的方法和装置。 冲泡室的打开可以自动地将饮料前体液体从贮存器提供到加热罐(加热或不加热)以形成饮料。 例如,冲泡室的打开可能导致阀打开或者允许将饮料前体液体从储存器流动到加热箱。 阀门可以同时自动打开一个冲泡室盖,当冲泡室盖关闭时可能关闭。

    Method, System, and Computer Program Product for Managing Business Customer Contacts
    9.
    发明申请
    Method, System, and Computer Program Product for Managing Business Customer Contacts 审中-公开
    方法,系统和计算机程序产品,用于管理业务客户联系人

    公开(公告)号:US20080208735A1

    公开(公告)日:2008-08-28

    申请号:US11677906

    申请日:2007-02-22

    IPC分类号: G06Q40/00

    摘要: In an enterprise where a database maintains multiple accounts for business customers, a method, system, and computer program product correctly links accounts which are associated with a common business. Business identification information from one or more external data sources is obtained and the format of the business identification data is standardized. Data records of business accounts are compared according to a plurality of rules for matching one business account to another. When two business accounts are found to match according to the business matching rules, a common identifier is applied to both business accounts to flag the two accounts as being associated with the same business entity. One or more hierarchy rules are applied to accounts associated with a common business, to establish a hierarchy among the accounts for purposes of marketing and other business communications.

    摘要翻译: 在数据库为业务客户维护多个帐户的企业中,方法,系统和计算机程序产品正确链接与常见业务相关联的帐户。 获得来自一个或多个外部数据源的业务识别信息,并且业务标识数据的格式被标准化。 根据用于将一个业务账户与另一个业务账户相匹配的多个规则来比较业务账户的数据记录。 当发现两个企业帐户根据业务匹配规则匹配时,通用标识符应用于两个业务帐户,以将两个帐户标记为与同一个业务实体相关联。 一个或多个层次结构规则应用于与公共业务相关联的帐户,以便为营销和其他业务通信的目的而在帐户之间建立层次结构。

    Hard intermetallic bonding of wafers for MEMS applications
    10.
    发明申请
    Hard intermetallic bonding of wafers for MEMS applications 审中-公开
    用于MEMS应用的晶片的硬金属间键合

    公开(公告)号:US20070099410A1

    公开(公告)日:2007-05-03

    申请号:US11262863

    申请日:2005-10-31

    IPC分类号: H01L21/44 H01L21/4763

    摘要: A method of bonding two substrates in MEMS applications includes depositing a first metal in a bonding area on a first substrate, depositing a second metal, which is different from the first metal, in a bonding area on a second substrate, place the first substrate and the second substrate together such that the deposited first metal on the first substrate is aligned and in contact with the deposited second metal on the second substrate, and annealing the first metal and second metal to form an intermetallic bond between the first substrate and the second substrate.

    摘要翻译: 在MEMS应用中结合两个基板的方法包括在第一基板上的接合区域中沉积第一金属,在第二基板上的接合区域中沉积与第一金属不同的第二金属,将第一基板和 所述第二衬底一起使得所述第一衬底上沉积的第一金属对准并且与所述第二衬底上沉积的第二金属接触,并且对所述第一金属和第二金属退火以在所述第一衬底和所述第二衬底之间形成金属间键 。