Abstract:
Disclosed herein are a common mode filter and a fabrication method thereof. The common mode filter includes: a first magnetic substrate; a laminate including insulating sheets with coil pattern electrodes printed thereon, having holes therein, and provided on the first magnetic substrate; a magnetic core inserted into the hole; and a second magnetic substrate integrally formed with the magnetic core and provided on the laminate.
Abstract:
The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.
Abstract:
Disclosed herein is an ejecting apparatus including: an upper bezel which includes an inlet through which ejectable fluid flows in from an external source, a channel which fluidly communicates with the inlet and through which the ejectable fluid flows, and an upper mounting portion which fluidly communicates with the channel and is opened downwardly; a lower bezel which includes a lower mounting portion which is opened upwardly to correspond to the upper mounting portion, and a nozzle slit which fluidly communicates with the lower mounting portion to eject the ejectable fluid to an outside, the lower bezel being fastened to the upper bezel, and a nozzle chip which is interposed between the upper mounting portion and the lower mounting portion to receive the ejectable fluid from the channel and discharge the ejectable fluid into the nozzle slit by being driven by an actuator.
Abstract:
There is provided an inkjet print head including an ink head and a chipping prevention portion. The ink head includes a nozzle for ejecting ink to the outside by a driving force of a piezoelectric actuator mounted on a surface of the ink head. The chipping prevention portion includes a cutting portion disposed at a side of the ink head and being cut so as to have a height lower than that of the nozzle.
Abstract:
There is provided a multi inkjet head package. The multi inkjet head package may include: a plurality of inkjet head assemblies each having a head plate in which an inkjet head discharging ink is housed; a rack in which the head plate is housed so as to expose the inkjet head; and a preliminary fixation portion that is installed on the rack and allows the head plate to be preliminarily fixed to the rack.
Abstract:
An inkjet head according to an aspect of the invention may include: a flow path plate having a plurality of ink chambers therein; a nozzle plate having a plurality of nozzles connected to the ink chambers in order to eject ink in the ink chambers to the outside; and air traps provided inside the flow path plate and the nozzle plate to prevent crosstalk in which vibrations for driving the ink chambers affect another adjacent ink chamber.
Abstract:
A method of fabricating an inkjet printer head, the method including: forming a nozzle part and a restrictor in a lower board and forming an ink chamber and an ink inlet in an upper board; joining the lower board onto an upper portion of the lower board; and joining a piezoelectric element onto a membrane of the upper board, wherein the membrane is formed, after a portion of the upper board is removed to form the ink chamber, by the remaining portion.
Abstract:
Disclosed is a method of manufacturing an inkjet head discharging ink. The method in accordance with an embodiment of the present invention can include: heating the inkjet head to a temperature over a melting point of a filler; filling the inkjet head with the filler such that a gap inside the inkjet head is filled with the filler; and discharging the filler out of the inkjet head such that the filler in the gap of the inkjet head remains.
Abstract:
A method of forming a circuit pattern is disclosed. The method of forming a circuit pattern may include providing a substrate that has a porous layer formed on one side, ejecting a thermosetting metal ink using an inkjet head into the porous layer in correspondence to a circuit pattern, and applying heat to the ink and the porous layer to cure the ink and remove the porous layer. With this method, a fine-line circuit pattern can be implemented, and a desired thickness of the circuit pattern can be obtained, by using a porous layer in printing and by applying heat to cure the ink and remove the coating layer.
Abstract:
A nozzle plate, inkjet head a manufacturing method of the same are disclosed. By using a method of manufacturing a nozzle plate which includes: forming a nozzle by selectively etching one side of a plate substrate, forming a straight portion connecting with the nozzle by selectively etching the other side of the plate substrate, and forming a hydrophobic layer on the one side of the plate substrate, where a window is formed in the hydrophobic layer that opens the nozzle by a circumference greater than a circumference of an end of the nozzle, the meniscus of ink can be formed to a greater size around the nozzle exit, thereby preventing degradations in ink ejection performance due to the vaporization of the solvent, and preventing blockage in the nozzles due to the clogging of particles.