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    Integrated compound nano probe card and method of making same
    1.
    发明授权
    Integrated compound nano probe card and method of making same 有权
    综合复合纳米探针卡及其制作方法

    公开(公告)号：US07671612B2

    公开(公告)日：2010-03-02

    申请号：US12071312

    申请日：2008-02-20

    Applicant: Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    Inventor： Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    IPC: G01R31/02

    CPC classification number: G01R1/06755 ,  B82Y10/00 ,  B82Y30/00 ,  G01R1/07314 ,  G01R3/00 ,  H01L2924/00013 ,  Y10S977/742 ,  H01L2224/29099

    Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

    Abstract translation: 公开了一种集成化合物纳米探针卡，其包括具有前侧和背侧的基底层和布置在基底层中的复合探针。 每个复合探针都具有一对排列的平行的纳米管和纳米棒，以及粘合到对齐的平行纳米管/纳米棒束上并且填充在纳米管/纳米棒中的间隙中的粘合材料。 每个复合探针具有暴露在基底层的背面上的基端和在基底层的前侧间隔开的远端。

    BLADE TYPE MICRO PROBE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    BLADE TYPE MICRO PROBE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    刀片式微型探针及其制造方法

    公开(公告)号：US20140091822A1

    公开(公告)日：2014-04-03

    申请号：US13629980

    申请日：2012-09-28

    Applicant: Horng-Jee Wang ,  Ya-Ru Huang

    Inventor： Horng-Jee Wang ,  Ya-Ru Huang

    IPC: G01R1/067 ,  G01R3/00

    CPC classification number: G01R1/06733 ,  G01R1/06761 ,  G01R3/00

    Abstract: A blade type micro probe and a method of manufacturing the same are disclosed. The method includes forming a plating seed layer on a substrate, a first blade structure on the plating seed layer and a second blade structure on the first blade structure, wherein the first blade structure includes a first second patterned photo resist layer and a metal layer filling up the voids in the first second patterned photo resist layer and the second blade structure includes a second patterned photo resist layer and an another metal layer filling up the voids in the second patterned photo resist layer, then removing the first and second patterned photo resist layers, and finally removing the plating seed layer and the substrate, thereby forming the blade type micro probe. The first patterned photo resist layer is different from the second patterned photo resist layer in shape.

    Abstract translation: 公开了一种叶片式微型探针及其制造方法。 该方法包括在基板上形成电镀种子层，在电镀种子层上形成第一叶片结构，在第一叶片结构上形成第二叶片结构，其中第一叶片结构包括第一第二图案化光致抗蚀剂层和金属层填充物 在第一第二图案化光致抗蚀剂层中的空隙，第二叶片结构包括第二图案化光致抗蚀剂层和填充第二图案化光致抗蚀剂层中的空隙的另一金属层，然后除去第一和第二图案化光致抗蚀剂层 ，最后除去电镀种子层和基板，从而形成刀片型微型探针。 第一图案化抗蚀剂层的形状与第二图案化光致抗蚀剂层不同。

    Integrated compound nano probe card and method of making same
    4.
    发明申请
    Integrated compound nano probe card and method of making same 有权
    综合复合纳米探针卡及其制作方法

    公开(公告)号：US20080160195A1

    公开(公告)日：2008-07-03

    申请号：US12071310

    申请日：2008-02-20

    Applicant: Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    Inventor： Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    IPC: B05D5/00

    CPC classification number: G01R1/06755 ,  B82Y10/00 ,  B82Y30/00 ,  G01R1/07314 ,  G01R3/00 ,  H01L2924/00013 ,  Y10S977/742 ,  H01L2224/29099

    Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

    Abstract translation: 公开了一种集成化合物纳米探针卡，其包括具有前侧和背侧的基底层和布置在基底层中的复合探针。 每个复合探针都具有一对排列的平行的纳米管和纳米棒，以及粘合到对齐的平行纳米管/纳米棒束上并且填充在纳米管/纳米棒中的间隙中的粘合材料。 每个复合探针具有暴露在基底层的背面上的基端和在基底层的前侧间隔开的远端。

    Optical fiber alignment element using integrated micro ball lens
    5.
    发明授权
    Optical fiber alignment element using integrated micro ball lens 失效

    公开(公告)号：US06584250B2

    公开(公告)日：2003-06-24

    申请号：US09785289

    申请日：2001-02-20

    Applicant: Yuh-Sheng Lin ,  Cheng-Chun Huang ,  Ming-Yueh Liu ,  Jauh-Jung Yang ,  Chuan-Kang Mu ,  Ya-Ru Huang

    Inventor： Yuh-Sheng Lin ,  Cheng-Chun Huang ,  Ming-Yueh Liu ,  Jauh-Jung Yang ,  Chuan-Kang Mu ,  Ya-Ru Huang

    IPC: G02B626

    CPC classification number: G02B6/32 ,  G02B6/26 ,  G02B6/30

    Abstract: An optical fiber alignment element using integrated micro ball lens includes a substrate and a plurality of V-shaped grooves or waveguides formed on the substrate by lithography and etching. The substrate surface is coated with a first polymer layer and a high transparency second polymer layer, then is processed through a lithography process and heating process to form at least a base pad and a spherical micro ball lens between the V-shaped grooves or waveguides. Then dispose optical fibers in the V-shaped grooves. And encase an upper cap over the micro ball lens, grooves, and optical fibers or waveguides. Through suitable configuration and positioning of the micro ball lens, grooves or waveguides, the micro ball lens may be aligned precisely between two sides of the optical fibers or waveguides. The process is simpler, more accurate, and may produce the optical fiber alignment element in an integrated and batch fashion.

    Method for reducing stress in nickel-based alloy plating
    7.
    发明授权
    Method for reducing stress in nickel-based alloy plating 失效
    减少镍基合金电镀应力的方法

    公开(公告)号：US06699379B1

    公开(公告)日：2004-03-02

    申请号：US10302844

    申请日：2002-11-25

    Applicant: Shih-Tsung Ke ,  Jen-Chih Li ,  Ming-Der Ger ,  Le-Min Wang ,  Yeh Sung ,  Jauh-Jung Yang ,  Ya-Ru Huang

    Inventor： Shih-Tsung Ke ,  Jen-Chih Li ,  Ming-Der Ger ,  Le-Min Wang ,  Yeh Sung ,  Jauh-Jung Yang ,  Ya-Ru Huang

    IPC: C25D1500

    CPC classification number: C25D5/50 ,  C25D3/562 ,  C25D5/18 ,  C25D15/02

    Abstract: An improved plating method in combination with a low-temperature thermal treatment is disclosed. The method for reducing the stress in the nickel-based alloy plating comprises the steps of: (a) adding ceramic particles into a plating bath containing soluble nickel salts; and (b) placing a substrate in the plating bath and thereafter carrying out a pulse-current electroplating in the plating bath. The method of this invention can prevent substrate softening or deformation problems. The use of a post low-temperature thermal treatment can slightly increase the hardness of the coating products. The use of the low-temperature thermal treatment can reduce the stress of the coatings since the hydrogen embrittlement resulting from exist of hydrogen in the coatings is eliminated.

    Abstract translation: 公开了一种结合低温热处理的改进的电镀方法。 减少镍基合金镀层中的应力的方法包括以下步骤：（a）将陶瓷颗粒加入含有可溶性镍盐的镀浴中; 和（b）将基板放置在电镀液中，然后在电镀液中进行脉冲电流电镀。 本发明的方法可以防止基板软化或变形问题。 使用后期低温热处理可以稍微提高涂层产品的硬度。 使用低温热处理可以降低涂层的应力，因为消除了由涂层中的氢存在引起的氢脆化。

    Integrated compound nano probe card
    8.
    发明授权
    Integrated compound nano probe card 有权
    综合复合纳米探针卡

    公开(公告)号：US07652492B2

    公开(公告)日：2010-01-26

    申请号：US12071311

    申请日：2008-02-20

    Applicant: Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    Inventor： Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    IPC: G01R31/02

    CPC classification number: G01R1/06755 ,  B82Y10/00 ,  B82Y30/00 ,  G01R1/07314 ,  G01R3/00 ,  H01L2924/00013 ,  Y10S977/742 ,  H01L2224/29099

    Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

    Abstract translation: 公开了一种集成化合物纳米探针卡，其包括具有前侧和背侧的基底层和布置在基底层中的复合探针。 每个复合探针都具有一对排列的平行的纳米管和纳米棒，以及粘合到对齐的平行纳米管/纳米棒束上并且填充在纳米管/纳米棒中的间隙中的粘合材料。 每个复合探针具有暴露在基底层的背面上的基端和在基底层的前侧间隔开的远端。

    Integrated compound nano probe card and method of making same
    9.
    发明授权
    Integrated compound nano probe card and method of making same 有权
    综合复合纳米探针卡及其制作方法

    公开(公告)号：US07585548B2

    公开(公告)日：2009-09-08

    申请号：US12071310

    申请日：2008-02-20

    Applicant: Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    Inventor： Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    IPC: B05D5/00

    CPC classification number: G01R1/06755 ,  B82Y10/00 ,  B82Y30/00 ,  G01R1/07314 ,  G01R3/00 ,  H01L2924/00013 ,  Y10S977/742 ,  H01L2224/29099

    Abstract: An integrated compound nano probe card is disclosed to include a substrate layer having a front side and a back side, and compound probe pins arranged in the substrate layer. Each compound probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each compound probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

    Abstract translation: 公开了一种集成化合物纳米探针卡，其包括具有前侧和背侧的基底层和布置在基底层中的复合探针。 每个复合探针都具有一对排列的平行的纳米管和纳米棒，以及粘合到对齐的平行纳米管/纳米棒束上并且填充在纳米管/纳米棒中的间隙中的粘合材料。 每个复合探针具有暴露在基底层的背面上的基端和在基底层的前侧间隔开的远端。

    Integrated complex nano probe card and method of making same
    10.
    发明授权
    Integrated complex nano probe card and method of making same 有权
    集成复合纳米探针卡及其制作方法

    公开(公告)号：US07400159B2

    公开(公告)日：2008-07-15

    申请号：US10393262

    申请日：2003-03-21

    Applicant: Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    Inventor： Horng-Jee Wang ,  Ya-Ru Huang ,  Min-Chieh Chou

    IPC: G01R31/02

    CPC classification number: G01R1/06755 ,  B82Y10/00 ,  B82Y30/00 ,  G01R1/07314 ,  G01R3/00 ,  H01L2924/00013 ,  Y10S977/742 ,  H01L2224/29099

    Abstract: An integrated complex nano probe card is disclosed to include a substrate layer having a front side and a back side, and complex probe pins arranged in the substrate layer. Each complex probe pin has a bundle of aligned parallel nanotubes/nanorods and a bonding material bonded to the bundle of aligned parallel nanotubes/nanorods and filled in gaps in the nanotubes/nanorods. Each complex probe pin has a base end exposed on the back side of the substrate layer and a distal end spaced above the front side of the substrate layer.

    Abstract translation: 公开了一种集成的复合纳米探针卡，其包括具有前侧和后侧的基底层，以及布置在基底层中的复杂探针。 每个复合探针都具有一束对准的平行纳米管/纳米棒，以及粘合到对齐的平行纳米管/纳米棒的束并且填充在纳米管/纳米棒中的间隙中的粘合材料。 每个复合探针具有暴露在基底层的背面上的基端和在基底层的前侧间隔开的远端。

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